Electronic article surveillance protection for printed circuit boards
First Claim
Patent Images
1. A printed circuit board comprising:
- (a) a first layer;
(b) a second layer;
(c) an electronic article surveillance tag positioned between said first and second layers; and
(d) bonding material positioned between said first and second layers to bond said first layer, second layer, and electronic article surveillance tag together.
5 Assignments
0 Petitions
Accused Products
Abstract
A printed circuit board includes first and second layers and an electronic article surveillance tag positioned between the first and second layers. Bonding material is positioned between the first and second layers to bond the first layer, second layer and electronic article surveillance tag together. The printed circuit board can be detected by an electronic article surveillance system.
21 Citations
27 Claims
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1. A printed circuit board comprising:
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(a) a first layer; (b) a second layer; (c) an electronic article surveillance tag positioned between said first and second layers; and (d) bonding material positioned between said first and second layers to bond said first layer, second layer, and electronic article surveillance tag together. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of making a printed circuit board which comprises the steps of:
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(a) positioning an electronic article surveillance tag between a first and second layer of the printed circuit board; (b) positioning bonding material between the first and second layers; (c) applying heat and pressure to the first layer, electronic article surveillance tag, bonding material, and second layer to cause the bonding material to bond the first layer, electronic article surveillance tag and second layer together. - View Dependent Claims (13, 14, 15, 16)
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17. An electronic article surveillance system comprising:
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(a) means for generating an interrogation signal in an interrogation zone; (b) a printed circuit board comprising a first layer, a second layer, an electronic article surveillance tag positioned between said first and second layers, and bonding material positioned between said first and second layers to bond said first layer, second layer, and electronic article surveillance tag together; and (c) means for detecting said electronic article surveillance tag when said printed circuit board is in said interrogation zone and said generating means generates an interrogation signal. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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Specification