Sockets for electronic components and methods of connecting to electronic components
First Claim
1. Socket for releasably connecting a first electronic component to a second electronic component, comprising:
- a plurality of resilient contact structures extending upward from a top surface of a support substrate; and
a plurality of contact structures disposed on a bottom surface of the support substrate, selected ones of the contact structures are connected through the support substrate to selected ones of the resilient contact structures;
wherein;
at least a portion of the contact structures are solder balls.
2 Assignments
0 Petitions
Accused Products
Abstract
Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Resilient contact structures extend from a top surface of a support substrate, and solder-ball (or other suitable) contact structures are disposed on a bottom surface of the support substrate. Composite interconnection elements are used as the resilient contact structures disposed atop the support substrate. In any suitable manner, selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate. In an embodiment intended to receive a LGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally normal to the top surface of the support substrate. In an embodiment intended to receive a BGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally parallel to the top surface of the support substrate.
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Citations
92 Claims
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1. Socket for releasably connecting a first electronic component to a second electronic component, comprising:
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a plurality of resilient contact structures extending upward from a top surface of a support substrate; and a plurality of contact structures disposed on a bottom surface of the support substrate, selected ones of the contact structures are connected through the support substrate to selected ones of the resilient contact structures; wherein; at least a portion of the contact structures are solder balls. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. Solder-down socket for releasably connecting an electronic component to a circuit board, comprising:
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a support substrate; a plurality of resilient contact structures extending upward from a top surface of the support substrate; and a plurality of solderable raised contact structures disposed on a bottom surface of the substrate, selected ones of said solderable raised contact structures being electrically connected to selected ones of the resilient contact structures; wherein; the support substrate comprises a plurality of plated through holes extending through the support substrate from the top surface to the bottom surface of the support substrate; each of selected ones of the through holes comprise a top contact area exposed on the top surface of the support substrate and a bottom contact area exposed on the bottom surface of the support substrate; selected ones of the resilient contact structures are mounted to selected ones of the top contact areas; selected ones of the solderable raised contact structures are mounted to selected ones of the bottom contact areas; and interconnections between selected ones of the resilient contact structures and selected ones of the solderable raised contact structures comprise selected ones of the plated through holes. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
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39. Socket for releasably connecting an electronic component to a circuit board, comprising:
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a plurality of resilient contact structures extending upward from a top surface of a support substrate; a plurality of contact structures disposed on a bottom surface of the support substrate and connected through the support substrate to selected ones of the resilient contact structures; wherein; the support substrate comprises a plurality of plated through holes extending through the support substrate from the top surface to the bottom surface of the support substrate; each of selected ones of the through holes comprise a top contact area exposed on the top surface of the support substrate and a bottom contact area exposed on the bottom surface of the support substrate; at least a portion of the resilient contact structures are mounted to selected ones of the top contact areas; selected ones of the contact structures are mounted to selected ones of the bottom contact areas; and at least a portion of the connections between the resilient contact structure and the contact structure comprises a portion of the plated through holes. - View Dependent Claims (40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 67, 68, 69, 70, 71, 72)
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66. Solder-down socket for making pressure connections from a plurality of terminals of a first electronic component to a second electronic component, comprising:
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a substrate having a top surface and a bottom surface; a plurality of resilient contact structures extending from the top surface of the substrate, each resilient contact structure having a tip at a free end thereof; and means for effecting pressure connection between selected ones of the tips of at least a portion of the resilient contact structures and selected ones of the terminals of the first electronic component; wherein; the substrate comprises a plurality of plated through holes extending through the substrate from the top surface to the bottom surface of the substrate; each of selected ones of the through holes comprise a top contact area exposed on the top surface of the substrate and a bottom contact area exposed on the bottom surface of the substrate; and selected ones of the resilient contact structures mounted to selected ones of the top contact areas; and further comprising a plurality of contact structures, selected ones of the contact structures mounted on selected ones of the bottom contact areas. - View Dependent Claims (73, 74, 75, 76, 92)
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77. Method of removably connecting an electronic component to a circuit board, said circuit board having a plurality of contact areas on a surface thereof, said electronic component having a plurality of terminals, comprising:
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disposing a support substrate between the electronic component and the circuit board, the support substrate having a top surface and a bottom surface opposite the top surface; mounting a plurality of resilient contact structures to the top surface of the support substrate; mounting a plurality of contact structures to the bottom surface of the support substrate; mounting the support substrate to the circuit board so as to make permanent electrical connections between selected ones of the contact structures and selected ones of the contact areas; urging the electronic component against the resilient contact structure so that a removable connection is made between selected ones of the terminals and selected ones of the resilient contact structures; and within the support substrate, interconnecting selected ones of the resilient contact structures with selected ones of the contact structures; and forming the contact structures as solder balls. - View Dependent Claims (78, 79, 80, 81, 82, 83)
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84. Method of removably connecting an electronic component to a circuit board, said circuit board having a plurality of contact areas on a surface thereof, said electronic component having a plurality of terminals, comprising:
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disposing a support substrate between the electronic component and the circuit board, the support substrate having a top surface and a bottom surface opposite the top surface; mounting a plurality of resilient contact structures to the top surface of the support substrate; mounting a plurality of contact structures to the bottom surface of the support substrate; mounting the support substrate to the circuit board so as to make permanent electrical connections between selected ones of the contact structure& and
selected ones of the contact areas;urging the electronic component against the resilient contact structure so that a removable connection is made between selected ones of the terminal& and
selected ones of the resilient contact structures; andwithin the support substrate, interconnecting the selected ones of the resilient contact structures with selected ones of the contact structures; wherein; the support substrate comprises a plurality of plated through holes extending through the support substrate from the top surface to the bottom surface of the support substrate; each through hole comprises a top contact area exposed on the top surface of the support substrate and a bottom contact area exposed on the bottom surface of the support substrate; selected ones of the resilient contact structures are mounted to selected ones of the top contact areas; selected ones of the contact structures are mounted to selected ones of the bottom contact areas; and at least a portion of the interconnections between the resilient contact structures and the contact structures comprises at least a portion of the plated through holes. - View Dependent Claims (85, 86, 87, 88, 89, 90, 91)
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Specification