Universal fixtureless test equipment
First Claim
1. A test equipment including at least one test area for testing the functionality of a workpiece placed in an arbitrary position and orientation on the test area, for contacting conductive elements of said workpiece, regardless of pitch and configurations of the conductive elements of the workpiece, the test area comprising:
- (a) a base plate;
(b) at least one test module mounted on said base plate, said test module having compressible means on a surface facing said base plate, such that when mounting said test module on said test plate, said compressible means lies between said test module and said base plate, said test module including;
(1) at least one semiconductor die, said die including integrated electronic circuitry including an array of selectable memorized switching cells, each said switching cell terminated by a conductive terminal pad, said conductive terminal pad functioning as an input/output contact, said terminal pads matrixed on a surface of said semiconductor die, such die having said electronic circuitry integrated in the remainder area unoccupied by said pads, said terminal pads having bumps of conductive material at ends of said terminal pads;
(2) a plurality of conductors for use as test electrodes, arrayed in a parallel manner such as to produce a 3-dimensional multi-electrode adapter/pitch translator, having first and second conductive cross-section surfaces, first ends of said electrodes on first surface of said adapter/pitch translator being matrixed and pitched to correspond to said bumped terminal pads of said semiconductor die, second ends of said electrodes on said second surface of said adapter/pitch translator being pitched and matrixed such as to guarantee that each conductive element of the workpiece will be contacted by at least one test electrode for any arbitrary positioning angle of the workpiece on the test area; and
,(3) said bumped semiconductor die, being flipped and permanently mounted on a corresponding conductive cross-section surface of said adapter/pitch translator such that each bumped pad of said die is in direct contact with a corresponding test electrode of said adapter/pitch translator,whereby each test electrode is connected to a selectable memorized switching cell of the semiconductor die.
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Accused Products
Abstract
A universal, fixtureless automatic test equipment is provided, capable of accessing opposite surfaces of any workpiece, simultaneously, for functionality testing. The workpiece can be freely placed anywhere on the test area, regardless of orientation, without the need for pre-test registration, alignment, or any kind of securing means. The test area of a universal fixtureless automatic test equipment, according to the teachings of the present invention, is made up of Independent Test Modules (ITMs). A test area may be configured from any number of ITMs, as desired. The ITMs can be individually selected for testing various functions of a respective section of a workpiece under test, and for independent electrical functioning. A typical ITM is made up of a plurality of semiconductor dies. Dies are similarly structured with matrices of selectable memorized bidirectional switching cells. Each switching cell is connected to a terminal-pad on the surface of the die. The terminal-pads extend to a test mattress of highly dense, compressible micronic bumps by means of a Adapter/Pitch Translator. These bumps function as independent test electrodes and are dimensioned to provide two positive features: to guarantee that each tested element on a workpiece corresponds with at least two of the test electrodes, and that the test electrodes are dimensioned to prevent shortages between adjacent pairs of tested elements.
36 Citations
21 Claims
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1. A test equipment including at least one test area for testing the functionality of a workpiece placed in an arbitrary position and orientation on the test area, for contacting conductive elements of said workpiece, regardless of pitch and configurations of the conductive elements of the workpiece, the test area comprising:
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(a) a base plate; (b) at least one test module mounted on said base plate, said test module having compressible means on a surface facing said base plate, such that when mounting said test module on said test plate, said compressible means lies between said test module and said base plate, said test module including; (1) at least one semiconductor die, said die including integrated electronic circuitry including an array of selectable memorized switching cells, each said switching cell terminated by a conductive terminal pad, said conductive terminal pad functioning as an input/output contact, said terminal pads matrixed on a surface of said semiconductor die, such die having said electronic circuitry integrated in the remainder area unoccupied by said pads, said terminal pads having bumps of conductive material at ends of said terminal pads; (2) a plurality of conductors for use as test electrodes, arrayed in a parallel manner such as to produce a 3-dimensional multi-electrode adapter/pitch translator, having first and second conductive cross-section surfaces, first ends of said electrodes on first surface of said adapter/pitch translator being matrixed and pitched to correspond to said bumped terminal pads of said semiconductor die, second ends of said electrodes on said second surface of said adapter/pitch translator being pitched and matrixed such as to guarantee that each conductive element of the workpiece will be contacted by at least one test electrode for any arbitrary positioning angle of the workpiece on the test area; and
,(3) said bumped semiconductor die, being flipped and permanently mounted on a corresponding conductive cross-section surface of said adapter/pitch translator such that each bumped pad of said die is in direct contact with a corresponding test electrode of said adapter/pitch translator, whereby each test electrode is connected to a selectable memorized switching cell of the semiconductor die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification