Pattern coating of thick film pressure sensitive adhesives

• US 5,773,080 A
• Filed: 04/17/1997
• Issued: 06/30/1998
• Est. Priority Date: 04/17/1997
• Status: Expired due to Term

• Current Assignee: Morgan Adhesives Company (Amcor Plc)
• Original Assignee: Morgan Adhesives Company (Amcor Plc)
• Inventors: Simmons, George, Schmitz, John L.
• Primary Examiner(s): BELL, JANYCE A
• Application Number:
  US08/843,865
• Time in Patent Office: 439 Days
• Field of Search: 427/286, 427/208.6, 427/385.5, 427/552, 427/558, 427/420, 427/177
• US Class Current: 427/208.6
• CPC Class Codes: B05C 5/0279 independently, e.g. individually, flow controlled
• CPC Class Codes: B05D 5/10 to obtain an adhesive surface

Abstract

The invention encompasses the pattern coating of a thick layer of adhesive on a single substrate. The adhesive strips may be continuous or discontinuous on the single substrate. In one preferred embodiment of the invention, the substrate is a release liner and the adhesive is a hot melt, thereby not requiring the use of an extruder in the application of the adhesive onto the substrate. When it is desired to produce a non-foamed product, the web is chilled on a chilled drum. Elimination of this chilling step, results in the formation of a foamed tape product, due to the evaporation of the moisture which is typically contained within the silicone-coated paper web. The product is a thick (10-100 mils), free (no carrier) film of adhesive made to the desired width (3/8" to approximately 6") of a high cohesive strength adhesive, with good temperature resistance (>196° F.), with low bubble content (appears clear), wound into rolls containing from 100-800 feet or greater in length.

Claims

1. A process for pattern coating a plurality of strips of adhesive onto a release web comprising the steps of:

feeding an adhesive into a feed manifold in a die assembly,

the die assembly comprising;

a die body having at least two exit ports in a front face of the die body; and

at least two die cavity forming means, each of which receive adhesive exiting from at least one die body exit port, each die cavity forming means having at least one opening through which the adhesive can exit the die cavity forming means;

passing a silicone-coated web under the openings of the die cavity forming means in the die assembly and depositing at least two non-contacting adhesive strips thereon;

drying or curing the adhesive wherein the process of curing is selected from the group consisting of electron beam curing, ultraviolet curing and heat curing; and

winding the adhesive coated web.

2. The process of claim 1 wherein the step of passing occurs over a roll which is chilled thereby minimizing the foaming of the adhesive.

3. The process of claim 1 which further comprises the step of passing the silicone-coated web with at least two non-contacting adhesive strips thereon through an accumulator.

4. The process of claim 1 wherein the die cavity forming means comprises:

a die shim having a longitudinal element extending along a length of the die body and at least three downwardly extending fingers;

a die shim attachment; and

a die shim attachment fastening means which secures the die shim and die shim attachment to the die body, and wherein

the die shim attachment and die body form two walls of the die cavity forming

means and the downwardly extending fingers form side walls.

5. The process of claim 4 wherein the at least three downwardly extending fingers are essentially parallel.

6. The process of claim 4 wherein the at least three downwardly extending fingers form a cavity having a width as measured between the sidewalls which is narrower at the bottom opening of the cavity than at the top of the cavity.

7. The process of claim 4 wherein a thickness of the die shim is from about 1 to about 30 mils inclusive and a thickness of the adhesive strips is from about 10 to about 300 mils inclusive.

8. The process of claim 7 wherein a thickness of the die shim is from about 3 to about 15 mils inclusive and a thickness of the adhesive strips is from about 15 to about 200 mils inclusive.

9. The process of claim 8 wherein a thickness of the die shim is from about 4 to about 8 mils inclusive and a thickness of the adhesive strips is from about 25 to about 100 mils inclusive.

10. The process of claim 1 wherein the die cavity forming means comprises:

a chamber which has at least one non-parallel side.

11. The process of claim 1 wherein the die cavity forming means is a die chamber having a length as measured between the front and rear walls which is wider at a top of the chamber than at a bottom opening of the chamber.

12. The process of claim 11 wherein the die cavity forming means further comprises a die chamber having a width as measured between the sidewalls which is narrower at the bottom opening of the chamber than at the top of the chamber.

13. The process of claim 1 wherein a thickness of the adhesive strips is from about 10 to about 300 mils inclusive.

14. The process of claim 13 wherein a thickness of the adhesive strips is from about 15 to about 200 mils inclusive.

15. The process of claim 14 wherein a thickness of the adhesive strips is from about 25 to about 100 mils inclusive.

16. A process for pattern coating a plurality of strips of adhesive onto a release web comprising the steps of.

feeding an adhesive into a die assembly;

moving the adhesive in the die assembly into at least one die chamber having at least two discrete and separated openings disposed therein for egress of the adhesive through the at least two openings;

passing a silicone-coated web under the at least two openings in the at least one die chamber in the die assembly;

depositing at least two non-contacting adhesive strips thereon by contact of the adhesive with the web as the adhesive exits from the discrete openings;

drying or curing the adhesive wherein the process of curing is selected from the group consisting of electron beam curing ultraviolet curing; and

heat curing, and

winding the adhesive coated web.

17. The process of claim 16 wherein the step of passing occurs over a roller which is chilled so as to minimize adhesive foaming.

18. The process of claim 16 wherein the die cavity forming means comprises:

a die shim having a longitude element extending along a length of the body and at least three downwardly extending fingers;

a die shim attachment; and

a die shim attachment fastening means which secures the die shim attachment to the die body, and wherein

the die shim attachment and die body form two walls of the die cavity forming means and the downwardly extending fingers form side walls.

19. The process of claim 18 wherein the at least three downwardly extending fingers are essentially parallel.

20. The process of claim 18 wherein the at least three downwardly extending fingers form a cavity having a width as measured between the sidewalls which is narrower at the bottom opening of the cavity than at the top of the cavity.

21. The process of claim 16 wherein the die cavity forming means comprises:

a chamber which has at least one non-parallel side.

22. The process of claim 16 wherein the die cavity forming means is a die chamber having a length as measured between the front and rear walls which is wider at a top of the chamber than at a bottom opening of the chamber.

23. The process of claim 22 wherein the die cavity forming means further comprises a die chamber having a width as measured between the sidewalls which is narrower at the bottom opening of the chamber than at the top of the chamber.

24. The process of claim 16 wherein a thickness of the adhesive strips is from about 10 to about 300 mils inclusive.

25. The process of claim 24 wherein a thickness of the adhesive strips is from about 15 to about 200 mils inclusive.

26. The process of claim 25 wherein a thickness of the adhesive strips is from about 25 to about 100 mils inclusive.

27. The process of claim 26 wherein a thickness of the die shim is from about 1 to about 30 mils inclusive and a thickness of the adhesive strips is from about 10 to about 300 mils inclusive.

28. The process of claim 27 wherein a thickness of the die shim is from about 3 to about 15 mils inclusive and a thickness of the adhesive strips is from about 15 to about 200 mils inclusive.

29. The process of claim 28 wherein a thickness of the die shim is from about 4 to about 8 mils inclusive and a thickness of the adhesive strips is from about 25 to about 100 mils inclusive.

30. A process for pattern coating a plurality of strips of adhesive onto a release web comprising the steps of:

feeding an adhesive into a die assembly;

moving the adhesive in the die assembly into at least two die chambers, each having at least one opening in each die chamber therein for egress of the adhesive through the opening;

passing a silicone-coated web under the at least one opening in the at least two die chambers in the die assembly;

depositing at least two non-contacting adhesive strips thereon by contact of the adhesive with the web as the adhesive exits from the discrete openings;

drying or curing the adhesive wherein the process of curing is selected from the group consisting of electron beam curing ultraviolet curing and heat curing; and

winding the adhesive coated web.

31. The process of claim 30 wherein the step of passing occurs over a roller which is chilled so as to minimize adhesive foaming.

32. The process of claim 30 wherein the die cavity forming means comprises:

a die shim having a longitudinal element extending along a length of the die body and at least three downwardly extending fingers;

a die shim attachment; and

a die shim attachment fastening means which secures the die shim and die shim attachment to the die body, and wherein

the die shim attachment and die body form two walls of the die cavity forming means and the downwardly extending fingers form side walls.

33. The process of claim 32 wherein the at least three downwardly extending fingers are essentially parallel.

34. The process of claim 33 wherein the at least three downwardly extending fingers form a cavity having a width as measured between the sidewalls which is narrower at the bottom opening of the cavity than at the top of the cavity.

35. The process of claim 30 wherein the die cavity forming means comprises:

a chamber which has at least one non-parallel side.

38. The process of claim 30 wherein a thickness of the adhesive strips is from about 10 to about 300 mils inclusive.

39. The process of claim 38 wherein a thickness of the adhesive strips is from about 15 to about 200 mils inclusive.

40. The process of claim 39 wherein a thickness of the adhesive strips is from about 25 to about 100 mils inclusive.

36. as measured between the front and rear walls which is wider at a top of the chamber than at a bottom opening of the chamber.

37. The process of claim 36 wherein the die cavity forming means further comprises a die chamber having a width as measured between the sidewalls which is narrower at the bottom opening of the chamber than at the top of the chamber.

41. The process of claim 36 wherein a thickness of the die shim is from about 1 to about 30 mils inclusive and a thickness of the adhesive strips is from about 10 to about 300 mils inclusive.

42. The process of claim 41 wherein a thickness of the die shim is from about 3 to about 15 mils inclusive and a thickness of the adhesive strips is from about 15 to about 200 mils inclusive.

43. The process of claim 42 wherein a thickness of the die shim is from about 4 to about 8 mils inclusive and a thickness of the adhesive strips is from about 25 to about 100 mils inclusive.