Semiconductor laser module and method for fabricating the same

• US 5,774,616 A
• Filed: 06/25/1996
• Issued: 06/30/1998
• Est. Priority Date: 06/27/1995
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Matsuda, Kenichi
• Primary Examiner(s): NGO, HUNG NHAT
• Application Number:
  US08/669,952
• Time in Patent Office: 735 Days
• Field of Search: 385/88-94
• US Class Current: 385/89
• CPC Class Codes: G02B 6/3644 the coupling means being through-holes or wall apertures
• CPC Class Codes: G02B 6/3672 with fibres arranged in a regular matrix array
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/424 Mounting of the optical light guide
• CPC Class Codes: G02B 6/4245 Mounting of the opto-electronic elements
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/4253 by embedding housing components in an adhesive or a polymer material G02B6/4212 takes precedence

Abstract

A semiconductor laser module includes: a semiconductor substrate; a plurality of surface emitting lasers provided on a primary plane of the semiconductor substrate; a plurality of guiding holes provided on a secondary plane of the semiconductor substrate, the secondary plane being opposite to the primary plane; and an optical fiber tape including a plurality of optical fibers and a covering material which fixes the plurality of optical fibers in parallel with each other, one tip of the optical fiber tape being adjoined to the secondary plane of the semiconductor substrate. A pitch of the respective surface emitting lasers is equal to an interval of a center of the respective optical fibers. The respective guiding holes are aligned with the respective surface emitting lasers so that a center of a light beam emitted from each of the surface emitting lasers and a center of each of the guiding holes are at approximately the same position on the secondary plane of the semiconductor substrate. A diameter of each of the guiding holes is substantially equal to an outer diameter of each of the optical fibers. And a portion of the respective optical fibers at tips thereof is exposed from the covering material and inserted into the respective guiding holes.

Claims

1. A semiconductor laser module, comprising:

a semiconductor substrate;

a plurality of surface emitting lasers formed on a primary plane of the semiconductor substrate;

a plurality of guiding holes formed on a secondary plane of the semiconductor substrate, the secondary plane being opposite to the primary plane; and

an optical fiber tape including a plurality of optical fibers and a covering material which fixes the plurality of optical fibers in parallel with each other, one tip of the optical fiber tape being adjoined to the secondary plane of the semiconductor substrate,

wherein a pitch of the respective surface emitting lasers is equal to an interval of a center of the respective optical fibers,

the respective surface emitting lasers comprise a layered structure for emitting light which is grown on the semiconductor substrate,

the respective guiding holes are aligned with the respective surface emitting lasers so that a center of a light beam emitted from each of the surface emitting lasers and a center of each of the guiding holes are at approximately the same position on the secondary plane of the semiconductor substrate,

a diameter of each of the guiding holes is substantially equal to an outer diameter of each of the optical fibers, and

a portion of the respective optical fibers at tips thereof is exposed from the covering material and inserted into the respective guiding holes.

2. A semiconductor laser module according to claim 1, wherein the plurality of surface emitting lasers and the plurality of guiding holes are arranged in a two-dimensional array, and the plurality of optical fibers included in the optical fiber tape are arranged in a one-dimensional array, and a plurality of the optical fiber tapes are overlaid on each other and adjoined to the secondary plane of the semiconductor substrate.

3. A semiconductor laser module according to claim 1, further comprising a supporting substrate having a wiring pattern provided thereon, wherein the semiconductor substrate is fixed on the supporting substrate in such a manner that the primary plane of the semiconductor substrate is in contact with the supporting substrate, so that the surface emitting lasers are electrically connected to the wiring pattern.

4. A semiconductor laser module according to claim 3, wherein the semiconductor substrate is fixed to the supporting substrate using a resin.

5. A semiconductor laser module according to claim 1, wherein the guiding holes are aligned with the surface emitting lasers so that a distance between the center of the light beam emitted from each of the surface emitting lasers and the center of each of the guiding holes is set to be about 10 μ

m or less on the secondary plane of the semiconductor substrate.

6. A semiconductor laser module according to claim 1, wherein the respective guiding holes are aligned with the respective surface emitting lasers using a mask aligner which exposes a pattern on the secondary plane which is aligned to a pattern on the primary plane.

7. A semiconductor laser module, comprising:

a semiconductor substrate;

a plurality of surface emitting lasers formed on a primary plane of the semiconductor substrate;

a plurality of guiding holes formed on a secondary plane of the semiconductor substrate, the secondary plane being opposite to the primary plane; and

an optical fiber tape including a plurality of optical fibers and a covering material which fixes the plurality of optical fibers in parallel with each other, one tip of the optical fiber tape being adjoined to the secondary plane of the semiconductor substrate,

wherein a pitch of the respective surface emitting lasers is equal to an interval of a center of the respective optical fibers,

the respective guiding holes are aligned with the respective surface emitting lasers so that a center of a light beam emitted from each of the surface emitting lasers and a center of each of the guiding holes are at approximately the same position on the secondary plane of the semiconductor substrate,

a diameter of each of the guiding holes is larger than an outer diameter of each of the optical fibers by about 1 μ

m to about 10 μ

m, and

a portion of the respective optical fibers at tips thereof is exposed from the covering material and inserted into the respective guiding holes.

8. A semiconductor laser module, comprising:

a semiconductor substrate;

a plurality of surface emitting lasers formed on a primary plane of the semiconductor substrate;

a plurality of guiding holes formed on a secondary plane of the semiconductor substrate, the secondary plane being opposite to the primary plane; and

an optical fiber tape including a plurality of optical fibers and a covering material which fixes the plurality of optical fibers in parallel with each other, one tip of the optical fiber tape being adjoined to the secondary plane of the semiconductor substrate,

wherein a pitch of the respective surface emitting lasers is equal to an interval of a center of the respective optical fibers,

the respective guiding holes are aligned with the respective surface emitting lasers so that a center of a light beam emitted from each of the surface emitting lasers and a center of each of the guiding holes are at approximately the same position on the secondary plane of the semiconductor substrate,

a portion of the respective optical fibers at tips thereof is exposed from the covering material and inserted into the respective guiding holes, and

a length of the portion of the respective optical fibers at the adjoined tip thereof exposed from the covering material is about 3 mm or less.

9. A semiconductor laser module, comprising:

a supporting substrate;

a semiconductor substrate, having a primary plane and a secondary plane opposite to the primary plane, provided on the supporting substrate in such a manner that the primary plane is in contact with the supporting substrate;

a surface emitting laser formed on the primary plane of the semiconductor substrate;

a guiding hole formed on the secondary plane of the semiconductor substrate;

an optical fiber cable including an optical fiber and a covering material which covers the optical fiber, one tip of the optical fiber cable being adjoined to the secondary plane of the semiconductor substrate; and

a fiber supporting member provided perpendicularly to the semiconductor substrate,

wherein the guiding hole is aligned with the surface emitting laser so that a center of a light beam emitted from the surface emitting laser and a center of the guiding hole are at approximately the same position on the secondary plane of the semiconductor substrate,

the respective surface emitting lasers comprise a layered structure for emitting light which is grown on the semiconductor substrate,

a diameter of the guiding hole is substantially equal to an outer diameter of the optical fiber,

a portion of the optical fiber at one tip thereof is exposed from the covering material and inserted into the guiding hole, and

the covering material is supported by the fiber supporting member.

10. A semiconductor laser module according to claim 9, wherein a plurality of the surface emitting lasers and a plurality of the guiding holes are provided, the optical fiber cable is an optical fiber tape which includes a plurality of the optical fibers fixed in parallel with each other by the covering material, and a pitch of the respective surface emitting lasers is equal to an interval of a center of the respective optical fibers.

11. A semiconductor laser module according to claim 10, wherein the plurality of surface emitting lasers and the plurality of guiding holes are arranged in a two-dimensional array, and the plurality of optical fibers included in the optical fiber tape are arranged in a one-dimensional array, and the plurality of optical fiber tapes are adjoined to the secondary plane of the semiconductor substrate.

12. A semiconductor laser module according to claim 9, wherein the guiding hole is aligned with the surface emitting laser using a mask aligner which exposes a pattern on the secondary plane which is aligned with a pattern on the primary plane.

13. A semiconductor laser module, comprising:

a supporting substrate;

a semiconductor substrate, having a primary plane and a secondary plane opposite to the primary plane, provided on the supporting substrate in such a manner that the primary plane is in contact with the supporting substrate;

a surface emitting laser formed on the primary plane of the semiconductor substrate;

a guiding hole formed on the secondary plane of the semiconductor substrate;

an optical fiber cable including an optical fiber and a covering material which covers the optical fiber, one tip of the optical fiber cable being adjoined to the secondary plane of the semiconductor substrate; and

a resin molding which integrally seals the semiconductor substrate, the supporting substrate, and a portion of the optical fiber located in the vicinity of the adjoined tip thereof,

wherein the guiding hole is aligned with the surface emitting laser so that a center of a light beam emitted from the surface emitting laser and a center of the guiding hole are at approximately the same position on the secondary plane of the semiconductor substrate,

the respective surface emitting lasers comprise a layered structure for emitting light which is grown on the semiconductor substrate,

a diameter of the guiding hole is substantially equal to an outer diameter of the optical fiber, and

a portion of the optical fiber at one tip thereof is exposed from the covering material and inserted into the guiding hole.

14. A semiconductor laser module according to claim 13, wherein a plurality of the surface emitting lasers and a plurality of the guiding holes are provided, the optical fiber cable is an optical fiber tape which includes a plurality of the optical fibers fixed in parallel with each other by the covering material, and a pitch of the respective surface emitting lasers is equal to an interval of a center of the respective optical fiber core wires.

15. A semiconductor laser module according to claim 14, wherein the plurality of surface emitting lasers and the plurality of guiding holes are arranged in a two-dimensional array, and the plurality of optical fibers included in the optical fiber tape are arranged in a one-dimensional array, and the plurality of optical fiber tapes are adjoined to the secondary plane of the semiconductor substrate.

16. A semiconductor laser module according to claim 13, further comprising a fiber supporting member, wherein the covering material is supported by the fiber supporting member.

17. A semiconductor laser module according to claim 13, wherein the guiding hole is aligned with the surface emitting laser using a mask aligner which exposes a pattern on the secondary plane which is aligned with a pattern on the primary plane.

18. A method for fabricating a semiconductor laser module, comprising the steps of:

forming a plurality of surface emitting lasers which are arranged in a two-dimensional array on a primary plane of a semiconductor substrate;

forming a plurality of guiding holes arranged in a two-dimensional array on a secondary plane of the semiconductor substrate in such a manner that the respective guiding holes are aligned with the respective surface emitting lasers;

fixing the semiconductor substrate on a supporting substrate in such a manner that the primary plane of the semiconductor substrate is in contact with the supporting substrate;

providing a first optical fiber tape including a plurality of first optical fibers and a first covering material which fixes the first optical fibers in parallel with each other, and exposing a portion of the first optical fibers at tips thereof from the first covering material;

aligning the respective first optical fibers with the respective guiding holes in a first row so that the respective first optical fibers are inserted into the respective guiding holes in the first row, thereby adjoining the first optical fiber tape to the secondary plane of the semiconductor substrate;

fixing the first covering material of the first optical fiber tape to a fiber supporting member;

providing a second optical fiber tape including a plurality of second optical fibers and a second covering material which fixes the second optical fibers in parallel with each other, and exposing a portion of the second optical fibers at tips thereof from the second covering material;

aligning the respective second optical fibers with the respective guiding holes in a second row so that the respective second optical fibers are inserted into the respective guiding holes in the second row, thereby adjoining the second optical fiber tape to the secondary plane of the semiconductor substrate; and

fixing the second covering material of the second optical fiber tape to the first covering material of the first optical fiber tape.

19. A method according to claim 18, wherein a double-sided mask aligner is employed for aligning the respective surface emitting lasers with the respective guiding holes.

20. A method according to claim 18, wherein the semiconductor substrate is fixed to the supporting substrate using a resin.

21. A method for fabricating a semiconductor laser module according to claim 18, wherein the respective guiding holes are aligned with the respective surface emitting lasers using a mask aligner which exposes a pattern on the secondary plane which is aligned with a pattern on the primary plane.

22. A method for fabricating a semiconductor laser module according to claim 18, wherein the step of forming a plurality of surface emitting lasers includes the step of growing a layered structure for emitting light on the semiconductor substrate.

23. A method for fabricating a semiconductor laser module according to claim 18, wherein the first optical fiber tape is kept in a curved state at least during the step of aligning the respective second optical fibers.

24. A method for fabricating a semiconductor laser module, comprising the steps of:

providing a plurality of surface emitting lasers which are arranged in a two-dimensional array on a primary plane of a semiconductor substrate;

forming a plurality of guiding holes arranged in a two dimensional array on a secondary plane of the semiconductor substrate in such a manner that the respective guiding holes are aligned with the respective surface emitting lasers;

fixing the semiconductor substrate on a supporting substrate in such a manner that the primary plane of the semiconductor substrate is in contact with the supporting substrate;

providing a first optical fiber tape including a plurality of first optical fibers and a first covering material which fixes the first optical fibers in parallel with each other, and exposing a portion of the first optical fibers at tips thereof from the first covering material;

providing a second optical fiber tape including a plurality of second optical fibers and a second covering material which fixes the second optical fibers in parallel with each other, and exposing a portion of the second optical fibers at tips thereof from the second covering material;

overlaying the second optical fiber tape onto the first optical fiber tape, thereby aligning the respective first optical fibers with the respective second optical fibers;

fixing the first and second optical fiber tapes with each other; and

aligning the respective first and second optical fibers with the respective guiding holes so that the respective first and second optical fibers are inserted into the respective guiding holes, thereby adjoining the first and second optical fiber tapes to the secondary plane of the semiconductor substrate.

25. A method according to claim 24, wherein a double-sided mask aligner is employed for aligning the respective surface emitting lasers with-the respective guiding holes.

26. A method according to claim 24, further comprising the step of integrally sealing with a resin the semiconductor substrate, the supporting substrate, and a portion of the first and second optical fiber tapes located in the vicinity of the adjoined tips thereof.