Semiconductor sensor including protective resin package

• US 5,783,748 A
• Filed: 01/02/1996
• Issued: 07/21/1998
• Est. Priority Date: 02/28/1995
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Otani, Hiroshi
• Primary Examiner(s): Oda, Christine K.
• Application Number:
  US08/582,055
• Time in Patent Office: 931 Days
• Field of Search: 73/574.16, 73/493, 73/431, 73/866.5, 73/754, 73/727, 73/706, 73/756, 73/726
• US Class Current: 73/493
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/142 Multiple part housings
• CPC Class Codes: G01L 19/148 Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
• CPC Class Codes: G01P 1/02 Housings
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/08 with conversion into electric or magnetic values
• CPC Class Codes: G01P 2015/0828 the mass being of the paddle type being suspended at one of its longitudinal ends
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A semiconductor sensor provided with a planar circuit board and a resin package for protecting the circuit board. Further, a sensing element is mounted on the circuit board and outer electrodes are attached to a side edge portion of the circuit board. Moreover, includes the resin package, a groove, in which the circuit board is disposed. Thus the semiconductor sensor can be easily fabricated. Consequently, the manufacturing cost of a product or sensor can be reduced.

Claims

1. A semiconductor sensor and resin package comprising:

a semiconductor sensor including a planar circuit board having edges, a sensing element mounted on the circuit board, and outer electrodes attached to one of the edges of the circuit board and extending outwardly from the circuit board;

a resin package protecting the sensing element, the resin package having a groove in which the edges of the circuit board are disposed, the groove including opposing projections for contacting and restraining the edges of the circuit board; and

a metallic cap fitted onto the resin package and covering at least part of the resin package, the resin package having a sealing groove receiving edges of the metallic cap.

2. The semiconductor sensor and resin package according to claim 1, wherein the metallic cap has a disengagement preventing portion for releasably engaging the resin package.

3. The semiconductor sensor and resin package according to claim 1, wherein the metallic cap has mounting projections.

4. The semiconductor sensor and resin package according to claim 1, wherein the resin package includes holes through which the respective outer electrodes extend.

7. The semiconductor sensor and resin package according to claim 2, wherein the resin package has a sealing groove receiving edges of the metallic cap.

5. A semiconductor sensor and resin package comprising:

a semiconductor sensor including a planar circuit board having edges, a sensing element mounted on the circuit board, and outer electrodes attached to one of the edges of the circuit board and extending outwardly from the circuit board; and

a resin package protecting the sensing element, the resin package having a groove in which the edges of the circuit board are disposed, the groove including opposing projections for contacting and restraining the edges of the circuit board, the resin package and the groove being U-shaped and receiving at least two edges of the circuit board.

6. The semiconductor sensor and resin package according to claim 5, comprising a metallic cap fitted onto the resin package and covering at least part of the resin package.

8. The semiconductor sensor and resin package according to claim 5, wherein the resin package has a mounting projection.

9. The semiconductor sensor and resin package according to claim 8, wherein the mounting projection has a hole for receiving a screw.

10. A semiconductor sensor and resin package comprising:

a semiconductor sensor including a planar circuit board having opposed first and second sides and edges, a sensing element mounted on the first side of the circuit board, and outer electrodes attached to one of the edges of the circuit board and extending outwardly from the circuit board;

a plate abutting and covering the second side of the circuit board for protecting the circuit board; and

a flexible resin package protecting the sensing element, the resin package including a concavity in which the sensing element is housed and including opposed grooves in which opposed edges of the circuit board and the plate are disposed, each of the grooves including a respective hook-like projection for retaining edges of the plate.

11. The semiconductor sensor and resin package according to claim 10, wherein the resin package includes a hole communicating with the concavity.

12. The semiconductor sensor and resin package according to claim 10, comprising a sealing component disposed between the circuit board and the resin package.

13. The semiconductor sensor and resin package according to claim 10, wherein the resin package includes an opening through which the outer electrodes project.

14. The semiconductor sensor and resin package according to claim 10, comprising a sealing component disposed between the circuit board and the plate for sealing the circuit board to the plate.

15. The semiconductor sensor and resin package according to claim 10, including a hole extending through the plate and the circuit board in communication with the concavity.

16. The semiconductor sensor and resin package according to claim 10, wherein the plate includes a concavity for housing the sensing element.