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Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size

  • US 5,781,412 A
  • Filed: 11/22/1996
  • Issued: 07/14/1998
  • Est. Priority Date: 11/22/1996
  • Status: Expired due to Term
First Claim
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1. A method of conductively cooling a heat-generating electronic component disposable in spaced-apart adjacency with a surface of a thermal dissipation member to define a gap of a predetermined width therebetween, said method comprising the steps of:

  • (a) providing a curable, fluent composition comprising an electrically-insulating polymeric binder having thermally-conductive, electrically-insulating filler particles dispersed therein, said particles having a thermal conductivity of between about 25-50 W/m-K and at least a portion thereof being of a maximum average diameter about equal to the predetermined width of the gap;

    (b) providing a layer of said composition disposable in conductive heat transfer contact with the electronic component and the surface of the thermal dissipation member; and

    (c) curing said layer of said composition to form an interlayer within the gap having a continuous phase of said binder and a dispersed phase of said filler particles, at least a portion of said filler particles of said maximum average diameter each substantially directly contacting the electronic component and the surface of the thermal dissipation member to establish thermally- conductive pathways effective to transfer heat from the electronic component to the heat dissipation member.

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