Method for bonding compounds semiconductor wafers to create an ohmic interface
First Claim
1. A method for bonding at least two semiconductor surfaces to form a bonded interface that exhibits low electrical resistance with a minimal accompanying voltage drop, at least one of the surfaces being bonded comprising a compound semiconductor, the two surfaces having similar doping types, the method comprising the steps of:
- heating the two semiconductor surfaces;
aligning the surface orientation of the two semiconductor surfaces;
aligning the rotational alignment of the two semiconductor surfaces; and
applying uniaxial pressure to the heated, oriented and aligned surfaces.
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Accused Products
Abstract
A method for forming an ohmic interface between unipolar (isotype) compound semiconductor wafers without a metallic interlayer and the semiconductor devices formed with these ohmic interfaces are disclosed. The ohmic interface is formed by simultaneously matching the crystallographic orientation of the wafer surfaces and the rotational alignment within the surfaces of the two wafers and then subjecting them to applied uniaxial pressure under high temperatures to form the bonded ohmic interface. Such an ohmic interface is required for the practical implementation of devices wherein electrical current is passed from one bonded wafer to another.
75 Citations
15 Claims
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1. A method for bonding at least two semiconductor surfaces to form a bonded interface that exhibits low electrical resistance with a minimal accompanying voltage drop, at least one of the surfaces being bonded comprising a compound semiconductor, the two surfaces having similar doping types, the method comprising the steps of:
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heating the two semiconductor surfaces; aligning the surface orientation of the two semiconductor surfaces; aligning the rotational alignment of the two semiconductor surfaces; and applying uniaxial pressure to the heated, oriented and aligned surfaces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification