Integrated circuit package

• US 5,783,857 A
• Filed: 07/25/1996
• Issued: 07/21/1998
• Est. Priority Date: 07/25/1996
• Status: Expired due to Fees

• Current Assignee: The Whitaker Corporation (Meggitt PLC)
• Original Assignee: The Whitaker Corporation (Meggitt PLC)
• Inventors: Sletten, Robert John, Ziegner, Bernhard Alphonso
• Primary Examiner(s): Saadat, Mahshid D.
• Assistant Examiner(s): CLARK, SHEILA V
• Application Number:
  US08/690,418
• Time in Patent Office: 726 Days
• Field of Search: 257/664, 257/728, 257/698, 257/700
• US Class Current: 257/664
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/49555 the bent parts being the outer leads
• CPC Class Codes: H01L 23/49558 Insulating layers on lead frames, e.g. bridging members
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

An IC package appropriate for microwave devices, integrated circuits, multichip modules, and hybrid circuit assemblies and power devices comprises an outer interconnect (2) and an inner interconnect (3). Lead lines (8) on an outer interconnect (2) are in electric engagement with respective access lines (13) on an inner interconnect (3). Contacts (21) of an IC are electrically interconnected with the access lines (13) on the inner interconnect (3). A package according to the teachings of the present invention provides for efficient heat dissipation from the package interior and an efficient electrical transition from the interior of a package.

Claims

1. A packaged IC comprising:

an outer interconnect and an inner interconnect, said outer interconnect comprising a transmission layer including at least one conductive lead line, an insulating layer, and a base layer, said inner interconnect comprising a transmission layer including at least one conductive access line, an insulating layer and a base layer, said outer interconnect overlapping a portion of said inner interconnect and at least one lead line of said inner interconnect physically engaging and being electrically connected to respective ones of said at least one access line of said outer interconnect, and an IC having at least one contact, said at least one contact being electrically connected to said at least one access line of said inner interconnect.

2. A packaged IC as recited in claim 1 wherein said outer interconnect forms a ring which circumnavigates said inner interconnect.

3. A packaged IC as recited in claim 2 wherein said transmission layer of said outer interconnect further comprises lead lines and said transmission layer of said inner interconnect further comprises access lines and said lead lines electrically interconnect with said access lines.

4. A packaged IC as recited in claim 1 wherein each said transmission layer of said inner and outer interconnects comprises microstrip or coplanar transmission lines.

5. A packaged IC as recited in claim 1 wherein said at least one lead line has a geometry that varies over a package transition.

6. A packaged IC as recited in claim 5 and further comprising an injection molded package body around said inner and outer interconnects, said lead line geometry varying through said body.

7. A packaged IC as recited in claim 1 wherein said inner interconnect comprises a ring.

8. A packaged IC as recited in claim 7 and further comprising a carrier to which the IC is mounted.

9. A packaged IC as recited in claim 8 wherein a surface of said carrier plate is substantially coplanar with said transmission layer of said outer interconnect.

10. A packaged IC as recited in claim 1 wherein said inner interconnect is a planar member.

11. A packaged IC as recited in claim 10 wherein the IC is flip chip mounted to said planar inner interconnect.

12. A packaged IC as recited in claim 1 wherein a via electrically interconnects a lead line of said outer interconnect to said base layer of said outer interconnect.

13. A packaged IC as recited in claim 1 and further comprising a via electrically interconnecting said at least one access line with said base layer of said inner interconnect.

14. A packaged IC as recited in claim 1 wherein said base layer is electrically connected to signal ground.

15. A packaged IC as recited in claim 13 wherein said base layer is electrically connected to signal ground.

16. A packaged IC as recited in claim 8 wherein said carrier is thermally matched to the IC.

17. A packaged IC as recited in claim 10 and further comprising a frame engaging the inner interconnect.

18. A packaged IC as recited in claim 17 wherein, said frame is thermally matched to the IC.

19. A packaged IC as recited in claim 16 wherein said carrier is a copper-molybdenum-copper laminate and the IC is a glass based microwave integrated circuit.

20. A packaged IC as recited in claim 16 wherein said carrier is a copper-molybdenum-copper laminate or a copper-tungsten alloy and the IC is a glass based microwave integrated circuit.

21. A packaged IC as recited in claim 18 wherein said inner interconnect is a copper-molybdenum-copper laminate and the IC is a glass based microwave integrated circuit.

22. A packaged IC as recited in claim 18 wherein said inner interconnect is a copper-molybdenum-copper laminate or a copper-tungsten alloy and the IC is a glass based microwave integrated circuit.

23. A packaged IC as recited in claim 1 and further comprising a metalized cover.

24. A package for an IC comprising a package body and conductive leads extending through said body from an interior to an exterior of the package, said leads comprising an outer interconnect comprising a conductive base layer, an insulating layer, and a transmission layer including at least one lead line, and an inner interconnect comprising a conductive base layer, an insulating layer and a transmission layer including at least one access line, said at least one access line of said transmission layer of said inner interconnect overlapping and being electrically connected to said at least one lead line of said of said outer interconnect.

25. A package for an IC as recited in claim 24 wherein said base layer (4) is in electrical engagement with said transmission layer (6).

26. A package for an IC as recited in claim 25 and further comprising at least one via electrically interconnecting said transmission layer and said base layer of said inner interconnect.

27. A package for an IC as recited in claim 24 wherein said outer interconnect comprises a ring and further comprising a carrier disposed against said inner interconnect.

28. A package for an IC as recited in claim 24 and further comprising a heat puck disposed against said inner interconnect.

29. A package for an IC as recited in claim 24 and further comprising a cover (24) disposed on said body (16).