Hybrid optical integration assembly using optical platform
First Claim
1. An optical assembly, comprising:
- a semiconductor substrate;
a semiconductor light emitting element mounted on said semiconductor substrate; and
a semiconductor light receiving element mounted on said semiconductor substrate,wherein said semiconductor light emitting element is mounted on said semiconductor substrate directly or through a thin film layer,said semiconductor light receiving element is mounted on said semiconductor substrate through a dielectric layer,said semiconductor substrate includes an optical waveguide formed thereon, said optical waveguide having said dielectric layer,wherein a material inserted between said semiconductor light receiving element and said semiconductor substrate has a thickness which is greater than the thickness of a material inserted between said semiconductor light emitting element and said semiconductor substrate, andsaid optical waveguide has its optical axis adjusted to the optical axis of said semiconductor light emitting element, and said optical waveguide has its optical axis adjusted to the optical axis of said semiconductor light receiving element.
1 Assignment
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Accused Products
Abstract
An optical assembly structure includes, a semiconductor element generating a large amount of heat and a high impedance optical element which are to be mounted, with low optical loss on the same semiconductor substrate which has an optical waveguide formed thereon.The element generating a large amount of heat is mounted on a terrace of the semiconductor substrate directly or through an insulating layer having a thickness of submicron order, while the high impedance element is mounted in a groove which is etched into the semiconductor substrate to such an extent that the optical axis of the high impedance element mates with the optical axis of the optical waveguide layer formed on a recess in the semiconductor substrate. The optical axes can be adjusted independently for the respective elements. Alternatively, with a potential on the semiconductor substrate set equal to a supply voltage or a ground potential, a crystal substrate for a forward biased heat generating element is given the polarity opposite to that of a crystal substrate for a reverse biased element which may imply a problem of stray capacitance.
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Citations
26 Claims
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1. An optical assembly, comprising:
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a semiconductor substrate; a semiconductor light emitting element mounted on said semiconductor substrate; and a semiconductor light receiving element mounted on said semiconductor substrate, wherein said semiconductor light emitting element is mounted on said semiconductor substrate directly or through a thin film layer, said semiconductor light receiving element is mounted on said semiconductor substrate through a dielectric layer, said semiconductor substrate includes an optical waveguide formed thereon, said optical waveguide having said dielectric layer, wherein a material inserted between said semiconductor light receiving element and said semiconductor substrate has a thickness which is greater than the thickness of a material inserted between said semiconductor light emitting element and said semiconductor substrate, and said optical waveguide has its optical axis adjusted to the optical axis of said semiconductor light emitting element, and said optical waveguide has its optical axis adjusted to the optical axis of said semiconductor light receiving element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An optical assembly, comprising:
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a semiconductor substrate; a semiconductor light emitting element mounted on said semiconductor substrate; and a semiconductor light receiving element mounted on said semiconductor substrate; wherein said semiconductor light emitting element is mounted on said semiconductor substrate directly or through a thin film layer, said semiconductor light receiving element is mounted on said semiconductor substrate directly or through a thin film layer, said semiconductor light emitting element is mounted to be biased in a forward direction, and said semiconductor light receiving element is mounted to be biased in a reverse direction, said semiconductor light emitting element and said semiconductor light receiving element are mounted so that signal lines for said semiconductor light emitting element and said semiconductor light receiving element are arranged at a side a distance from said semiconductor substrate, an optical waveguide having a dielectric layer is formed on said semiconductor substrate, and said optical waveguide has its optical axis adjusted to the optical axis of said semiconductor light emitting element, and said optical waveguide has its optical axis adjusted to the optical axis of said semiconductor light receiving element. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. An optical assembly comprising:
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a semiconductor substrate; a pre-amplifier element mounted on said semiconductor substrate; and a semiconductor light receiving element mounted on said semiconductor substrate, wherein said pre-amplifier element is mounted on said semiconductor substrate directly or through a thin film layer, said semiconductor light receiving element is mounted on said semiconductor substrate through a dielectric layer, wherein a material inserted between said semiconductor light receiving element and said semiconductor substrate has a thickness which is greater than the thickness of a material inserted between said pre-amplifier element and said semiconductor substrate, and said semiconductor substrate includes an optical waveguide formed thereon, said optical waveguide including said dielectric layer.
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24. An optical assembly, comprising:
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a semiconductor substrate; an element generating a large amount of heat mounted on said semiconductor substrate; and a high impedance optical element mounted on said semiconductor substrate, wherein said element generating a large amount of heat is mounted on said semiconductor substrate directly or through a thin film layer, said high impedance optical element is mounted on said semiconductor substrate through a dielectric layer, said semiconductor substrate includes an optical waveguide formed thereon, said optical waveguide including said dielectric layer, wherein a material inserted between said high impedance optical element and said semiconductor substrate has a thickness which is greater than the thickness of a material inserted between said element generating a large amount of heat and said semiconductor substrate, and said optical waveguide has its optical axis adjusted to the optical axis of said element generating a large amount of heat, and said optical waveguide has its optical axis adjusted to the optical axis of said high impedance optical element.
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25. An optical assembly, comprising:
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a semiconductor substrate; an element generating a large amount of heat mounted on said semiconductor substrate; and a high impedance optical element mounted on said semiconductor substrate, wherein said element generating a large amount of heat is mounted on said semiconductor substrate directly or through a thin film layer, said high impedance optical element is mounted on said semiconductor substrate directly or through a thin film layer, said element generating a large amount of heat is forward biased, and said high impedance optical element is reverse biased, said element generating a large amount of heat and said high impedance optical element are mounted so that signal lines for said element generating a large amount of heat and said high impedance optical element are arranged at a side a distance from said semiconductor substrate, an optical waveguide having a dielectric layer is formed on said semiconductor substrate, and said optical waveguide has its optical axis adjusted to the optical axis of said element generating a large amount of heat, and said optical waveguide has its optical axis adjusted to the optical axis of said high impedance optical element.
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26. An optical assembly, comprising:
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a semiconductor substrate; an element generating a large amount of heat mounted on said semiconductor substrate; and a high impedance optical element mounted on said semiconductor substrate, wherein said element generating a large amount of heat is mounted on said semiconductor substrate directly or through a thin film layer, said high impedance optical element is mounted on said semiconductor substrate through a dielectric layer, wherein a material inserted between said high impedance optical element and said semiconductor substrate has a thickness which is greater than the thickness of a material inserted between said element generating a large amount of heat and said semiconductor substrate, and said semiconductor substrate includes an optical waveguide formed thereon, said optical waveguide including said dielectric layer.
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Specification