Coagulating microsystem

• US 5,792,137 A
• Filed: 10/27/1995
• Issued: 08/11/1998
• Est. Priority Date: 10/27/1995
• Status: Expired due to Fees

• Current Assignee: Lacar Microsystems, Inc.
• Original Assignee: Lacar Microsystems, Inc.
• Inventors: Carr, William N., Ladocsi, Lewis T.
• Primary Examiner(s): Shay, David M.
• Application Number:
  US08/549,541
• Time in Patent Office: 1,019 Days
• Field of Search: 606/27-30, 606/32
• US Class Current: 606/29
• CPC Class Codes: A61B 18/085 Forceps, scissors
• CPC Class Codes: A61B 18/14 Probes or electrodes therefor
• CPC Class Codes: A61B 18/1442 Probes having pivoting end effectors, e.g. forceps

Abstract

A coagulating microknife includes at least one knife blade that is comprised of a doped semiconductor body that exhibits a resistive current-carrying characteristic and a sharp cutting edge. A power supply is connected to the knife blade and applies a metered current which heats the knife blade to a controlled temperature for cauterizing tissue during a cutting action. The semiconductor body includes a pair of contact areas which extend into the body and enable localized heating at the tip of the knife blade.

Claims

1. A coagulating microknife comprising:

at least one doped silicon semiconductor body, micromachined to a knife blade form and exhibiting a resistive current carrying characteristic and a sharp cutting edge; and

power supply means connected to said silicon semiconductor body for applying a metered current thereto, to heat said knife blade form to a controlled temperature for cauterizing tissue during a cutting action by said knife blade form of said tissue.

2. The coagulating microknife as recited in claim 1, further comprising:

an insulating substrate for supporting said silicon semiconductor body in a cutting configuration and including at least one aperture to enable a user to view the tissue being cut.

3. The coagulating microknife as recited in claim 1, further comprising:

an insulating substrate for supporting said silicon semiconductor body in a cutting configuration said insulating substrate configured to removably mate with a receiving structure at a distal end of a pair of forceps.

4. The coagulating microknife as recited in claim 1, wherein said power supply means includes a user-operable switch for enabling application of said metered current to said silicon semiconductor body, and adjustment means for enabling control of an amount of power applied to said silicon semiconductor body.

5. The coagulating microknife as recited in claim 1, wherein said silicon semiconductor body includes a pair of spaced apart conductive contact regions for distributing current flow across an interior area of said knife blade form.

6. The coagulating microknife as recited in claim 1, further comprising:

a second doped silicon semiconductor body micromachined to have a knife blade form and movably mounted in opposition to said at least one doped silicon semiconductor body, and exhibiting a resistive current carrying characteristic and a sharp cutting edge;

means for connecting said second doped silicon semiconductor body to said power supply means so as to enable current flow therethrough concurrently with current flow through said at least one doped silicon semiconductor body; and

means for bringing together in a shearing action, said at least one knife blade form and said second knife blade form.

7. The coagulating microknife as recited in claim 1, further comprising:

a substrate mounted in opposition to said at least one knife blade form and including a channel for receiving a cutting edge of said at least one knife blade form; and

means for bringing together in a cutting action, said at least one knife blade form and said substrate.