Composition of epoxy group-containing cycloolefin resin

• US 5,783,639 A
• Filed: 01/13/1997
• Issued: 07/21/1998
• Est. Priority Date: 03/14/1994
• Status: Expired due to Fees

• Current Assignee: Fujitsu Limited, Nipon Zeon Co., Ltd.
• Original Assignee: Fujitsu Limited, Nipon Zeon Co., Ltd.
• Inventors: Mizutani, Daisuke, Yoneda, Yasuhiro, Yokouchi, Kishio, Ishizuki, Yoshikatsu, Kataoka, Hideaki, Yamamoto, Masahide, Kamiya, Shigemitsu, Yuda, Eiko
• Primary Examiner(s): Sellers, Robert E.
• Application Number:
  US08/781,385
• Time in Patent Office: 554 Days
• Field of Search: 525/332.1, 525/286, 522/65, 522/68, 522/149
• US Class Current: 525/286
• CPC Class Codes: C08F 255/08 on to polymers of olefins having four or more carbon atoms
• CPC Class Codes: C08F 283/14 on to polymers obtained by ring-opening polymerisation of carbocyclic compounds having one or more carbon-to-carbon double bonds in the carbocyclic ring, i.e. polyalkeneamers C08F283/004 takes precedence
• CPC Class Codes: C08G 59/027 obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
• CPC Class Codes: C08G 59/3218 Carbocyclic compounds
• CPC Class Codes: C08G 61/08 of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C08L 51/00 Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds for ABS polymers C08L55/02; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 51/06 grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
• CPC Class Codes: C08L 51/08 grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
• CPC Class Codes: G03F 7/0045 with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
• CPC Class Codes: G03F 7/0125 characterised by the polymeric binder or the macromolecular additives other than the macromolecular azides
• CPC Class Codes: G03F 7/038 Macromolecular compounds which are rendered insoluble or differentially wettable G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021
• CPC Class Codes: H01B 3/40 epoxy resins
• CPC Class Codes: H01B 3/441 from alkenes
• CPC Class Codes: H05K 3/285 Permanent coating compositions
• CPC Class Codes: H05K 3/4676 Single layer compositions
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/31663 As siloxane, silicone or silane

Abstract

A resin composition comprising an epoxy group-containing cycloolefin resin and a crosslinking agent is provided. More specifically, a resin composition comprising an epoxy group-containing thermoplastic norbornene resin obtained by introducing epoxy groups into a thermoplastic norbornene resin, and as the crosslinking agent, a curing agent for epoxy resins or a photoreactive substance is provided. The resin composition is suitable for use as an insulating material.

Claims

1. A resin composition comprising:

a) 100 parts by weight of an epoxy group containing thermoplastic norbornene resin obtained by subjecting a thermoplastic norbornene resin to a graft reaction with an epoxy group containing unsaturated monomer, and

b) 0.1-30 parts by weight of a cross-linking agent composed of a photoreactive substance,

wherein the thermoplastic norbornene resin is a hydrogenated product of a ring-opening (co)polymer obtained by the ring-opening (co)polymerization of at least one norborene monomer.

2. The resin composition according to claim 1, wherein the thermoplastic norbornene resin is a hydrogenated product of a ring-opening polymer of dimethanooctahydronaphthalenes.

3. The resin composition according to claim 1, wherein the thermoplastic norbornene resin is a hydrogenated product of a ring-opening copolymer of dimethanooctahydronaphthalenes and dicyclopentadiene.

4. The resin composition according to claim 1, wherein the epoxy group containing thermoplastic norbornene resin has a number average molecular weight of 5×

10³ to 200×

10³ (value measured by GPC analysis making use of cyclohexane as a solvent).

5. The resin composition according to claim 1, wherein the epoxy group containing thermoplastic norbornene resin contains epoxy groups in a proportion of 0.05-5 wt. % on the basis of the weight of oxygen in the epoxy groups.

6. The resin composition according to claim 1, wherein the epoxy group containing unsaturated monomer is selected from the group consisting of unsaturated monoglycidyl esters, mono- or polyglycidyl ethers of unsaturated polycarboxylic acids, unsaturated glycidyl ethers, alkylene oxide group containing unsaturated monomers, glycidyl group containing aromatic vinyl compounds, epoxy group containing alkene monomers and epoxy group containing cyclic unsaturated monomers.

7. The resin composition according to claim 1, wherein the photoreactive substance is a compound selected from the group consisting of aromatic bisazide compounds, photo-induced amine generators and photo-induced acid generators.