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Chucks and methods for positioning multiple objects on a substrate

  • US 5,788,814 A
  • Filed: 04/09/1996
  • Issued: 08/04/1998
  • Est. Priority Date: 04/09/1996
  • Status: Expired due to Fees
First Claim
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1. An apparatus for positioning multiple objects in a selected configuration, each object having a thickness less than about three millimeters, comprisingan electrostatic chuck comprising:

  • a conductive layer;

    a first insulating layer; and

    a substrate layer, wherein the substrate layer comprisesa multitude of conductive vias extending from a top of the substrate layer to a bottom of the substrate;

    wherein the electrostatic chuck is activated by applying a bias voltage to the conductive layer, and wherein points on the outer surface nearest the vias define attraction points for positioning the objects.

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