Pattern shifting laser cutter

• US 5,780,805 A
• Filed: 05/03/1995
• Issued: 07/14/1998
• Est. Priority Date: 05/03/1995
• Status: Expired due to Fees

• Current Assignee: Gerber Garment Technology, Inc. (Lectra SA)
• Original Assignee: Gerber Garment Technology, Inc. (Lectra SA)
• Inventors: Silverglate, Michael I., Duncan, Marvin H. Jr.
• Primary Examiner(s): Paschall, Mark H.
• Application Number:
  US08/433,704
• Time in Patent Office: 1,168 Days
• Field of Search: 219/121.67, 219/121.68, 219/121.72, 219/121.78, 219/121.79, 219/121.81, 219/121.85, 364/470, 364/474.08
• US Class Current: 219/121.68
• CPC Class Codes: B08B 7/0042 by laser
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence

Abstract

A method and apparatus for cleaning a support surface during successive cuts of a sheet material along a common cutting path by a laser. The method includes offsetting the location of the common cutting path with respect to the support surface for subsequent cuts. The offset distance is sufficient to align a portion of the common cutting path with a portion of the ridge of debris formed during a previous cut such that upon tracing the subsequent path with the laser, the previously formed ridge of debris is ablated.

Claims

1. A method of ablating debris from a support surface during repeated cuttings of segments of a material along a common cutting path, comprising:

(a) positioning the common cutting path in a first position with respect to the support surface;

(b) directing a laser along the common cutting path in a first cutting to cut a first segment of the material and form a first adjacent debris ridge;

(c) disposing a second segment of the sheet material on the support surface; and

(d) displacing the common cutting path for a second cutting to a second position positioned over a portion of the first adjacent debris ridge such that upon directing the laser along the portion of the common cutting path in the second cutting, the laser penetrates the second segment of the sheet material and contacts the portion of the first adjacent debris ridge to substantially ablate the debris.

2. The method of claim 1, wherein displacing the common cutting path includes repeatedly displacing the cutting path so that a point thereon traverses along a closed loop.

3. The method of claim 2, wherein displacing the common cutting path includes displacing the cutting path so that a point thereon traverses a circle.

4. The method claim 3, further comprising displacing the common path by a segment length of approximately 1/4, 1/8, 1/6 of a circle.

5. A method of ablating a ridge of laser ablation debris from a prior cutting of a sheet material during a subsequent cutting of sheet material with a laser on a support surface, comprising:

(a) displacing the common cutting path from a first position in the prior cutting along the common cutting path to a second position to substantially align a portion of the common cutting path in the second position with a portion of the ridge of laser ablation debris formed in the prior cutting, such that upon directing the laser along the portion of the common cutting path in the second position, the laser penetrates the sheet material and contacts the portion of the ridge of laser ablation debris.

6. A method of ablating a ridge of debris on a support surface from a prior laser cutting of a first segment of sheet material during a subsequent cutting of a second segment of sheet material on the support surface along a second path with a laser, comprising:

(a) aligning a portion of the second path with the debris from the prior laser cutting, such that upon directing the laser along the length of the second path, the laser penetrates the sheet material and ablates the portion of the ridge of debris.