Ignition coil driver module

• US 5,781,047 A
• Filed: 05/27/1997
• Issued: 07/14/1998
• Est. Priority Date: 07/31/1995
• Status: Expired due to Term

• Current Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Original Assignee: Delco Electronics Corporation (Motors Liquidation Co. GUC Trust)
• Inventors: Wilkinson, Lester, Shreve, John Robert
• Primary Examiner(s): Callahan, Timothy P.
• Assistant Examiner(s): KIM, JUNG H
• Application Number:
  US08/863,173
• Time in Patent Office: 413 Days
• Field of Search: 327/110, 327/478, 327/565, 323/266, 323/311, 323/265
• US Class Current: 327/110
• CPC Class Codes: F02P 3/053 using digital techniques
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49112 the connectors connecting a common bonding area on the semiconductor or solid-state body to different bonding areas outside the body, e.g. diverging wires
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12035 Zener diode
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/1306 Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H03K 17/0828 in composite switches
• CPC Class Codes: H03K 17/567 Circuits characterised by the use of more than one type of semiconductor device, e.g. BIMOS, composite devices such as IGBT

Abstract

The ignition coil driver module of the present invention includes a control integrated circuit and a high current load driver integrated circuit housed within a common package such as a TO-247 or TO-264 package. The control integrated circuit is formed of a semiconductor material manufactured in accordance with a standard low-voltage integrated circuit processing technology and is responsive to a control signal input to provide a low voltage drive signal. The high current load driver integrated circuit is formed of a semiconductor material manufactured in accordance with a high-voltage integrated circuit processing technology and is responsive to the low voltage drive signal to energize the high current load. A current limit function is further provided for limiting the load current to a predetermined level.

Claims

1. A high current load driver module comprising:

a control circuit responsive to a low voltage control signal to provide a low voltage drive signal, said control circuit formed of a low voltage semiconductor material arranged as a first integrated circuit;

a high current load driver circuit responsive to said low voltage drive signal to energize a high current load, said high current load driver circuit formed of a high voltage semiconductor material arranged as a second integrated circuit separate from said first integrated circuit; and

a housing having a first terminal extending therein and forming an integrated circuit mount within said housing, said first integrated circuit having a substrate attached to said mount yet electrically insulated therefrom via an electrically insulating circuit mount medium separate from said integrated circuit mount, said second integrated circuit having a substrate attached and electrically connected to said mount via an electrically conductive circuit mount medium separate from said integrated circuit mount.

3. The high current load driver module of claim 1 wherein said housing includes a second terminal extending therein and electrically connected to said first integrated circuit, said second terminal receiving the low voltage control signal thereat and providing the low voltage control signal to said control circuit.

4. The high current load driver module of claim 3 wherein said first terminal is adapted for connection to the high current load to thereby provide a load current path from the high current load through said high current load drive circuit.

5. The high current load driver module of claim 4 wherein said housing includes a third terminal extending therein and electrically connected to each of said first and second integrated circuits, said third terminal adapted for connection to a high current load drive module ground reference for providing a ground potential reference thereto.

6. The high current load driver module of claim 1 wherein said integrated circuit mount is electrically connected to said substrate of said second integrated circuit via attachment of said second integrated circuit to said mount.

7. The high current load driver module of claim 6 wherein said second integrated circuit substrate is attached to said mount by solder attachment,

and wherein said mount further acts as a heat sink to thereby dissipate heat generated by said high current load driver circuit.

8. The high current load driver module of claim 7 wherein said first integrated circuit substrate is attached to said mount via an electrically insulating attachment medium.

9. The high current load driver module of claim 1 wherein said high current load driver circuit includes a power transistor, said power transistor having a first input for receiving said low voltage drive signal, a second input for receiving a load current from the high current load, and an output, said power transistor conducting said load current from said second input to said output in response to said low voltage drive signal.

10. The high current load driver module of claim 9 wherein said power transistor is an insulated gate bipolar transistor.

11. The high current load driver module of claim 1 wherein said high current load is an inductive load.

12. The high current load driver module of claim 11 wherein said inductive load is a primary coil of an ignition coil for an internal combustion engine.

13. The high current load driver module of claim 1 wherein said low voltage drive signal provided by said control circuit has a maximum voltage of approximately 7.0 volts.

14. The high current load driver module of claim 13 wherein said high current load driver circuit is operable to drive the high current load having a load current associated therewith within a range of between approximately 500 milliamperes to approximately 20 amperes.

2. A high current load driver module comprising:

a low voltage integrated circuit responsive to a low voltage control signal to simultaneously derive all electrical power needed to power said low voltage integrated circuit from said control signal and produce a low voltage drive signal corresponding thereto;

a high current integrated circuit separate from said low voltage integrated circuit and responsive to said low voltage drive signal to energize a high current load; and

a housing having said low voltage and high current integrated circuits mounted therein.

15. The high current load driver module of claim 2 wherein said low voltage drive signal provided by said low voltage integrated circuit has a maximum voltage of approximately 7.0 volts.

16. The high current load driver module of claim 15 wherein said high current integrated circuit is operable to drive the high current load having a load current associated therewith within a range of between approximately 500 milliamperes and approximately 20 amperes.

17. The high current load driver module of claim 16 wherein said high current integrated circuit includes a power transistor having an input terminal connected to said low voltage drive signal of said low voltage integrated circuit, said low voltage drive signal providing a low level drive current to said input terminal of said power transistor to thereby turn on said power transistor to full conduction.

18. The high current load driver module of claim 17 wherein said low level of input current is within a range of between approximately 200 micro amperes to approximately 3.0 milliamperes.

19. The high current load driver module of claim 18 wherein said power transistor is an insulated gate bipolar transistor.

20. The high current load driver module of claim 2 wherein said high current load is an inductive load.

21. The high current load driver module of claim 20 wherein said inductive load is a primary coil of an ignition coil for an internal combustion engine.

22. The high current load driver module of claim 2 further including a plurality of electrical conductors extending into said housing and forming an electrical connection with said low voltage integrated circuit and said high current integrated circuit.

23. The high current load driver module of claim 2 wherein said low voltage integrated circuit is formed of a low voltage semiconductor material.

24. The high current load driver module of claim 23 wherein said high current integrated circuit is formed of a high voltage semiconductor material.