Solder jet printhead

• US 5,779,971 A
• Filed: 06/07/1996
• Issued: 07/14/1998
• Est. Priority Date: 06/07/1996
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Hanson, Eric G., Tsung Pan, Alfred I., Allen, Ross R.
• Primary Examiner(s): KASTLER, SCOTT R
• Application Number:
  US08/660,649
• Time in Patent Office: 767 Days
• Field of Search: 266/237, 266/236, 266/45, 222/593, 222/594, 222/595, 222/590, 427/422, 427/100, 427/427
• US Class Current: 266/237
• CPC Class Codes: B23K 3/0607 Solder feeding devices
• CPC Class Codes: B41J 2/01 Ink jet

Abstract

A solder drop ejector is disclosed where a current through liquid solder in a channel flows in a direction opposite to the direction of current through a fixed conductor insulated from the channel. The magnetic fields generated repulse the solder toward an orifice to eject a droplet of solder. The dielectric layer separating the fixed conductor and the solder is formed of a film. The film may be made extremely thin, such as 0.1 microns, so that the necessary repulsion force generated by the oppositely flowing currents may be achieved with relatively low driving currents of 10-200 amperes. The thin dielectric film is not molded and is not required to provide mechanical support to a channel wall. Hence, the manufacturing of the resulting solder jet printhead is simplified and its reliability is improved.

Claims

1. A solder drop ejector comprising:

an insulating substrate;

a first conductor located on a surface of said insulating substrate;

a dielectric layer located on said first conductor, said dielectric layer having at least one opening for exposing a first portion of said first conductor;

a solder channel, for containing liquid solder, located on said dielectric layer such that liquid solder in said solder channel will be in electrical contact with said first conductor through said opening in said dielectric layer and insulated from said first conductor along a second portion of said first conductor by said dielectric layer, said solder channel communicating with an orifice; and

electrodes for conducting a current through said first conductor in a first direction and conducting a current through said liquid solder within said solder channel in a direction substantially opposite to said first direction,

said first conductor, said solder channel, and said orifice being arranged such that a sufficient electric current through said first conductor and said liquid solder in said solder channel generates magnetic fields which force an amount of said solder through said orifice.

2. The ejector of claim 1 wherein said first conductor comprises a conductive trace.

3. The ejector of claim 1 wherein said dielectric layer comprises a polymer layer laminated onto a surface of said first conductor.

4. The ejector of claim 3 wherein said polymer is a polyimide.

5. The ejector of claim 1 wherein said dielectric layer is sputtered onto a surface of said first conductor.

6. The ejector of claim 1 wherein said dielectric is silicon dioxide (SiO₂).

7. The ejector of claim 1 further comprising:

a conductive via formed in said opening in said dielectric layer to electrically connect said first portion of said first conductor to said liquid solder in said solder channel, said via being formed of a material relatively insoluble in said liquid solder.

8. The ejector of claim 1 further comprising:

a second conductor connected between one of said electrodes and said liquid solder within said solder channel.

9. The ejector of claim 8 wherein said second conductor is located on said surface of said insulating substrate, said dielectric layer being located on said second conductor and having a second opening for exposing a first portion of said second conductor, said liquid solder in said solder channel being electrically coupled to said second conductor through said second opening.

10. The ejector of claim 8 wherein said second conductor is insulated from said first conductor by a second dielectric layer.

11. The ejector of claim 1 wherein said ejector further comprises a plurality of solder channels, each of said solder channels communicating with an associated orifice.

12. The ejector of claim 1 wherein said solder channel communicates with a plurality of orifices.

13. The ejector of claim 1 wherein said ejector further comprises a plurality of solder channels, a plurality of orifices, and a plurality of first conductors, wherein a current is applied through each pair of a solder channel and a first conductor so as to eject an amount of solder through an associated orifice.

14. The ejector of claim 1 further comprising a heater for maintaining said solder in a molten state.

15. The ejector of claim 1 wherein said ejector is configured as a replaceable cartridge which can be inserted into a receptacle.

16. The ejector of claim 1 wherein said dielectric layer has a thickness between approximately 0.1 and 200 microns.

17. A solder drop ejector comprising:

an insulating substrate;

a first conductor located on a surface of said insulating substrate;

a dielectric layer located on said first conductor such that said first conductor is sandwiched between said substrate and said dielectric layer;

a solder channel, for containing liquid solder, located on said dielectric layer so as to be insulated from said first conductor by said dielectric layer, said solder channel communicating with an orifice;

a first set of electrodes for conducting a current through said first conductor in a first direction proximate to said solder channel; and

a second set of electrodes for conducting a current through said liquid solder in said solder channel in a direction opposite to said first direction,

said first conductor, said solder channel, and said orifice being arranged such that a sufficient electric current through said first conductor and a sufficient electric current through said liquid solder in said solder channel generate magnetic fields which force an amount of said solder through said orifice.

18. A solder drop ejector comprising:

an insulating substrate;

a first conductor located on a surface of said insulating substrate;

a dielectric layer located on said first conductor;

a second conductor insulated from said first conductor by said dielectric layer along a first portion of said second conductor and connected to said first conductor through said dielectric layer at a second portion of said second conductor, said second conductor having a degree of movement substantially perpendicular to a plane of said first conductor and said dielectric layer;

a solder channel, for containing liquid solder, located on said second portion of said second conductor, said solder channel communicating with an orifice;

a first electrode connected to said first conductor; and

a second electrode connected to said second conductor,

said first conductor, said second conductor, said solder channel, and said orifice being arranged such that a sufficient electric current through said first conductor and said second conductor generates magnetic fields which flex said second conductor in a direction toward said orifice to force an amount of said solder through said orifice.

19. The ejector of claim 18 wherein said dielectric layer is laminated onto said first conductor.

20. The ejector of claim 18 wherein said dielectric layer is air.

21. The ejector of claim 18 wherein said substrate has an opening for allowing air to gain access to a gap between said first conductor and said second conductor, and wherein said dielectric layer is air.