Electronics mounting plate with heat exchanger and method for manufacturing same

• US 5,796,049 A
• Filed: 04/04/1997
• Issued: 08/18/1998
• Est. Priority Date: 04/04/1997
• Status: Expired due to Fees

• Current Assignee: Sundstrand Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: Sundstrand Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Schneider, Michael G.
• Primary Examiner(s): Ledynh, Bot L.
• Assistant Examiner(s): SODERQUIST, KRISTINA D
• Application Number:
  US08/832,998
• Time in Patent Office: 501 Days
• Field of Search: 361/704, 361/705, 361/707, 361/708, 361/709, 361/710, 361/717, 361/718, 361/719, 361/720, 361/721, 174/252, 174/250, 174/257, 174/260, 174/258, 257/706, 257/707, 257/722
• US Class Current: 174/252
• CPC Class Codes: H01L 23/3733 having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures H01L23/3732, H01L23/3737 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20481 characterised by the material composition exhibiting specific thermal properties
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A combined electronics mounting plate and heat exchanger and method of manufacturing same. The present invention provides an electronics mounting plate formed from a metal matrix composite and a metal heat exchanger in order to combine the low coefficient of thermal expansion and high heat dissipation characteristics of a metal matrix composite, with the cost effectiveness and relatively easy manufacturability of metal. In the preferred embodiment, the metal matrix composite is provided in the form of aluminum and silicon carbide, and the metal heat exchanger is provided in the form of aluminum fins. The method of manufacturing the present invention includes the steps of cleaning the metal matrix composite mounting plate and aluminum heat exchanger in a nitric acid fluoride salt before brazing the elements together. In one embodiment of the present invention the metal matrix composite mounting plate includes pin fins extending toward the aluminum heat exchanger fins, and an additional aluminum braze sheet is provided between the mounting plate and heat exchanger fins to enhance the brazement therebetween and improve the thermal conductivity of the resulting mounting plate and heat exchanger.

Claims

1. A combination electronics mounting plate and heat exchanger, comprising:

a substrate made of metal matrix composite having a first planar surface and a second, opposed planar surface, the first planar surface having electronic components mounted directly thereon, the substrate including a plurality of pin fins integrally formed therewith, and extending from, the second planar surface to increase the total surface area and enhance the thermal conductivity and heat dissipation of the substrate; and

a heat exchanger having a plurality of fins brazed directly to the second, opposed planar surface of the substrate, the plurality of heat exchanger fins being interposed between the substrate pin fins, the pin fins being laterally spaced from the heat exchanger fins to increase the surface area of the substrate and heat exchanger.

2. The combination electronics mounting plate and heat exchanger of claim 1 wherein the metal matrix composite is formed from aluminum and silicon carbide.

3. The combination electronics mounting plate and heat exchanger of claim 1 wherein the heat exchanger fins are formed from aluminum.

4. The combination electronic mounting plate and heat exchanger of claim 1 wherein a braze foil is disposed between the substrate and the heat exchanger fins.

5. The combination electronic mounting plate and heat exchanger of claim 1 wherein a braze paste is disposed between the substrate and the heat exchanger fins.

6. The combination electronics mounting plate and heat exchanger of claim 5 wherein the braze paste is formed from aluminum.