Semiconductor device

• US 5,793,106 A
• Filed: 02/28/1996
• Issued: 08/11/1998
• Est. Priority Date: 02/28/1995
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Fujieda, Nobuo, Muso, Masanori, Yasukawa, Akio, Suzuki, Osamu, Naito, Shotaro, Yamamura, Hirohisa, Kuwahara, Heikichi
• Primary Examiner(s): Saadat, Mahshid D.
• Assistant Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US08/608,565
• Time in Patent Office: 895 Days
• Field of Search: 257/712, 257/706, 257/675, 257/723, 257/718, 257/719, 257/720, 257/783, 257/785, 257/787, 257/788, 257/795, 257/796, 257/713, 257/717, 361/702, 361/704, 361/709, 361/711, 148/559, 148/580
• US Class Current: 257/712
• CPC Class Codes: H01L 2023/405 heatsink to package
• CPC Class Codes: H01L 2023/4087 Mounting accessories, interposers, clamping or screwing parts
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/3511 : Warping

Abstract

A semiconductor device, suitable for use in an invertor device for large currents in which IGBT chips are used and of which a high reliability is required, has an insulating plate on which are mounted semiconductor chips, a resin case enclosing the semiconductor chips, a filler resin filled into the resin case and covering the semiconductor chips and filling in the space between the semiconductor chips and the resin case, and a heatsink to which the insulating plate is attached, wherein, for purposes of attaching the insulating plate to the heatsink, the resin case is used to press the insulating plate onto the heatsink. Some benefits of this construction are that is makes it possible to eliminate the problem of fatigue failure of a solder layer previously used for attaching the insulating plate to the heatsink by dispensing with that solder layer, while at the same time improving the transfer of heat from the insulating plate to the heatsink, and thereby improving the removal of heat from the device. The construction also makes it possible to reduce cracking of the insulating plate, reduce breakage of mounting portions of the resin case and to use the device to make a small, thin, light and highly reliable invertor device.

Claims

1. A semiconductor device, comprising an insulating plate on which are mounted semiconductor chips, a resin case enclosing the semiconductor chips, a filler resin filled into the resin case and covering the semiconductor chips and filling in a space between the semiconductor chips and the resin case, a heatsink to which the insulating plate is attached, and means for attaching the insulating plate to the heatsink by using the resin case to press the insulating plate against the heatsink.

2. A semiconductor device according to claim 1, wherein a metal film is formed on the face of the insulating plate on the heatsink side thereof, wherein the resin case has a projection adjacent the face of the insulating plate opposite the heatsink side thereof, wherein, when viewing the semiconductor device from a plane view perspective, the plane view position of said projection is inside of the plane view outline of said metal film such that said plane view position of the projection is surrounded by the plane view outline of the metal film, and wherein said projection presses the insulating plate toward the heatsink from the face of the insulating plate opposite the heatsink side thereof.

3. A semiconductor device according to claim 1, wherein said means for attaching the insulating plate to the heatsink includes bolt holes in said resin case for bolts to pass through and screw holes for the bolts in the heatsink so that the insulating plate is pressed against the heatsink by head portions of bolts which pass through the bolt holes in the resin case and are screwed into the screw holes formed in the heatsink.

4. A semiconductor device according to claim 1, wherein a grease layer is provided between the insulating plate and the heatsink.

5. A semiconductor device according to claim 2, wherein said projection is provided in the form of a ring positioned on lines substantially parallel with the edges formed by the faces of the insulating plate, and the semiconductor chips are disposed inside the ring-form boundary of said projection.

6. A semiconductor device according to claim 5, wherein inside the ring-form boundary of said projection on the resin case there is provided a pressing member for pressing the insulating plate and this pressing member is formed integrally with the resin case.

7. A semiconductor device, comprising:

an insulating plate on which are mounted semiconductor chips, a resin case enclosing the semiconductor chips, a filler resin filled into the resin case and covering the semiconductor chips and filling in a space between the semiconductor chips and the resin case, and a heatsink to which the insulating plate is attached, wherein the insulating plate and the heatsink are thermally joined by means for applying a contact pressure to the insulating plate to bias it against said heatsink.

8. A multiple-phase invertor device having a plurality of circuits, each circuit providing an output of a respective phase of the invertor device, comprising:

an insulating plate on which are mounted semiconductor chips, a resin case enclosing the semiconductor chips, a filler resin filled into the resin case and covering the semiconductor chips and filling in a space between the semiconductor chips and the resin case, and a heatsink to which the insulating plate is attached, wherein each one of said plurality of circuits respectively corresponds to one phase of the multiple phase invertor device, wherein each circuit includes an insulating plate and a corresponding resin case and wherein each of the insulating plates are pressed against the heatsink by the corresponding resin cases which are fixed to the heatsink with bolts.

9. A semiconductor device, comprising:

an insulating plate on which are mounted semiconductor chips, a resin case enclosing the semiconductor chips, a filler resin filled into the resin case and covering the semiconductor chips and filling in a space between the semiconductor chips and the resin case, and a heatsink to which the insulating plate is attached, wherein the resin case has terminal plates which project from the resin case in directions substantially parallel to the surface of the heatsink, including terminal plates for a gate driving circuit and terminal plates for a power supply circuit which project from one side of the resin case and terminal plates for an output which project from the side of the resin case opposite said one side thereof.

11. A semiconductor device according to claim 9, wherein the semiconductor device is an invertor.

10. A semiconductor comprising:

an insulating plate on which are mounted semiconductor chips, a resin case enclosing the semiconductor chips, a filler resin filled into the resin case and covering the semiconductor chips and filling in a space between the semiconductor chips and the resin case, and a heatsink to which the insulating plate is attached, wherein two terminal plates for a power supply circuit of the semiconductor chips are provided in the form of flat plates which are mutually superposed with an insulator interposed therebetween and are directly connected and fixed to capacitor terminals outside the resin case.

12. A semiconductor device according to claim 10, wherein the semiconductor device is an invertor.

13. A semiconductor device, comprising:

an insulating plate on which are mounted semiconductor chips, a resin case enclosing the semiconductor chips, a filler resin filled into the resin case and covering the semiconductor chips and filling in a space between the semiconductor chips and the resin case, a heatsink to which the insulating plate is attached, and means for attaching the insulating plate to the heatsink without using solder between the insulating plate and the heatsink by forcibly pressing the insulating plate against the heatsink using the resin case to exert pressing force.

14. A semiconductor device according to claim 13, wherein a grease layer is provided between the insulating plate and the heatsink to absorb differential thermal expansion between the insulating plate and the heatsink.

15. A semiconductor device according to claim 13, wherein the semiconductor device is an invertor.