Heat dissipating lid hinge structure with laterally offset heat pipe end portions

• US 5,781,409 A
• Filed: 12/19/1996
• Issued: 07/14/1998
• Est. Priority Date: 12/19/1996
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Compaq Computer Corporation (HP Inc.)
• Inventors: Mecredy, Henry E. III
• Primary Examiner(s): Phillips, Michael W.
• Application Number:
  US08/769,795
• Time in Patent Office: 572 Days
• Field of Search: 16/223, 16/342, 364/708.1, 174/15.2, 165/80.4, 165/104.29, 165/104.33, 361/687, 361/680, 361/681, 361/699, 361/700, 361/704, 361/707, 62/259.2
• US Class Current: 361/679.27
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: G06F 1/1616 with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
• CPC Class Codes: G06F 1/1681 Details related solely to hinges hinge details related to the transmission of signals or power are classified in G06F1/1683
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A notebook computer display housing is pivotally connected to its associated CPU housing by a heat dissipating hinge structure having telescoped, relatively rotatable first and second sections respectively anchored to the CPU and display housings. The heat absorbing evaporation end of a first thermosyphoning heat pipe is conductively connected to a heat generating electronic component within the CPU housing, with the heat rejecting condensing end of the heat pipe defining the first hinge structure section. During computer operation, heat from the electronic component is sequentially transferred through the heat pipe and the second hinge structure section, in which the first hinge section is journaled, to the display housing for dissipation therefrom to ambient. Heat transfer from the second hinge structure section to the display housing is representatively facilitated by a second thermosyphoning heat pipe having an evaporator end received in an opening in the second hinge structure section, and laterally offset from the condensing end of the first heat pipe, and a condensing end thermally communicated with the display housing.

Claims

1. Electronic apparatus comprising:

a housing having first and second portions;

a heat generating component carried in said first housing portion;

a first heat pipe carried within said first housing portion and having a first end thermally coupled to said heat generating component, and a second end;

a second heat pipe carried within said second housing portion and having a first end thermally coupled to said second housing portion, and a second end; and

a hinge structure interconnecting said first and second housing portions for pivotal movement relative to one another, said hinge structure including;

a heat conductive first hinge section anchored to one of said first and second housing portions and connected to the second end of one of said first and second heat pipes in a heat exchange relationship therewith, and

a heat conductive second hinge section defined by the second end of the other of said first and second heat pipes and journaled within said first hinge section, in a heat exchange relationship therewith, and thereby forming an integral portion of said hinge structure.

2. The electronic apparatus of claim 1 wherein:

said electronic apparatus is a portable computer.

3. The electronic apparatus of claim 2 wherein:

said portable computer is a notebook computer.

4. The electronic apparatus of claim 1 wherein:

said first hinge section is anchored to said second housing portion,

said first end of said first heat pipe is an evaporation end thereof, and

said second end of said first heat pipe is journaled in said first hinge section.

5. The electronic apparatus of claim 4 wherein:

the second end of said second heat pipe is received within said first hinge section.

6. A heat dissipating hinge structure comprising:

a first heat pipe having an end portion extending along an axis and defining a first hinge structure section;

a second hinge structure section formed of a heat conductive material, said second hinge structure section rotatably receiving said first hinge structure section and being in a heat conductive relationship therewith; and

a second heat pipe having an end portion secured to said second hinge structure section at a location laterally offset from said axis, in a heat conductive relationship therewith, for rotation with said second hinge structure section relative to said first hinge structure section about said axis.

7. The heat dissipating hinge structure of claim 6 wherein:

said end portion of said first heat pipe is a condensing end portion thereof.

8. The heat dissipating hinge structure of claim 6 wherein:

said second hinge section has a generally cylindrical passage therein which receives said end portion of said first heat pipe and has an interior side surface with a coefficient of friction and lined with a frictional material having a coefficient of friction greater than that of said interior side surface, and

said end portion of said first heat pipe has an exterior side surface having a coefficient of friction and being covered with a frictional material having a coefficient of friction greater than that of said exterior side surface and being frictionally but releasably engaged by said frictional material on said interior side surface of said second hinge section.

9. The heat dissipating hinge structure of claim 8 wherein:

said second hinge section and the outer wall portion of said first heat pipe are formed from copper, and each of said frictional materials is formed from a harder metal material.

10. A portable computer comprising:

a CPU housing;

a heat generating component in said CPU housing;

a display housing;

a hinge section secured to said display housing in a heat transfer relationship therewith;

a first heat pipe operative to transfer heat from said component to said hinge section and thus to said display housing for dissipation therefrom,

said first heat pipe having an evaporating end portion thermally communicated with said component to receive operating heat therefrom, and a condensing end portion journaled in said hinge section to permit said display housing to pivot about said condensing end portion relative to said CPU housing; and

a second heat pipe having an evaporating end portion in heat transfer communication with said hinge section, and a condensing end portion in heat transfer communication with said display housing,

said hinge section having a first generally cylindrical passage therein which receives said condensing end portion of said first heat pipe, and a second generally cylindrical passage therein which receives said evaporating end of said second heat pipe.

11. The portable computer of claim 10 wherein:

said portable computer is a notebook computer.

12. The portable computer of claim 10 wherein:

said heat generating component is a processor.

13. The portable computer of claim 10 wherein:

said condensing end portion of said first heat pipe and said hinge section form a friction hinge structure.

14. The portable computer of claim 13 wherein:

said display housing has an outer wall portion, with an inner side surface,

said portable computer further comprises a metallic heat transfer member positioned against said inner side surface in a spaced relationship with said hinge section, and

said condensing end portion of said second heat pipe is in contact with said heat transfer member.

15. The portable computer of claim 13 wherein:

said display housing has a display screen with a metallic frame, and

said condensing end portion of said second heat pipe is in contact with said metallic frame.

16. The portable computer of claim 13 wherein:

said display housing has a metallic EMI shield member therein, and

said condensing end portion of said second heat pipe is in contact with said EMI shield member.

17. The portable computer of claim 10 wherein:

said portable computer further comprises a metallic heat transfer member sandwiched between and in heat conductive contact with said heat generating component and said evaporating end portion of said first heat pipe.

18. The portable computer of claim 17 wherein:

said heat generating component is a processor.

19. The portable computer of claim 10 wherein:

said first and second passages are parallel to one another.

20. The portable computer of claim 10 wherein:

said hinge section has a generally cylindrical passage therein which receives said condensing end portion of said first heat pipe and has an interior side surface with a coefficient of friction and lined with a frictional material having a coefficient of friction greater than that of said interior side surface, and

said condensing end portion of said first pipe has an exterior side surface having a coefficient of friction and being covered with a frictional material having a coefficient of friction greater than that of said exterior side surface and being frictionally but releasably engaged by said frictional material on said interior side surface of said hinge section.

21. The portable computer of claim 20 wherein:

said hinge section and the outer wall portion of said first heat pipe are formed from copper, and each of said frictional materials is formed from a harder metallic material.