Method of encapsulating a semiconductor package
First Claim
1. A method of encapsulating a semiconductor device, comprising the steps of:
- disposing a spacer layer between a top surface of a sheet-like substrate and a contact bearing surface of a semiconductor chip, wherein the substrate has terminals thereon and bonding windows such that conductive leads electrically connected to the terminals extend at least partially thereacross and are juxtaposed with respective chip contacts;
bonding the leads to respective chip contacts;
attaching a protective layer on a bottom surface of the substrate so as to cover the bonding windows;
depositing flowable encapsulation material around at least a portion of the periphery of the chip after attaching the protective layer so as to encapsulate the bonded leads; and
at least partially curing the encapsulation material.
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Abstract
A method of encapsulating a semiconductor device. The encapsulation method includes a semiconductor chip package assembly having a spacer layer between a top surface of a sheet-like substrate and a contact bearing surface of a semiconductor chip, wherein the substrate has conductive leads thereon, the leads being electrically connected to terminals on a first end and bonded to respective chip contacts on a second end. Typically, the spacer layer is comprised of a compliant or elastomeric material. A protective layer is attached on a bottom surface of the substrate so as to cover the terminals on the substrate. A flowable, curable encapsulant material is deposited around a periphery of the semiconductor chip after the attachment of the protective layer so as to encapsulate the leads. The encapsulant material is then cured. Typically, this encapsulation method is performed on a plurality of chip assemblies simultaneously.
222 Citations
47 Claims
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1. A method of encapsulating a semiconductor device, comprising the steps of:
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disposing a spacer layer between a top surface of a sheet-like substrate and a contact bearing surface of a semiconductor chip, wherein the substrate has terminals thereon and bonding windows such that conductive leads electrically connected to the terminals extend at least partially thereacross and are juxtaposed with respective chip contacts; bonding the leads to respective chip contacts; attaching a protective layer on a bottom surface of the substrate so as to cover the bonding windows; depositing flowable encapsulation material around at least a portion of the periphery of the chip after attaching the protective layer so as to encapsulate the bonded leads; and at least partially curing the encapsulation material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of encapsulating a semiconductor device, comprising the steps of:
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disposing a spacer layer between a top surface of a sheet-like substrate and a contact bearing surface of a semiconductor chip, wherein the substrate has conductive leads thereon, the leads being electrically connected to terminals on the substrate on a first end and bonded to respective chip contacts on a second end; attaching a protective layer on a bottom surface of the substrate so as to cover the terminals; depositing flowable encapsulation material around at least a portion of the periphery of the chip after attaching the protective layer so as to encapsulate the bonded leads; and curing the encapsulation material. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A method of encapsulating a semiconductor device, comprising the steps of:
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disposing a spacer layer between a top surface of a sheet-like substrate and a contact bearing surface of a semiconductor chip, wherein the substrate has conductive leads which are electrically connected to terminals on the substrate on a first end and bonded to respective chip contacts on a second end; placing raised terminals atop the terminal regions; placing the semiconductor device into a mold prior to the encapsulation step wherein the raised terminals provide a stand-off between substrate and the mold; depositing flowable encapsulation material into the mold around a at least a portion of the periphery of the chip so as to encapsulate the leads and substrate while leaving at least a portion of the raised terminals exposed; and removing the mold after at least a portion of the encapsulation material has been cured. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34)
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35. A method of encapsulating a semiconductor device assembly, comprising the steps of:
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providing a sheet-like, dielectric substrate having a first and second surface and an inner portion and an outer portion, the inner and outer portions being separated by at least one bonding window extending through the substrate, the substrate further having conductive terminals on at least the outer portion on the second surface of the substrate; providing a rigid element having first and second opposite surfaces; attaching a back surface of a semiconductor chip to the first surface of the rigid element; disposing a first spacer layer between the first surface of the inner portion of the substrate and a contact-bearing face surface of the chip so that both the substrate and the chip are adhered thereto; disposing a second spacer layer between the first surface of the outer portion of the substrate and the first surface of the rigid element and a contact-bearing face surface of the chip so that both the substrate and the rigid element are adhered thereto; electrically connecting the terminals to respective chip contacts through the at least one bonding window in the substrate; attaching a protective layer on a bottom surface of the substrate so as to cover the bonding windows; depositing flowable encapsulation material around at least a portion of the periphery of the chip after attaching the protective layer so as to encapsulate the bonded leads; and at least partially curing the encapsulation material. - View Dependent Claims (36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47)
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Specification