Power semiconductor module having elongate plug contacts

• US 5,777,849 A
• Filed: 02/06/1996
• Issued: 07/07/1998
• Est. Priority Date: 02/06/1996
• Status: Expired due to Fees

• Current Assignee: Asea Brown Boveri AG (ABB Limited)
• Original Assignee: Asea Brown Boveri AG (ABB Limited)
• Inventors: Schifferli, Rolf, Bayerer, Reinhold, Hilpert, Gerald
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Vigushin, John B.
• Application Number:
  US08/597,133
• Time in Patent Office: 882 Days
• Field of Search: 361/730, 361/732, 361/733, 361/735, 361/775, 361/809, 361/812, 361/813, 361/822, 361/823, 257/684, 257/686, 257/688, 257/689, 257/691, 257/693, 257/700, 257/709, 439/76.1, 439/79, 439/80, 174/70 B, 174/71 B, 174/72 B, 174/88 B
• US Class Current: 361/730
• CPC Class Codes: H01R 12/7088 Arrangements for power supply
• CPC Class Codes: H05K 7/1422 Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames

Abstract

A power semiconductor module is specified. It comprises a housing into which any desired power semiconductor circuit is installed. The power semiconductor circuit has at least two connections, which are passed out of the housing. According to the invention, the connections have the form of an elongate plug contact. An insulating plate may additionally be provided between the adjacent plug contacts. Reliable, yet easily releasable, low-inductance electrical contact is achieved by this form of the connections.

Claims

1. A power semiconductor module comprising;

a module housing;

a power semiconductor circuit provided in the module housing;

at least two elongate plug contacts for providing at least two electrical connections, said at least two elongate plug contacts extending out of the module housing; and

wherein an insulating plate is provided between the at least two elongate plug contacts.

2. The power semiconductor module according to claim 1, wherein the at least two elongate plug contacts are arranged next to one another.

3. The power semiconductor module according to claim 2, wherein the at least two elongate plug contacts have a multiplicity of parallel contact points.

4. A power semiconductor circuit arrangement comprising:

a plurality of power semiconductor modules;

a plurality of connecting plates; and

wherein the power semiconductor modules comprise;

a module housing,

a power semiconductor circuit provided in the module housing,

at least two elongate plug contacts for providing at least two electrical connections, said at least two plug contacts extending out of the module housing, and

an insulating plate which is provided between the at least two elongate plug contacts; and

wherein the connecting plates are designed to mechanically and electrically connect with the plug contacts of the power semiconductor modules.

5. The power semiconductor circuit arrangement according to claim 4, wherein the connecting plates are arranged one above the other and have a lattice form provided with cut outs forming webs, and wherein the webs of the latticed connecting plates have, in the region of the cut outs and at the edge of the connecting plates, lugs which protrude essentially at right angles to mechanically and electrically connect with the elongate plug contacts.

6. The power semiconductor module according to claim 4, wherein the at least two elongate plug contacts are arranged next to one another.

7. The power semiconductor circuit arrangement according to claim 5, wherein the at least two elongate plug contacts have a multiplicity of parallel contact points.