Bulk fabricated electromagnetic micro-relays/micro-switches and method of making same

• US 5,778,513 A
• Filed: 02/09/1996
• Issued: 07/14/1998
• Est. Priority Date: 02/09/1996
• Status: Expired due to Term

• Current Assignee: Cisco Technology, Inc. (Cisco Systems, Inc.), Denny K. Miu
• Original Assignee: Denny K. Miu
• Inventors: Miu, Denny K., Temesvary, Viktoria A., Tang, Weilong
• Primary Examiner(s): BRAY, WAYMOND D
• Application Number:
  US08/599,018
• Time in Patent Office: 886 Days
• Field of Search: 361/283.1, 361/684, 361/792, 361/803, 361/819, 29/602.1, 29/605, 29/831, 29/841, 29/827, 335/78, 335/79, 335/80
• US Class Current: 29/602.1
• CPC Class Codes: H01F 2017/0086 on semiconductor substrate
• CPC Class Codes: H01F 41/042 by thin film techniques
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01H 1/20 Bridging contacts for circuit breakers H01H73/045
• CPC Class Codes: H01H 50/005 using micromechanics
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base

Abstract

A micro-relay has a flexible monocrystalline structure which is moved by an electromagnetic force to establish a connection between relay contact elements. The micro-relay includes a substrate having a magnetic pathway and one or more coils located over the magnetic pathway. A first contact pad is coupled to the substrate. The monocrystalline structure is suspended over the substrate. A second contact pad and pole pieces are coupled to the monocrystalline structure such that the second contact pad is positioned over the first contact pad, and the pole pieces are located over the coils. A current is applied to the coils to generate an electromagnetic force which flexes the monocrystalline structure toward the substrate, thereby causing the second contact pad to touch the first contact pad. In one embodiment, the coils include insulating spacers located adjacent to the innermost and outermost traces to prevent shorting.

Claims

1. A micro-relay comprising:

a substrate having a magnetic pathway located therein;

one or more coils located on the substrate over the magnetic pathway, wherein a current applied to the one or more coils magnetizes the magnetic pathway;

a first electrically conductive contact pad coupled to the substrate, the first contact pad being electrically insulated from the substrate;

a flexible monocrystalline structure suspended over the substrate;

a second electrically conductive contact pad coupled to the monocrystalline structure and located above the first contact pad, the second contact pad being positioned such that when the monocrystalline structure flexes toward the substrate, the second contact pad touches the first contact pad, thereby providing an electrical connection between the first and second contact pads; and

a pole piece coupled to the monocrystalline structure and positioned above the one or more coils, whereby a current applied to the one or more coils generates an electromagnetic force which flexes the monocrystalline structure toward the substrate, thereby causing the second contact pad to touch the first contact pad.

2. The micro-relay of claim 1, wherein the monocrystalline structure comprises:

a frame portion located about a perimeter of the monocrystalline structure;

a platform portion which is laterally surrounded by the frame portion, the pole piece and the second contact pad being located on the platform portion; and

a plurality of spring elements extending between the frame portion and the platform portion.

3. The micro-relay of claim 2, wherein the spring elements have a serpentine shape.

4. The micro-relay of claim 2, further comprising a cover located over the monocrystalline structure.

5. The micro-relay of claim 1, wherein the monocrystalline structure is continuous.

6. The micro-relay of claim 5, wherein the monocrystalline structure is capable of buckling and latching when the monocrystalline structure flexes toward the substrate.

7. The micro-relay of claim 1, wherein the monocrystalline structure has a thickness of less than 100 μ

m.

8. The micro-relay of claim 1, further comprising at least one pole tip extending from the pole piece.

9. The micro-relay of claim 1, further comprising a pole tip coupled to the substrate, wherein one of the one or more coils laterally surrounds the pole tip.

10. The micro-relay of claim 1, wherein the substrate comprises a ferromagnetic material.

11. The micro-relay of claim 1, wherein the substrate comprises:

a monocrystalline silicon substrate having a trench located therein; and

a layer of ferromagnetic material located in the trench, wherein the ferromagnetic material forms the magnetic pathway.

12. The micro-relay of claim 1, wherein the pole piece comprises a ferromagnetic material.

13. The micro-relay of claim 1, wherein the pole piece comprises a permanent magnet.

14. The micro-relay of claim 1, wherein the monocrystalline structure comprises monocrystalline silicon.

15. A micro-relay comprising:

a substrate;

a first electrically conductive contact pad coupled to the substrate, the first contact pad being electrically insulated from the substrate;

a flexible monocrystalline structure suspended over the substrate;

a second electrically conductive pad coupled to the monocrystalline structure and located above the first contact pad, the second contact pad being positioned such that when the monocrystalline structure flexes toward the substrate, the second contact pad touches the first contact pad, thereby providing an electrical connection between the first and second contact pads; and

means for generating a magnetic force which pulls the monocrystalline structure towards the substrate, thereby causing the second contact pad to touch the first contact pad.

16. The micro-relay of claim 15, wherein the means for generating comprises an electromagnet.

17. The micro-relay of claim 16, wherein the electromagnet is coupled to the substrate.

18. The micro-relay of claim 16, wherein the electromagnet is positioned away from the substrate.

19. The micro-relay of claim 15, wherein the means for generating comprises a permanent magnet.

20. The micro-relay of claim 15, wherein the monocrystalline structure comprises monocrystalline silicon.

21. A micro-relay comprising:

a substrate;

a monocrystalline semiconductor structure suspended above the substrate;

means for generating a magnetic force which moves the monocrystalline structure relative to the substrate; and

means for establishing an electrical connection when the monocrystalline structure is moved by the means for generating, the means for establishing an electrical connection being separate from the means for generating.

22. A coil comprising:

a planar substrate;

a first winding layer located over the substrate, the first winding layer having an innermost trace and an outermost trace;

a first insulating spacer located adjacent to the innermost trace of the first winding layer;

a second insulating spacer located adjacent to the outermost trace of the first winding layer; and

a first insulating layer located over the first winding layer and the first and second spacers.

23. The coil of claim 22, further comprising:

a second winding layer located over the first insulating layer, the second winding layer having an innermost trace and an outermost trace;

a third insulating spacer located adjacent to the innermost trace of the second winding layer;

a fourth insulating spacer located adjacent to the outermost trace of the second winding layer; and

a second insulating layer located over the second winding layer and the third and fourth spacers.

24. The coil of claim 22, wherein the first and second spacers comprise photoresist material.

25. A method of operating a micro-relay comprising the steps of:

generating an electromagnetic force;

using the electromagnetic force to flex a monocrystalline structure; and

closing an electrical circuit when the monocrystalline structure is flexed, wherein the closing is achieved by a contact element located on the monocrystalline structure.

26. A method of fabricating a micro-relay comprising the steps of:

providing a substrate having a magnetic pathway;

forming one or more coils over the magnetic pathway;

forming a first electrically conductive contact element over the substrate;

forming a flexible monocrystalline structure;

forming a pole piece on the monocrystalline structure;

forming a second electrically conductive contact element on the monocrystalline structure;

joining the monocrystalline structure to the substrate such that the monocrystalline structure is suspended over substrate, the pole piece is located over the one or more coils and the second contact element is located over the first contact element.

27. A method of fabricating a coil over a planar substrate comprising the steps of:

forming a first winding layer of the coil over the substrate, the first winding layer having an innermost trace and an outermost trace;

forming a first electrically insulating spacer adjacent to the outermost trace;

forming a second electrically insulating spacer adjacent to the innermost trace; and

forming a first insulating layer over the first winding layer and the first and second spacers.

28. The method of claim 27, further comprising the steps of forming a second insulating layer over the substrate, and forming the first winding layer and the first and second spacers over the second insulating layer.

29. The method of claim 27, wherein the steps of forming the first winding layer and the first and second spacers further comprise the steps of:

forming a photoresist layer over the substrate;

exposing the photoresist layer through a first reticle which defines the first winding layer;

developing the photoresist layer to form an opening in the photoresist layer;

forming an electrically conductive material in the opening, thereby forming the first winding layer;

exposing the photoresist layer through a second reticle which defines the first and second spacers; and

developing the photoresist layer, thereby leaving portions of the photoresist layer as the first and second spacers.

30. The method of claim 29, further comprising the step of baking the portions of the photoresist layer.

31. The method of claim 27, further comprising the steps of:

forming a second winding layer of the coil over the first insulating layer, the second winding layer having an innermost trace and an outermost trace;

forming a third electrically insulating spacer adjacent to the outermost trace of the second winding layer;

forming a fourth electrically insulating spacer adjacent to the innermost trace of the second winding layer; and

forming a second insulating layer over the second winding layer and the third and fourth spacers.

32. A micro-relay comprising:

a monocrystalline structure comprising a frame portion and a flexible beam portion extending from the frame portion;

a first contact element located on the beam portion;

a second contact element separated from the first contact element;

means for flexing the beam portion such that the first contact element contacts the second contact element, the means for flexing being coupled to the beam portion.

33. The micro-relay of claim 32, wherein the means for flexing comprise:

a pole piece formed on the beam portion; and

an element for generating a magnetic field located adjacent to the pole piece.

34. The micro-relay of claim 33, wherein the element for generating a magnetic field comprises:

a structural member coupled to the monocrystalline structure, the structural member having a magnetic pathway located therein; and

a coil coupled to the structural member, the coil being located over the magnetic pathway and being positioned adjacent to the pole piece.

35. The micro-relay of claim 32, wherein the means for flexing comprises:

a first pole piece coupled to the beam portion;

a second pole piece coupled to the frame portion, wherein a gap separates the first and second pole pieces, the first pole piece being offset from the second pole piece across the gap; and

a coil located around the second pole piece.