Covered microchannels and the microfabrication thereof

• US 5,783,452 A
• Filed: 02/02/1996
• Issued: 07/21/1998
• Est. Priority Date: 02/02/1996
• Status: Expired due to Fees

• Current Assignee: Washington University In St Louis
• Original Assignee: University of Washington
• Inventors: Jons, Steve D., Hu, Ing-Fen, O'Connor, Paul J.
• Primary Examiner(s): Baxter, Janet C.
• Assistant Examiner(s): ASHTON, ROSEMARY E
• Application Number:
  US08/595,683
• Time in Patent Office: 900 Days
• Field of Search: 427/489, 430/312, 430/272.1, 436/161, 436/183, 422/89, 422/70
• US Class Current: 436/183
• CPC Class Codes: G01N 27/44791 Microapparatus sample containers with integrated microfluidic structures B01L3/5027
• CPC Class Codes: G01N 30/6095 Micromachined or nanomachined, e.g. micro- or nanosize
• CPC Class Codes: G03F 7/0035 Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface

Abstract

The present invention is a covered microchannel comprising: a) a substrate; b) an etched material adhered to the substrate; and c) a silicon-carbon material adhered to the etched material in such a manner to form a covered microchannel; wherein the silicon-carbon material comprises SiO₁.8-2.4 C₀.3-1.0 and H₀.7-4.0 containing at least one of the following functional groups:

--Si--O--Si--, --Si--CH.sub.2 --, --Si--H, or --Si--OH.

The covered microchannel can be prepared by the steps of: a) coating a filler material onto a substrate having a groove, wherein the filler material covering the substrate fills the groove; b) removing filler material from the substrate but not from the groove; c) coating the substrate and the filler with an adhering, formable, capping material; and d) removing the filler from the groove. An etched laminate can also be used to prepare the covered microchannel.

The present invention provides a covered microchannel that can be prepared under milder conditions than those previously contemplated, thereby allowing greater flexibility in the choice of material of the substrate. The covered microchannel can be used, for example, in micro-liquid or micro-gas chromatographic or electrophoretic applications.

Claims

1. A method of preparing a covered microchannel comprising the steps of:

a) coating a filler material onto a laminate which comprises a substrate having adhered thereto an etchable material having a groove, so that the filler material covers the etchable material and fills the groove;

b) removing filler material from the etchable material but not from the groove;

c) coating the etchable material and the filler material remaining in the groove with an adhering, formable, capping material to form a capped laminate;

d) uncovering the filler material that remains in the groove at both ends of the groove; and

e) removing the filler from the groove with a solvent for the filler, so that the capping material and the etchable material form the covered microchannel.

2. The method of claim 1 wherein in step (a), the filler material is a photoactive material or a wax.

3. The method of claim 2 wherein the filler material is a photoactive material.

4. The method of claim 2 wherein in step (c), the adhering, formable, capping material is a resin;

a metal capable of being laminated by electroplating, vapor deposition or sputtering;

or an organosilicone compound deposited onto the substrate by plasma-enhanced chemical vapor deposition.

5. The method of claim 4 wherein the adhering, formable, capping material is an epoxy resin, an acrylic resin, an unsaturated polyester resin, a polyurethane resin, a diglycol dialkyl carbonate resin, a polyimide resin, a melamine resin, a phenolic resin, a urea resin, or a benzocyclobutene resin.

6. The method of claim 4 wherein the adhering, formable, capping material is copper, silver, gold, nickel, chromium, tin, lead, zinc, aluminum, or titanium.

7. The method of claim 6 wherein the adhering, formable, capping material is copper or aluminum.

8. The method of claim 4 wherein the adhering, formable, capping material comprises a silicon-carbon material of SiO₁.8-2.4 C₀.3-1.0 and H₀.7-4.0 containing at least one of the following functional groups:

space="preserve" listing-type="equation">--Si--O--Si--, --Si--CH.sub.2 --, --Si--H, or --Si--OH.