Solderless electrical interconnection including metallized hook and loop fasteners

• US 5,774,341 A
• Filed: 12/20/1995
• Issued: 06/30/1998
• Est. Priority Date: 12/20/1995
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Urbish, Glenn F., Pennisi, Robert W., Mullen, III, William Boone, Dorinski, Dale W.
• Primary Examiner(s): SPARKS, DONALD ALAN
• Application Number:
  US08/575,652
• Time in Patent Office: 923 Days
• Field of Search: 128/DIG. 15, 174/254, 174/259, 174/260, 174/261, 361/749, 361/760, 361/772-774, 361/776, 361/779, 361/782, 361/783, 361/807, 361/809, 361/811, 403/345, 403/364, 439/66, 439/67, 439/74, 439/77, 439/284, 439/81, 439/290, 439/291, 439/371
• US Class Current: 361/774
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01R 13/33 Contact members made of resilient wire
• CPC Class Codes: H01R 4/26 Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact H01R4/188, H01R4/203, H01R4/5075 take precedence; using shape memory materials H01R4/01
• CPC Class Codes: H01R 4/58 characterised by the form or material of the contacting members H01R4/01 takes precedence
• CPC Class Codes: H05K 1/038 Textiles used as reinforcing materials for organic insulating substrates H05K1/0366
• CPC Class Codes: H05K 2201/09754 Connector integrally incorporated in the PCB or in housing mounted connecter H05K2201/10189
• CPC Class Codes: H05K 2201/0979 Redundant conductors or connections, i.e. more than one current path between two points
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence

Abstract

A solderless electrical interconnection is made using electrically conductive hook fasteners (15) that are embedded in a substrate (12). The upper part (20) of the fastener is exposed on the top side of the substrate, the central part (22) is embedded within the substrate itself, and the lower or hook portion (17) of the fastener protrudes from the bottom side of the substrate. Electrically conductive pathways (30), defined on the top side of the substrate, make contact with the exposed upper part of the hook fastener. The electrically conductive runners on the top side have a continuous signal path through the substrate to the bottom side of the substrate via the electrically conductive hook fastener. The hook fastener (15) is engaged to electrically conductive loop fasteners (60) on a second substrate (70) in order to create a solderless electrical interconnection and mechanical interlocking between the two substrates.

Claims

1. A solderless electrical interconnection having electrically conductive hook fasteners in a first substrate and electrically conductive loop fasteners on a second substrate, comprising:

electrically conductive hook fasteners generally formed in the shape of a `J` and having a head portion, a shank portion, and a hook portion;

a first substrate having the hook fasteners embedded therein, the head portion exposed on a first side of the substrate, the shank portion embedded within the substrate, and the hook portion protruding out of an opposing second side of the substrate;

the head portion of selected electrically conductive hook fasteners electrically connected to a metal circuit pad that is formed on the first side of the substrate to provide an electrical pathway between the metal circuit pad and the hook portion of the selected electrically conductive hook fasteners; and

the hook portion of the selected electrically conductive hook fasteners mating and interlocking to electrically conductive loop fasteners on a second substrate to mechanically connect the first substrate to the second substrate and to provide an electrical connection from the metal circuit pads to the electrically conductive loop fasteners.

2. The solderless electrical interconnection as described in claim 1, further comprising a plurality of electrically non-conductive hook fasteners, each of said electrically non-conductive hook fasteners extending through the substrate from the first side to the second side.

3. The solderless electrical interconnection as described in claim 2, wherein only those hook fasteners that are electrically connected to the metal circuit pads are electrically conductive.

4. The solderless electrical interconnection as described in claim 1, wherein the substrate is a dielectric material.

5. The solderless electrical interconnection as described in claim 4, wherein the substrate is a woven material.

6. The solderless electrical interconnection as described in claim 1, further comprising a dielectric coating over the head portion of those electrically conductive hook fasteners that are not electrically connected to the metal circuit pad.

7. The solderless electrical interconnection as described in claim 1, further comprising a circuit pattern selectively metallized on the first side of the substrate.

8. The solderless electrical interconnection as described in claim 1, wherein the hook fasteners are metal wires.

9. The solderless electrical interconnection as described in claim 1, wherein only hook fasteners that are electrically connected to the metal circuit pad are present.

10. A solderless electrical interconnection providing an electrical pathway between electrically conductive hook fasteners in a substrate and a corresponding electrical contact on a second member, comprising:

electrically conductive hook fasteners generally formed in the shape of a `J` and having a head portion, a shank portion, and a hook portion;

the substrate having the hook fasteners embedded therein, the head portion exposed on a first side of the substrate, the shank portion embedded within the substrate, and the hook portion protruding out of an opposing second side of the substrate;

the head portion of selected electrically conductive hook fasteners electrically connected to a metal circuit pad on the first side of the substrate to provide an electrical pathway between the metal circuit pad and the hook portion of the selected electrically conductive hook fasteners; and

the hook portion of the selected electrically conductive hook fasteners contacting said corresponding electrical contact on said second member to provide an electrical connection from the metal circuit pads to said corresponding electrical contact.

11. The solderless electrical interconnection as described in claim 10, further comprising a plurality of electrically non-conductive hook fasteners, each of said electrically non-conductive hook fasteners extending through the substrate from the first side to the second side.

12. The solderless electrical interconnection as described in claim 11, wherein only those hook fasteners that are electrically connected to the metal circuit pads are electrically conductive.

13. The solderless electrical interconnection as described in claim 10, wherein the substrate is a dielectric material.

14. The solderless electrical interconnection as described in claim 13, wherein the substrate is a woven material.

15. The solderless electrical interconnection as described in claim 10, further comprising a dielectric coating over the head portion of those electrically conductive hook fasteners which are not electrically connected to the metal circuit pad.

16. The solderless electrical interconnection as described in claim 10, further comprising a circuit pattern selectively metallized on the first side of the substrate.

17. The solderless electrical interconnection as described in claim 10, wherein the hook fasteners are metal wires.

18. The solderless electrical interconnection as described in claim 10, wherein only hook fasteners that are electrically connected to the metal circuit pad are present.

19. A solderless electrical interconnection for a leadless chip carrier having electrically conductive hook fasteners for connection to electrically conductive loop fasteners on a printed circuit board, comprising:

a circuit carrying insulating substrate having opposing first and second sides;

electrically conductive hook fasteners generally formed in the shape of a `J` and having a head portion, a shank portion, and a hook portion;

said substrate having the hook fasteners embedded therein, the head portion exposed on the first side of the substrate, the shank portion embedded within the substrate, and the hook portion protruding out of the second side of the substrate;

a semiconductor device mounted on the first side of the substrate, said device having a plurality of I/O terminations electrically connected to the head portion of selected electrically conductive hook fasteners to provide an electrical pathway between the semiconductor device and the hook portion of the selected electrically conductive hook fasteners;

a transfer molded resin cover encapsulating the semiconductor device and covering a portion of the first side of the circuit carrying substrate, to form a leadless chip carrier; and

such that the hook portion of the selected electrically conductive hook fasteners serves to mate and interlock with corresponding electrically conductive loop fasteners on the printed circuit board so as to electrically and mechanically connect the leadless chip carrier to the printed circuit board.

20. The solderless electrical interconnection as described in claim 19, further comprising a plurality of electrically non-conductive hook fasteners, each of said electrically non-conductive hook fasteners extending through the substrate from the first side to the second side.

21. The solderless electrical interconnection as described in claim 20, wherein only those hook fasteners that are electrically connected to the semiconductor device are electrically conductive.

22. The solderless electrical interconnection as described in claim 21, wherein the substrate is a woven material.

23. The solderless electrical interconnection as described in claim 19, further comprising a dielectric coating over the head portion of those electrically conductive hook fasteners which are not electrically connected to the semiconductor device.

24. The solderless electrical interconnection as described in claim 19, further comprising a circuit pattern selectively metallized on the first side of the substrate.

25. The solderless electrical interconnection as described in claim 19, wherein the hook fasteners are metal wires.

26. The solderless electrical interconnection as described in claim 19, wherein only hook fasteners that are electrically connected to the semiconductor device are present.