3-D packaging using massive fillo-leaf technology

• US 5,786,629 A
• Filed: 04/03/1996
• Issued: 07/28/1998
• Est. Priority Date: 05/14/1992
• Status: Expired due to Fees

• Current Assignee: Reveo, Inc.
• Original Assignee: Reveo, Inc.
• Inventors: Faris, Sadeg Mustafa
• Primary Examiner(s): Saadat, Mahshid D.
• Assistant Examiner(s): Clark, S. V.
• Application Number:
  US08/626,971
• Time in Patent Office: 846 Days
• Field of Search: 257/686, 257/685, 257/723, 257/724
• US Class Current: 257/686
• CPC Class Codes: H01L 2225/06551 Conductive connections on the side of the device
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

This invention relates to a three-dimensional package or module which includes a large number of subassemblies or fillo-leafs arranged in a stack. The subassemblies which carry integrated circuits are bonded at one of their edges so they extend cantilever fashion into a fluid coolant. Each fillo-leaf includes a heat dissipating element and one is spaced from another by an ultraviolet light cured material which is in registry with a transparent edge portion of each fillo-leaf. The transparent edge portions are formed, on the wafer level, and used, on the wafer level to cure the U.V. curable material.

Pairs of encoder lines which are used to provide a unique address extend from the edge of each fillo-leaf to an associated comparator. When stacks of fillo-leafs are diced from a stack of wafers, the pairs of encoder lines are encoded by shorting or not shorting the exposed ends of encoder lines which extend from the edge of each fillo-leaf.

Claims

1. A three dimensional module comprising:

a plurality of elements disposed in registry in a stack, each of said elements carrying a plurality of active circuit devices,

actuating means disposed on each said element for actuating said plurality of active circuit devices when matching first and second coded input signals are applied to said actuating means;

means disposed at the edge of each said element connected to an associated means for applying first coded signals which are unique to each said element to said an associated means for actuating; and

means disposed at the edges of said elements connected to each of said means for actuating for applying second coded signals to each of said means for actuating said active devices on one said elements.

2. The module according to claim 1, wherein each of said elements has a planar surface at least an edge portion of which is transparent to electromagnetic radiation.

4. A module according to claim 1 wherein each of said elements is a semiconductor.

5. A module according to claim 1 wherein each of said elements is sapphire.

6. A module according to claim 1 wherein each of said elements is an electrically insulating material.

7. A module according to claim 1 wherein each of said elements is silicon.

8. A module according to claim 1 wherein each of said elements is made of lithium niobate.

9. A module according to claim 1 wherein said active circuit devices are transistors.

10. A module according to claim 1 wherein said active circuit devices are memory cells.

11. A module according to claim 1 wherein said active circuit devices are logic circuits.

12. A module according to claim 1 wherein said means for actuating are comparator circuits.

13. A module according to claim 1 wherein said active circuit devices are switchable optical devices.

14. A module according to claim 1 wherein said active circuit devices are optical circuits.

15. A module according to claim 1 wherein said active circuit devices are Josephson junctions.

16. A module according to claim 1 wherein said active circuit devices are electrically switchable devices disposed in insulated spaced relationship with said elements.

17. A module according to claim 1 wherein each of said elements is made of III-V compound semiconductor materials and their alloys.

18. A module according to claim 1 wherein each of said elements is made of gallium arsenide.

19. A module according to claim 1 wherein each of said elements of is a metal.

20. A module according to claim 2 wherein said edge portion is an oxide of a metal.

21. A module according to claim 2 wherein said edge portion is an oxide of silicon.

22. A module according to claim 1 wherein said edge portion is a material transparent to electromagnetic radiation.

23. A module according to claim 2 wherein said edge portion is a material transparent to ultra-violet radiation.

24. A module according to claim 2 wherein said edge portion is an insulator transparent to electromagnetic radiation.

25. A module according to claim 1 further including a heat dissipating and spacing element disposed contiguously with the underside of each of said elements.

26. A module according to claim 1 further including a heat dissipating metal film having a waffle iron-like shape extending from the underside of each of said elements.

27. A module according to claim 1 further including a copper film disposed contiguously with the underside of each of said elements.

28. A module according to claim 1 wherein each of said elements is flexible.

29. A module according to claim 1 wherein each of said elements is rigid.

30. A module according to claim 1, wherein said means for applying first coded signals includes a plurality of pairs of encoder lines extending from said actuating means and terminating at said edge.

32. A module according to claim 1 wherein said active circuit devices are CMOS devices.

33. A module according to claim 1 wherein said means for applying second coded signals includes a first plurality of transmission lines extending over said element from said actuating means and terminating at said edge.

34. A module according to claim 1 further including a second plurality of data, address and power transmission lines extending over said edge to said plurality of active circuit devices and terminating at said edge.

35. A module according to claim 30 wherein said encoder lines are made of metal.

36. A module according to claim 30 wherein said encoder lines are made of heavily doped silicon.

37. A module according to claim 30 wherein said encoder lines are passivated with an oxide of silicon.

38. A module according to claim 30 wherein said encoder lines are optical transmission lines.

39. A module according to claim 30 wherein said encoder lines are made of titanium dioxide.

41. A module according to claim 33 wherein said transmission lines are electrically conductive.

42. A module according to claim 33 wherein said transmission lines are optical fibers.

43. A module according to claim 34 wherein said data, address and power transmission lines are electrically conductive.

44. A module according to claim 34 wherein said data, address and power transmission lines are optical fibers.

45. The module according to claim 30, wherein said means for applying first coded signals further includes means disposed at said edge for applying a short circuit to at least one of said plurality of pairs of encoder lines.

46. A module according to claim 45 wherein said means for applying a short circuit is a shorting strap interconnecting said at least a pair of said plurality of pairs of encoder lines.

3. A three dimensional module assembly comprising:

a stack of fillo-leafs each of which contains a plurality of actuable circuit elements;

a comparator circuit which includes a plurality of active devices disposed on each of said fillo-leafs which provides an actuating output to said plurality of actuable circuit elements when first and second coded inputs to said comparator match;

encoding means disposed at an edge of each of said fillo-leafs connected to an associated comparator circuit each encoding means providing a first uniquely coded input to said an associated comparator circuit; and

,

means disposed at an edge of each of said fillo-leafs connected to each comparator for applying said second input to each comparator circuit to generate said output when said first and second coded inputs match.

31. A module according to 1 wherein said means for actuating is a comparator circuit.

40. A module according to claim 31 further including a plurality of pairs of encoder lines extending from said edge to said comparator circuit, and, means disposed perpendicular to at least a pair of encoder lines and adjacent to said edge for applying a short circuit to said at least a pair of encoder lines for applying said first coded signals to said comparator circuit.