Methods and apparatus for simultaneous multi-sided coating of optical thin film designs using dual-frequency plasma-enhanced chemical vapor deposition

• US 5,789,040 A
• Filed: 05/21/1997
• Issued: 08/04/1998
• Est. Priority Date: 05/21/1997
• Status: Expired due to Fees

• Current Assignee: Optical Coating Laboratory, Inc. (Lumentum Holdings Inc.)
• Original Assignee: Optical Coating Laboratory, Inc. (Lumentum Holdings Inc.)
• Inventors: Yamasaki, Nancy Lee Schultz, Lantman, Christopher Wayne, Martinu, Ludvik, Klemberg-Sapieha, Jolanta E.
• Primary Examiner(s): Beck, Shrive
• Assistant Examiner(s): MEEKS, TIMOTHY HOWARD
• Application Number:
  US08/861,246
• Time in Patent Office: 440 Days
• Field of Search: 427/569, 427/575, 427/255.5, 118/723 E
• US Class Current: 427/575
• CPC Class Codes: C23C 16/517 using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515
• CPC Class Codes: H01J 2237/3321 CVD [Chemical Vapor Deposition]
• CPC Class Codes: H01J 37/32082 Radio frequency generated discharge H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence
• CPC Class Codes: H01J 37/32192 Microwave generated discharge H01J37/32357, H01J37/32366, H01J37/32394, H01J37/32403 take precedence
• CPC Class Codes: H05H 1/46 using applied electromagnetic fields, e.g. high frequency or microwave energy H05H1/26 takes precedence

Abstract

The present invention is directed to methods and apparatus for depositing optical thin film coatings simultaneously onto both sides of at least one substrate in a dual-frequency plasma-enhanced chemical vapor deposition vacuum reaction chamber utilizing microwave and radio frequency energies. The substrate can be a continuous substrate, such as a flexible polymer web, or it can be one or more discrete substrates, such as rigid plastic, glass, or glass/polymer composite substrates. The substrate can be processed in a stationary or an in-line processing mode. In addition, the coatings deposited simultaneously onto both sides of the substrate can be identical, i.e. symmetrical, or different, i.e., non-symmetrical. The plasma attributes and reaction conditions on either side of the substrate can be independently controlled to provide either identical or different coating compositions and properties on the two sides of the substrate. Multiple plasmas can also be generated, in either an overlapping or isolated manner, to form multiple independently-controlled CVD reaction zones for simultaneous deposition of either identical or different coatings onto the sides of the substrate within the different zones.

Claims

1. A method for simultaneously depositing film coatings onto multiple surfaces of a substrate, said method comprising the steps of:

(a) obtaining a dual-frequency plasma-enhanced chemical vapor deposition device, said device comprising;

(i) a vacuum reaction chamber;

(ii) means for introducing a selected reactive gas composition into said vacuum reaction chamber;

(iii) means for generating a deposition plasma from said reactive gas composition, said means comprising at least one microwave energy source for directing microwave energy into said vacuum reaction chamber; and

at least one radio frequency-powered plasma electrode positioned within said vacuum reaction chamber; and

(iv) means for supporting at least one substrate within said deposition plasma such that multiple surfaces of said substrate are simultaneously exposed to a portion of said deposition plasma;

(b) generating a dual-frequency plasma activation region within said vacuum reaction chamber by (i) directing a selected microwave energy into said vacuum reaction chamber to form a first plasma activation region and (ii) generating a radio frequency energy and coupling said radio frequency energy to said plasma electrode within said vacuum reaction chamber to form a second plasma activation region having at least a portion that overlaps a portion of said first plasma activation region;

(c) generating a deposition plasma by introducing a selected reactive gas composition into said dual-frequency plasma activation region within said vacuum reaction chamber; and

(d) transporting a substrate through said deposition plasma such that said substrate is displaced away from said plasma electrode and multiple surfaces on all opposing sides of said substrate are simultaneously exposed to said deposition plasma.

2. A method for simultaneously depositing film coatings onto multiple surfaces of a substrate, said method comprising the steps of:

(a) directing microwave energy into a vacuum reaction chamber to form a first plasma activation region within said vacuum reaction chamber;

(b) coupling radio frequency energy to a plasma electrode positioned within said vacuum reaction chamber to form a second plasma activation region within said vacuum reaction chamber, said second plasma activation region having at least a portion that overlaps a portion of said first plasma activation region to thereby define a dual-frequency plasma region within said vacuum reaction chamber;

(c) supplying a reactive gas composition to said dual-frequency plasma activation region such that a deposition plasma for depositing a selected film coating onto a substrate is formed within said dual-frequency plasma activation region; and

(d) supporting a substrate within said deposition plasma such that said substrate is displaced away from said plasma electrode and multiple surfaces on all opposing sides of said substrate are simultaneously exposed to said deposition plasma.

3. The method of claim 2, wherein the power and frequency of the microwave energy source and the rf energy source are adjusted to obtain a deposition plasma that deposits a symmetrical coating onto said multiple surfaces of said substrate.

4. The method of claim 2, wherein a first reactive gas composition is supplied to said first plasma activation region and a second reactive gas composition is supplied to said second plasma activation region to obtain a deposition plasma that deposits a symmetrical coating onto said multiple surfaces of said substrate.

5. The method of claim 2, wherein the pressure of the reactive gas composition is selected to obtain a deposition plasma that deposits a symmetrical coating onto said multiple surfaces of said substrate.

6. The method of claim 2, wherein a gas flow is selected to obtain a deposition plasma that deposits a symmetrical coating onto said multiple surfaces of said substrate.

7. The method of claim 2, wherein the power and frequency of the microwave energy source and the rf energy source are adjusted to obtain a deposition plasma that deposits a non-symmetrical coating onto said multiple surfaces of said substrate.

8. The method of claim 2, wherein a first reactive gas composition is supplied to said first plasma activation region and a second reactive gas composition is supplied to said second plasma activation region to obtain a deposition plasma that deposits a non-symmetrical coating onto said multiple surfaces of said substrate.

9. The method of claim 2, wherein the pressure of the reactive gas composition is selected to obtain a deposition plasma that deposits a non-symmetrical coating onto said multiple surfaces of said substrate.

10. The method of claim 2, wherein a gas flow is selected to obtain a deposition plasma that deposits a non-symmetrical coating onto said multiple surfaces of said substrate.

11. The method of claim 2, wherein said step of supporting a substrate within said deposition plasma such that said multiple surfaces of said substrate are simultaneously exposed to said deposition plasma comprises moving at least one continuous substrate through said deposition plasma.

12. The method of claim 2, wherein said step of supporting a substrate within said deposition plasma such that said multiple surfaces of said substrate are simultaneously exposed to said deposition plasma comprises moving at least one discrete substrate through said deposition plasma.

13. The method of claim 2, wherein said step of supporting a substrate within said deposition plasma such that said multiple surfaces of said substrate are simultaneously exposed to said deposition plasma comprises supporting at least one stationary continuous substrate within said deposition plasma.

14. The method of claim 2, wherein said step of supporting a substrate within said deposition plasma such that said multiple surfaces of said substrate are simultaneously exposed to said deposition plasma comprises supporting at least one stationary discrete substrate within said deposition plasma.

15. The method of claim 2, wherein multiple microwave energy sources and multiple radio frequency powered plasma electrodes are used to generate multiple dual-frequency plasma activation regions.

16. The method of claim 15, wherein at least a portion of said multiple dual-frequency plasma activation regions are physically isolated and independently controlled with respect to the other dual-frequency plasma activation regions.

17. The method of claim 15, wherein multiple different reactive gas compositions are introduced to thereby generate different deposition plasmas within said multiple plasma activation regions.