Bare die multiple dies for direct attach

• US 5,790,384 A
• Filed: 06/26/1997
• Issued: 08/04/1998
• Est. Priority Date: 06/26/1997
• Status: Expired due to Term

• Current Assignee: Invensas Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Ahmad, Umar M., Atwood, Eugene R.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): FOSTER, DAVID A
• Application Number:
  US08/883,112
• Time in Patent Office: 404 Days
• Field of Search: 361/760, 361/762, 361/764, 361/765, 361/767, 361/772, 361/777, 361/779, 361/784, 361/785, 361/790, 257/777, 257/778, 257/780, 257/781, 257/782, 257/783, 257/784, 257/785, 257/788, 257/737, 257/738
• US Class Current: 361/760
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges

Abstract

A chip package includes a substrate formed from a first die and its attendant wiring interconnections, having a first thermal coefficient of expansion. The first die includes primary input/output (I/O) interconnections for the chip package. Also provided is a second die that includes escape wiring formed on that die and coupled to the primary I/O interconnections through the first die. The second die has a second thermal coefficient of expansion similar to the first thermal coefficient of expansion. The chip package also includes connectors that couple the primary I/O interconnections of the first die to a second level package. An interposer may be provided to couple the primary I/O interconnections to the second level package. The second die is smaller than the first die. The peripheral area of the first die is left exposed when the second die is coupled to the first die so that sufficient I/O interconnections may be formed for the primary I/O interconnections on the first die. The second die provides and receives signals which may include the second die'"'"'s primary I/O to and from the first die. Wiring may be shared between the first die and the second die in a manner optimal for design and manufacturing.

Claims

1. A chip package comprising:

a first die having a first size and including wiring coupled to chip package primary input/output (I/O) interconnections; and

a second die coupled directly to the first die and having a second size smaller than the first size, the second die providing and receiving signals via the first die to and from the chip package primary I/O interconnections.

2. The chip package according to claim 1, further comprising an interposer coupled to the chip package primary I/O.

3. The chip package according to claim 2, wherein the interposer is formed in segments.

4. The chip package according to claim 2, wherein the first die has a first thermal coefficient of expansion, the second die has a second thermal coefficient of expansion, and the interposer has a third thermal coefficient of expansion and wherein the first, second, and third thermal coefficients of expansion are substantially the same.

5. The chip package according to claim 1, wherein the first die has a first thermal coefficient of expansion and the second die has a second thermal coefficient of expansion that is substantially the same as the first thermal coefficient of expansion.

6. The chip package according to claim 1, further comprising a clip coupled to the chip package primary I/O interconnections.

7. The chip package according to claim 1, further comprising a column coupled to the chip package primary I/O interconnections.

8. The chip package according to claim 1, further comprising a wire bond coupled to the chip package primary I/O interconnections.

9. The chip package according to claim 1, further comprising an elastomeric connector coupled to the chip package primary I/O.

10. The chip package according to claim 1, further comprising an adhesive formed between the second die and the substrate.

11. The chip package according to claim 1, further comprising an area array connector for electrically coupling the first die to the second die.

12. The chip package according to claim 1, wherein the second die includes a first circuit, a second circuit, and internal wiring coupling the first circuit and the second circuit where a segment of the internal wiring is formed on the first die.

13. The chip package according to claim 1, further comprising a third die having a third size smaller than the first size, the third die providing and receiving further external signals to and from the substrate via the escape wiring.

14. The chip package according to claim 1, wherein the first die includes a first circuit and the second die includes a second circuit electrically coupled to the first circuit.

15. The chip package according to claim 1, wherein the first die is a memory and the second die is a microprocessor.

16. The chip package according to claim 1, wherein the second die is a memory and the first die is a microprocessor.

17. The chip package according to claim 16, wherein the second die includes a memory controller for controlling access to the memory for the first die.

18. The chip package according to claim 1, wherein the first die includes a first active surface and the second die includes a second active surface where the first active surface faces the second active surface.

19. The chip package according to claim 18, further comprising an area array connector formed between the first active surface and the second active surface.

20. The chip package according to claim 1, wherein the second die is formed above the substrate and the first die is formed above the second die.

21. The chip package according to claim 1, further comprising an area connector coupled to the first die.

22. A chip package comprising:

a substrate having interconnections;

a first die having a first size and a first thermal coefficient of expansion, the first die including escape wiring coupled to the interconnections;

coupling means for coupling the first die to the substrate; and

a second die coupled directly to the first die having a second size smaller than the first size and a second thermal coefficient of expansion that is substantially the same as the first thermal coefficient of expansion, the second die providing and receiving external signals to and from the substrate via the escape wiring.

23. The chip package according to claim 22, further comprising a third die having a third size smaller than the first size, the third die providing and receiving further external signals to and from the substrate via the escape wiring.

24. The chip package according to claim 22, wherein the first die includes internal wiring and the second die provides and receives internal signals to and from the second die via the internal wiring.

25. The chip package according to claim 22, wherein the first die is a memory and the second die is a microprocessor.

26. The chip package according to claim 22, wherein the second die is a memory and the first die is a microprocessor.

27. The chip package according to claim 22, wherein the first die includes a first active surface and the second die includes a second active surface where the first active surface faces the second active surface.

28. The chip package according to claim 27, further comprising an area array connector formed between the first active surface and the second active surface.