High density test probe with rigid surface structure
First Claim
1. A structure for probing an electronic device comprising:
- a dielectric substrate having a plurality of first electrically conductive contact locations;
a layer of elastomeric material having a first side and a second side;
a plurality of electrical conductors extending from said first side to said second side;
each of said electrical conductors has a first end and a second end, said first end extends to said first side, said second end extends to said second side;
said second end of each of said electrical conductors is physically attached to at least one of the first contact locations;
a layer of dielectric material disposed on said first side;
said layer of dielectric material being free to move with respect to said dielectric substrate when said structure is moved towards said electronic device;
said first end of said plurality of electrical conductors extends into openings in said layer of dielectric material.
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Accused Products
Abstract
The present invention is a structure for probing an electronic device. The structure has a layer of elastomeric material having a first side and a second side; a plurality of electrical conductors extending from the first side to the second side; each of the electrical conductors has a first end and a second end, the first end extends to the first side, the second end extends to said second side; a layer of dielectric material disposed on the first side; the first end of the plurality of electrical conductors extends into openings in the layer of dielectric material. More particularly, in the present invention, the second side is disposed in contact with a first surface of a substrate and the second ends of the electrical conductors are electrically connected to first electrical contact locations on the first surface.
172 Citations
17 Claims
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1. A structure for probing an electronic device comprising:
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a dielectric substrate having a plurality of first electrically conductive contact locations; a layer of elastomeric material having a first side and a second side; a plurality of electrical conductors extending from said first side to said second side; each of said electrical conductors has a first end and a second end, said first end extends to said first side, said second end extends to said second side; said second end of each of said electrical conductors is physically attached to at least one of the first contact locations; a layer of dielectric material disposed on said first side; said layer of dielectric material being free to move with respect to said dielectric substrate when said structure is moved towards said electronic device; said first end of said plurality of electrical conductors extends into openings in said layer of dielectric material. - View Dependent Claims (2, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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3. A structure according to claim I, wherein there is an aperture in said layer of elastomeric material extending from said first surface to said second surface.
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13. A probe for making electrical contact with a plurality of bond pads on an integrated circuit device comprising:
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a first fan out substrate having a first surface; said first surface having a plurality of electrically conductive contact locations; said surface between said electrically conductive contact locations being a dielectric material; a plurality of bonds physically attached to said plurality of contact locations; a plurality of wires extending outward from said bonds, away from said first surface on the fan out substrate; said wires having ends disposed away from said first surface; a layer of elastomeric material surrounding said plurality of wires, said layer of elastomeric material having a first side and a second side, said second side of the layer of elastomeric material is disposed on said first surface of the fan out substrate; a layer of dielectric material is disposed on said first side of the layer of elastomeric material, said layer of dielectric material having a plurality of openings through which said ends of said plurality of wires extend, said layer of dielectric material being free to move with respect to said bond pads electrically conductive contact locations when said probe is moved towards said integrated circuit device. - View Dependent Claims (14, 15, 16, 17)
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Specification