Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto

• US 5,773,884 A
• Filed: 03/03/1997
• Issued: 06/30/1998
• Est. Priority Date: 06/27/1996
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: DiPietro, Michael, Hammer, Richard Benjamin, Bupp, James Russell, Andros, Frank Edward
• Primary Examiner(s): ARROYO, TERESA M
• Application Number:
  US08/811,070
• Time in Patent Office: 484 Days
• Field of Search: 257/706, 257/707, 257/737, 361/707, 361/749
• US Class Current: 257/707
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/73269 Layer and TAB connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/142 Metallic substrates having insulating layers
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package'"'"'s semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

Claims

1. An electronic package comprising:

a substantially rigid, thermally conductive support member;

a thin, flexible circuitized substrate including a dielectric member having a first layer of circuitry positioned on a first surface thereof, said thin, flexible circuitized substrate including a plurality of conductive through-holes located within said dielectric member and electrically connected to said first layer of circuitry, said thin circuitized substrate being directly bonded to said support member in an electrically insulative manner, including along the portion of said dielectric member having said plurality of conductive through-holes therein;

a semiconductor device bonded to said support member in a thermally conductive manner at a location relative to said first layer of circuitry of said circuitized substrate, said semiconductor device including a surface having a plurality of electrical contact sites thereon for being electrically coupled to said first layer of said circuitry of said circuitized substrate; and

a plurality of solder elements each positioned on selected ones of said conductive through-holes and electrically connected thereto, each of said solder elements including a first portion thereof extending within a respective one of said selected ones of said conductive through-holes and a rounded second portion projecting from said conductive through-hole and adapted for being electrically coupled to an external circuitized substrate.

2. The electronic package of claim 1 wherein said solder elements are comprised of 10:

90 tin;

lead solder.

3. The electronic package of claim 1 further including a protective coating positioned on said thin, flexible circuitized substrate substantially adjacent said conductive through-holes and said plurality of said solder elements.

4. The electronic package of claim 1 wherein said thermally conductive support member comprises a metallic sheet member.

5. The electronic package of claim 1 wherein said metallic sheet member is comprised of copper.

6. The electronic package of claim 1 wherein said thermally conductive support member includes at least one indentation therein, said semiconductor device being bonded to said support member at the location of said indentation.

7. The electronic package of claim 1 wherein selected ones of said electrical contact sites of said semiconductor device are electrically coupled to said first layer of said circuitry of said circuitized substrate by a plurality of conductive wires.

8. The electronic package of claim 1 wherein said first layer of said circuitry of said thin, flexible circuitized substrate includes a plurality of projecting lead members, selected ones of said projecting lead members being electrically coupled to respective ones of said electrical contact sites of said semiconductor device.

9. The electronic package of claim 1 wherein said thermally conductive support member serves as both a heat sinking member for heat generated by said semiconductor device during operation of said electronic package and as a stiffener member for retaining said thin circuitized substrate in a substantially planar orientation.

10. The electronic package of claim 1 further including a second layer of circuitry on said tin, flexible circuitized substrate, said second layer of said circuitry of said thin flexible circuitized substrate facing said thermally conductive support member and electrically coupled to said first layer of circuitry by one or more of said conductive through-holes.

11. The electronic package of claim 1 wherein said thin flexible circuitized substrate is bonded to said thermally conductive support member by an electrically insulative adhesive.

12. The electronic package of claim 1 wherein said semiconductor device is bonded to said support member by a thermally conductive adhesive such that heat from said semiconductor device will readily pass to said thermally conductive support member.

13. The electronic package of claim 1 further including a quantity of encapsulant material substantially covering at least part of said semiconductor device and at least part of said circuitry of said thin flexible circuitized substrate.

14. The electronic package of claim 1 further including a second circuitized substrate, said rounded second portions of said plurality of solder elements being electrically coupled to said second, circuitized substrate.

15. The electronic package of claim 1 wherein said thermally conductive support member includes a base and at least one spacer member, said spacer member spacing said thin flexible circuitized substrate a predetermined distance from said base portion.

16. The electronic package of claim 1 wherein said first portion of each of said solder elements projects beyond said respective conductive through-hole on an opposite side of said through-hole from said projecting rounded second portions of said solder elements.