Bulk fabricated electromagnetic micro-relays/micro-switches and method of making same
First Claim
1. A micro-relay comprising:
- a substrate having a magnetic pathway located therein;
one or more coils located on the substrate over the magnetic pathway, wherein a current applied to the one or more coils magnetizes the magnetic pathway;
a first electrically conductive contact pad coupled to the substrate, the first contact pad being electrically insulated from the substrate;
a flexible monocrystalline structure suspended over the substrate;
a second electrically conductive contact pad coupled to the monocrystalline structure and located above the first contact pad, the second contact pad being positioned such that when the monocrystalline structure flexes toward the substrate, the second contact pad touches the first contact pad, thereby providing an electrical connection between the first and second contact pads; and
a pole piece coupled to the monocrystalline structure and positioned above the one or more coils, whereby a current applied to the one or more coils generates an electromagnetic force which flexes the monocrystalline structure toward the substrate, thereby causing the second contact pad to touch the first contact pad.
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Accused Products
Abstract
A micro-relay has a flexible monocrystalline structure which is moved by an electromagnetic force to establish a connection between relay contact elements. The micro-relay includes a substrate having a magnetic pathway and one or more coils located over the magnetic pathway. A first contact pad is coupled to the substrate. The monocrystalline structure is suspended over the substrate. A second contact pad and pole pieces are coupled to the monocrystalline structure such that the second contact pad is positioned over the first contact pad, and the pole pieces are located over the coils. A current is applied to the coils to generate an electromagnetic force which flexes the monocrystalline structure toward the substrate, thereby causing the second contact pad to touch the first contact pad. In one embodiment, the coils include insulating spacers located adjacent to the innermost and outermost traces to prevent shorting.
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Citations
35 Claims
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1. A micro-relay comprising:
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a substrate having a magnetic pathway located therein; one or more coils located on the substrate over the magnetic pathway, wherein a current applied to the one or more coils magnetizes the magnetic pathway; a first electrically conductive contact pad coupled to the substrate, the first contact pad being electrically insulated from the substrate; a flexible monocrystalline structure suspended over the substrate; a second electrically conductive contact pad coupled to the monocrystalline structure and located above the first contact pad, the second contact pad being positioned such that when the monocrystalline structure flexes toward the substrate, the second contact pad touches the first contact pad, thereby providing an electrical connection between the first and second contact pads; and a pole piece coupled to the monocrystalline structure and positioned above the one or more coils, whereby a current applied to the one or more coils generates an electromagnetic force which flexes the monocrystalline structure toward the substrate, thereby causing the second contact pad to touch the first contact pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A micro-relay comprising:
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a substrate; a first electrically conductive contact pad coupled to the substrate, the first contact pad being electrically insulated from the substrate; a flexible monocrystalline structure suspended over the substrate; a second electrically conductive pad coupled to the monocrystalline structure and located above the first contact pad, the second contact pad being positioned such that when the monocrystalline structure flexes toward the substrate, the second contact pad touches the first contact pad, thereby providing an electrical connection between the first and second contact pads; and means for generating a magnetic force which pulls the monocrystalline structure towards the substrate, thereby causing the second contact pad to touch the first contact pad. - View Dependent Claims (16, 17, 18, 19, 20)
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21. A micro-relay comprising:
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a substrate; a monocrystalline semiconductor structure suspended above the substrate; means for generating a magnetic force which moves the monocrystalline structure relative to the substrate; and means for establishing an electrical connection when the monocrystalline structure is moved by the means for generating, the means for establishing an electrical connection being separate from the means for generating.
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22. A coil comprising:
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a planar substrate; a first winding layer located over the substrate, the first winding layer having an innermost trace and an outermost trace; a first insulating spacer located adjacent to the innermost trace of the first winding layer; a second insulating spacer located adjacent to the outermost trace of the first winding layer; and a first insulating layer located over the first winding layer and the first and second spacers. - View Dependent Claims (23, 24)
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25. A method of operating a micro-relay comprising the steps of:
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generating an electromagnetic force; using the electromagnetic force to flex a monocrystalline structure; and closing an electrical circuit when the monocrystalline structure is flexed, wherein the closing is achieved by a contact element located on the monocrystalline structure.
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26. A method of fabricating a micro-relay comprising the steps of:
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providing a substrate having a magnetic pathway; forming one or more coils over the magnetic pathway; forming a first electrically conductive contact element over the substrate; forming a flexible monocrystalline structure; forming a pole piece on the monocrystalline structure; forming a second electrically conductive contact element on the monocrystalline structure; joining the monocrystalline structure to the substrate such that the monocrystalline structure is suspended over substrate, the pole piece is located over the one or more coils and the second contact element is located over the first contact element.
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27. A method of fabricating a coil over a planar substrate comprising the steps of:
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forming a first winding layer of the coil over the substrate, the first winding layer having an innermost trace and an outermost trace; forming a first electrically insulating spacer adjacent to the outermost trace; forming a second electrically insulating spacer adjacent to the innermost trace; and forming a first insulating layer over the first winding layer and the first and second spacers. - View Dependent Claims (28, 29, 30, 31)
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32. A micro-relay comprising:
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a monocrystalline structure comprising a frame portion and a flexible beam portion extending from the frame portion; a first contact element located on the beam portion; a second contact element separated from the first contact element; means for flexing the beam portion such that the first contact element contacts the second contact element, the means for flexing being coupled to the beam portion. - View Dependent Claims (33, 34, 35)
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Specification