Surface mount fusing device

• US 5,793,274 A
• Filed: 11/01/1996
• Issued: 08/11/1998
• Est. Priority Date: 11/01/1996
• Status: Expired due to Fees

• Current Assignee: Bourns Incorporated
• Original Assignee: Bourns Incorporated
• Inventors: Kelly, Kevin, Herbert, Chris
• Primary Examiner(s): Phillips, Michael W.
• Assistant Examiner(s): Vortman, Anatoly
• Application Number:
  US08/742,163
• Time in Patent Office: 648 Days
• Field of Search: 337/295, 337/296, 337/297, 337/232, 337/273, 337/276, 337/280, 337/282, 337/186, 337/104, 337/105, 337/163, 337/164, 337/165, 337/166, 337/234, 337/236, 337/238, 337/239, 337/241, 337/244, 337/245, 337/265, 337/267, 337/243, 337/405, 337/402, 337/403, 337/404, 337/4, 337/152, 337/153, 337/183, 337/184, 337/185, 337/401-417, 29/623
• US Class Current: 337/183
• CPC Class Codes: H01H 85/048 Fuse resistors
• CPC Class Codes: H01H 85/36 Means for applying mechanical tension to fusible member

Abstract

A thermal fuse device for over-current protection includes a fusing element comprising a conductive strip having a fulcrum point between first and second ends. The fuse strip is connected to first and second terminal pads on a substrate by a first solder joint between the first end and the first terminal pad, and a second solder joint between the fulcrum point and the second terminal pad. The second end of the strip is resiliently pressed against the interior surface of a housing that holds the substrate. The inwardly-directed pressure applied to the second end of the fuse strip by the housing is resisted by the first and second solder joints, whereby the fuse strip remains immobile. A resistive element on the substrate generates heat in response to the flow of current. When the current is greater than a predetermined current value, the generated heat melts the first and second solder joints, thereby allowing the fuse strip to pivot about its fulcrum point in response to the pressure applied to its second end by the housing, and thereby causing the first end of the fuse strip to separate from the first terminal pad to open the circuit. In a preferred embodiment, the housing holds two or more of the substrates in a substantially parallel relationship to each other and in a substantially perpendicular relationship to the circuit board, whereby the substrates can be installed on the board in an upright, surface mount orientation.

Claims

1. A fusing device, comprising:

a housing having a wall portion with an interior surface;

a substrate disposed within the housing;

first and second terminal pads on the substrate;

a fusing element having a first end attached to the first terminal pad by a first solder junction, a fulcrum point attached to the second terminal pad by a second solder junction, and a second end resiliently pressed against the interior surface of the housing wall portion so as to apply a pressure against the second end of the fusing element; and

a heat-generating resistive element disposed on the substrate;

whereby, in response to a current flowing through the resistive element that is greater than a predetermined current value, the resistive element generates sufficient heat to melt the first and second solder junctions, and whereby the pressure applied to the second end of the fusing element causes the fusing element to pivot about the fulcrum point to lift the first end of the fusing element away from the first terminal pad.

2. The fusing device of claim 1, wherein the fusing element has a first position before the first end is separated from the first terminal pad, and a second position after the first end is separated from the first terminal pad, and wherein the device further comprises indication means for providing a visual indication of the position of the fusing element from outside of the housing.

3. The fusing device of claim 2, wherein the indication means includes an aperture in the housing through which the fusing element is visible.

4. The fusing device of claim 3, wherein the housing includes an upper surface having a plane that is orthogonal to the plane of the substrate, and wherein the aperture is in the upper surface.

5. The fusing device of claim 1, further comprising:

mounting means on the substrate for permitting a surface-mount installation of the device on a circuit board.

6. The fusing device of claim 5, wherein the substrate has first and second opposed major surfaces, and wherein the substrate is retained in the housing so that, when the device is surface-mounted on a circuit board, the planes of the major surfaces are substantially perpendicular to the plane of the circuit board.

7. A fusing device, comprising:

a housing;

first and second substrates retained in the housing in a substantially parallel orientation, each of the substrates having an inner surface and an outer surface, the inner surfaces of the substrates facing each other;

first and second terminal pads on the outer surface of each of the substrates;

a fusing element disposed on the outer surface of each of the substrates so as to connect the first and second terminal pads, the fusing elements each comprising a metallic strip having a first end attached to the first terminal pad by a first solder junction, a fulcrum point attached to the second solder pad by a second solder junction, and a second end resiliently pressed against the housing so as to apply pressure on the second end; and

a heat-generating resistive element disposed on each of the substrates;

whereby, in response to a current flowing through the resistive element that is greater than a predetermined current value, the resistive element generates sufficient heat to melt the solder at the first and second solder junctions, and whereby the pressure applied to the second end causes the strip to pivot about the fulcrum point so as to separate the first end from the first terminal pad.

8. The fusing device of claim 7, wherein each of the metallic strips has a first position before the first end is separated from the first terminal pad, and a second position after the first end is separated from the first terminal pad, and wherein the device further comprises indication means for providing a visual indication of the position of the metallic strip from outside of the housing.

9. The fusing device of claim 8, wherein the indication means includes an aperture in the housing through which the fusing element is visible.

10. The fusing device of claim 9, wherein the housing includes an upper surface having a plane that is orthogonal to the plane of the substrate, and wherein the aperture is in the upper surface.

11. The fusing device of claim 7, further comprising:

mounting means on each of the substrates for permitting a surface-mount installation of the device on a circuit board.

12. The fusing device of claim 11, wherein the first and second substrates are retained in the housing so that, when the device is surface-mounted on a circuit board, the planes of the inner and outer surfaces of the first and second substrates are substantially perpendicular to the plane of the circuit board.

13. A fusing device, comprising:

a housing having a side wall portion and a top portion with an aperture;

a substrate disposed within the housing and having a first and second planar surfaces;

first and second terminal pads on the first planar surface of the substrate;

a heat-generating resistive element disposed on at least one of the planar surfaces of the substrate; and

a fusing element disposed on the first planar surface of the substrate, the fusing element comprising;

a first end attached by a first solder junction to the first terminal pad;

a fulcrum point attached by a second solder junction to the second terminal pad; and

a second end pressed against the side wall portion so as to apply pressure to the second end;

whereby, in response to a current flowing through the resistive element that is greater than a predetermined current value, the resistive element generates sufficient heat to melt the first and second solder junctions, and whereby the pressure applied to the second end causes the fusing element to pivot about the fulcrum point so as to separate the first end from the first terminal pad.

14. The fusing device of claim 13, further comprising:

mounting means on the substrate for providing a surface mount installation of the device on a circuit board.

15. The fusing device of claim 14, wherein the substrate is retained in the housing so that, when the device is surface-mounted on a circuit board, the planes of the planar surfaces are substantially perpendicular to the plane of the circuit board.

16. The fusing device of claim 13, wherein the fusing element has a first position before the first end is separated from the first terminal pad, and a second position after the first end is separated from the first terminal pad, and wherein the device further comprises indication means for providing a visual indication of the position of the fusing element from outside of the housing.

17. The fusing device of claim 16, wherein the indication means includes the aperture.