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Hybrid optical integration assembly using optical platform

  • US 5,780,875 A
  • Filed: 08/29/1996
  • Issued: 07/14/1998
  • Est. Priority Date: 08/30/1995
  • Status: Expired due to Fees
First Claim
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1. An optical assembly, comprising:

  • a semiconductor substrate;

    a semiconductor light emitting element mounted on said semiconductor substrate; and

    a semiconductor light receiving element mounted on said semiconductor substrate,wherein said semiconductor light emitting element is mounted on said semiconductor substrate directly or through a thin film layer,said semiconductor light receiving element is mounted on said semiconductor substrate through a dielectric layer,said semiconductor substrate includes an optical waveguide formed thereon, said optical waveguide having said dielectric layer,wherein a material inserted between said semiconductor light receiving element and said semiconductor substrate has a thickness which is greater than the thickness of a material inserted between said semiconductor light emitting element and said semiconductor substrate, andsaid optical waveguide has its optical axis adjusted to the optical axis of said semiconductor light emitting element, and said optical waveguide has its optical axis adjusted to the optical axis of said semiconductor light receiving element.

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