Method and apparatus for controlling injection-molding systems

• US 5,795,511 A
• Filed: 06/06/1995
• Issued: 08/18/1998
• Est. Priority Date: 06/06/1995
• Status: Expired due to Fees

• Current Assignee: Fast Heat, Inc.
• Original Assignee: Fast Heat, Inc.
• Inventors: Smith, J. Howard, Kalantzis, Peter G.
• Primary Examiner(s): HEITBRINK, JILL LYNNE
• Application Number:
  US08/468,711
• Time in Patent Office: 1,169 Days
• Field of Search: 264/40.1, 264/40.6, 264/328.1, 264/328.14, 264/328.15, 264/328.16, 425/143, 425/144, 425/547, 425/548, 425/549, 364/468, 364/476, 364/475.05, 364/475.06, 364/475.07
• US Class Current: 264/40.6
• CPC Class Codes: B29C 2045/1796 Moulds carrying mould related information or codes, e.g. bar codes, counters
• CPC Class Codes: B29C 45/1774 Display units or mountings therefor; Switch cabinets
• CPC Class Codes: B29C 45/27 Sprue channels ; Runner channels or runner nozzles
• CPC Class Codes: B29C 45/2737 Heating or cooling means therefor B29C45/7331 takes precedence
• CPC Class Codes: B29C 45/766 the setting or resetting of moulding conditions, e.g. before starting a cycle
• CPC Class Codes: B29C 45/78 of temperature
• CPC Class Codes: G05B 19/128 the workpiece itself serves as a record carrier, e.g. by its form, by marks or codes on it
• CPC Class Codes: G05B 19/4183 characterised by data acquisition, e.g. workpiece identification
• CPC Class Codes: G05B 2219/23335 History, log of program modifications
• CPC Class Codes: G05B 2219/25294 Part, workpiece, code, tool identification
• CPC Class Codes: G05B 2219/2624 Injection molding
• CPC Class Codes: G05B 2219/31095 Read write intelligent chip on workpiece, pallet, tool for data exchange
• CPC Class Codes: G05B 2219/31288 Archive collected data into history file
• CPC Class Codes: G05B 2219/45244 Injection molding
• CPC Class Codes: G05B 2219/49304 Tool identification, code
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

Apparatus and method for providing material to a mold, such as in an injection molding system, wherein the settings for controlling the molding operation are retained in a non-volatile memory in a hot-half of the mold. When connected to a system controller, the hot-half of the mold is configured to communicate the retained information to the system controller, thereby enabling simplified set up of the molding operation. The retained information includes system information, initial settings for a plurality of heating zones, and historical information associated with that particular hot-half of the mold. Changes made to the information at the system controller are transmitted to the hot-half for dynamic updating of the non-volatile memory.

Claims

1. A method of controlling the temperature of the material at least one location in a hot-half of a mold, comprising the steps of:

coupling a system controller to the hot-half of the mold to provide a communication path therebetween and to provide power from the system controller to at least one heating element in the hot-half;

communicating to the system controller temperature data along the communication path from a memory housed at and mounted to the hot-half;

providing a controlled amount of power from the system controller to the heating element in accordance with the temperature data communicated to the system controller; and

updating the temperature data via a user input at the system controller and communicating the updated temperature data to the memory via the communication path.

2. The method of claim 1 wherein the step of coupling a system controller to the hot-half of the mold includes the steps of selectively attaching via a junction box at the hot-half:

1) a source of power at the system controller to at least one heating element at the hot-half,

     2) at least one thermocouple at the hot-half to the system controller, and

     3) a communications medium between the system controller and the memory at the hot-half.

3. The method of claim 1 wherein the step of communicating to the system controller the temperature data includes the steps of formatting at least one data record at the hot-half having the stored temperature data therein and transmitting the formatted data record to the system controller.

4. The method of claim 2 further comprising the steps of receiving the communicated data from the system controller at the hot-half and writing the received data to the non-volatile memory.

5. The method of claim 1 wherein the steps of updating temperature data via user input at the system controller and communicating the updated temperature data to the memory via the communication path include the steps of formatting the updated temperature data at the system controller into at least one formatted data record including a type field and data field, the data field having the updated temperature data therein, and transmitting the formatted data record to the hot-half.

6. The method of claim 5 further comprising the steps of providing error checking information in the formatted data record transmitted by the system controller, receiving the data record at the hot-half, verifying the received data record against the error checking information therein, and returning a signal from the hot-half to the system controller indicative of the result of the verification.

8. The apparatus of claim 1 further comprising communications circuitry at the hot-half and connected to the non-volatile memory therein for communicating information between the non-volatile memory and the communications controller at the system controller.

9. The apparatus of claim 8 wherein the communications circuitry at the hot-half includes means for formatting information in the non-volatile memory into data records, the data records hazing fields therein including record type fields and data fields, and means for evaluating record type fields received from the communications controller at the system controller, such that the communications circuitry at the hot-half communicates with the communications controller at the system controller by transmitting formatted data records therebetween.

10. The apparatus of claim 8 wherein the communications circuitry at the hot-half includes a transceiver for communicating with the system controller via an RS-232 communications protocol.

7. An apparatus for providing material to a cold-half of a mold at a selected temperature, the apparatus comprising:

a hot-half of the mold for mating with the cold-half, the hot-half including a flow passage for providing material to the mold when the hot-half is mated with the cold-half, a heater for elevating the temperature of the material at a selected location of the hot-half, a non-volatile memory for storing initial and historical information including data for controlling the temperature of the heater, a junction box mounted to the hot-half and including at least one connector in communication with the heater and the non-volatile memory;

a connector extending from a system controller for connecting with the at least one connector of the junction box such that the hot-half is selectively attachable to the system controller;

an input device for inputting current settings for a molding operation based on the initial historical information;

a communications controller within the system controller for communicating with the memory of the hot-half to obtain the initial and historical information therein and for writing the current settings into the non-volatile memory in order to update the historical information, and the system controller further including a heater controller for outputting power signals to control the temperature of the heater in accordance with the information.

11. The apparatus of claim 7 wherein the non-volatile memory comprises an EEPROM.

12. The apparatus of claim 7 wherein the cold-half includes a plurality of molds therein and the flow passage includes a manifold for distributing the material to the molds.

13. The apparatus of claim 7 wherein the non-volatile memory comprises an EEPROM.

14. The apparatus of claim 7 wherein the cold-half includes a plurality of molds therein and the flow passageway includes a manifold for distributing the material to the molds.

15. A hot-half for a mold for mating with a cold-half of the mold, the hot-half comprising:

a substrate shaped to mate with the cold-half in registration;

a flow passageway for communicating liquefied material to the cold half;

a heating element interposed in the flow passage way for heating the liquefied material;

a junction box for coupling the heating element to an external source of power and control; and

, a non volatile memory for storing initial and historical information indicative of an appropriate temperature setting for the heating element to produce products of a molding process performed by the hot and cold halves.

16. The apparatus of claim 15 further comprising communications circuitry at the hot-half for communicating the information indicative of an appropriate temperature setting for the heating element to the external source of power and control.

17. The apparatus of claim 16 wherein the communications circuitry at the hot-half includes means for formatting information in the non-volatile memory into data records, each data records having fields therein including a record type field and a data field, and means for evaluating received record type fields such that the communications circuitry communicates with the external source of power and control by transmitting formatted data records therebetween.

18. The apparatus of claim 16 wherein the communications circuitry at the hot-half includes a transceiver for communicating with the system controller via an RS-232 communications protocol.