Method and workpiece for connecting a thin layer to a monolithic electronic modules surface and associated module packaging
First Claim
1. A temporary workpiece for attaching to a substantially planar surface of a semiconductor structure having a plurality of contacts, said temporary workpiece comprising:
- a temporary support;
a temporary adhesive layer disposed on a surface of said temporary support; and
a thin-film layer coupled to said temporary support by said temporary adhesive layer, wherein said thin-film layer can be transferred to said substantially planar surface of the semiconductor structure to interconnect at least some of said plurality of contacts by bonding said thin-film layer to said substantially planar surface and decoupling said temporary support from said thin-film layer along said temporary adhesive layer.
0 Assignments
0 Petitions
Accused Products
Abstract
A fabrication method and resultant monolithic electronic module having a separately formed thin-film layer attached to a side surface. The fabrication method includes providing an electronic module composed of stacked integrated circuit chips. A thin-film layer is separately formed on a temporary support which is used to attach the thin-film layer to the electronic module. The disclosed techniques may also be used for attaching an interposer, which may include active circuity, to an electronic module. Specific details of the fabrication method, resulting multichip packages, and various thin-film structures are set forth.
-
Citations
11 Claims
-
1. A temporary workpiece for attaching to a substantially planar surface of a semiconductor structure having a plurality of contacts, said temporary workpiece comprising:
-
a temporary support; a temporary adhesive layer disposed on a surface of said temporary support; and a thin-film layer coupled to said temporary support by said temporary adhesive layer, wherein said thin-film layer can be transferred to said substantially planar surface of the semiconductor structure to interconnect at least some of said plurality of contacts by bonding said thin-film layer to said substantially planar surface and decoupling said temporary support from said thin-film layer along said temporary adhesive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
Specification