High-frequency integrated circuit device having a multilayer structure

• US 5,796,165 A
• Filed: 04/26/1996
• Issued: 08/18/1998
• Est. Priority Date: 03/19/1996
• Status: Expired due to Term

• Current Assignee: Collabo Innovations, Inc. (Wi-LAN Inc.)
• Original Assignee: Matsushita Electric Corporation (Panasonic Holdings Corporation)
• Inventors: Tateoka, Kazuki, Yoshikawa, Noriyuki, Kanazawa, Kunihiko, Makioka, Satoshi
• Primary Examiner(s): Thomas, Tom
• Assistant Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US08/638,264
• Time in Patent Office: 844 Days
• Field of Search: 257/700, 257/686, 257/698, 257/699-706, 257/708, 257/712, 257/713, 257/717, 257/720, 257/728, 257/723-725, 257/758, 257/778
• US Class Current: 257/728
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/49805 the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/05432 : Al2O3
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 : Multilayer substrate
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19106 : in a mirrored arrangement on two different side of a common die mounting substrate
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/0237 : High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0298 : Multilayer circuits
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/183 : Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 3/4611 : by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: H05K 3/4629 : laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Abstract

A multilayer structure composed of a plurality of substrates stacked in layers is provided with a cavity formed by partially removing some of the substrates. A semiconductor chip internally provided with an active component such as an FET is mounted on the bottom face of the cavity. Passive components including a high-frequency matching circuit and a bias circuit are distributed in the uppermost layer, lowermost layer, and middle layer lying between the substrates of the multilayer structure. For example, a chip component partially composing the high-frequency matching circuit is disposed in the uppermost layer, while the bias circuit is disposed in the middle layer. Since only a reduced number of substrates underlie the semiconductor chip internally provided with the active component primarily serving as a heating element, an excellent heat dissipating ability is retained even when each of the substrates of the multilayer structure is composed of a versatile material such as alumina. By utilizing the characteristic, there can be implemented a high-frequency integrated circuit device exhibiting a high degree of integration and usable in mobile communication such as a portable telephone.

Claims

1. A high-frequency integrated circuit device having a plurality of circuit components including at least one active component for a high-frequency signal and a plurality of passive components, said high-frequency integrated circuit device comprising:

a multilayer structure comprising a plurality of substrates composed of a dielectric material, wherein said circuit components are disposed on an upper surface of an uppermost substrate, in at least one middle layer corresponding to a region lying between the substrates, on a lower surface of a lowermost substrate, and on a side layer formed by side surfaces of said respective substrates;

a cavity formed by removing a part of the substrate of said multilayer structure including said uppermost substrate; and

a semiconductor chip mounted on a bottom surface of said cavity, said semiconductor chip comprising said active component,

said passive components being distributed in said uppermost substrate and said middle layer of said multilayer structure, wherein

said semiconductor chip mounted in said cavity is sealed with a resin, and said upper surface of said uppermost substrate and an upper surface of the resin are substantially flush with one another.

2. A high-frequency integrated circuit device according to claim 1, further comprising:

a member for heat radiation provided on a region of a lower surface of the lowermost substrate in said multilayer structure located underneath said semiconductor chip.

3. A high-frequency integrated circuit device according to claim 2, further comprising:

a through hole formed in the substrate underlying the cavity of said multilayer structure, said through hole extending between a region in which said semiconductor chip is formed and a region in which said member for heat radiation is formed, and

a heat conductive member disposed in said through hole.

4. A high-frequency integrated circuit device according to claim 1, wherein

each of said substrates in said multilayer structure is composed of at least one of aluminum oxide and aluminum nitride.

5. A high-frequency integrated circuit device according to claim 1, wherein

each of the substrates in said multilayer structure is composed of polycrystal phenylene oxide (PPO).

6. A high-frequency integrated circuit device according to claim 5, further comprising:

a member for heat radiation provided on a region of the lower surface of the lowermost substrate in said multilayer structure located underneath said semiconductor chip;

a through hole formed by selectively removing a portion of the substrate underlying the cavity of said multilayer structure lying between said semiconductor chip and said member for heat radiation; and

a heat conductive member disposed in said through hole.

7. A high-frequency integrated circuit device according to claim 1, wherein

of said substrates in said multilayer structure, the one underlying said cavity is composed of at least one of aluminum oxide and aluminum nitride and

each of the substrates except the one underlying said cavity in said multilayer structure is composed of a glass ceramic.

8. A high-frequency integrated circuit device according to claim 1, wherein

said circuit components include a bias circuit having a filter circuit and a high-frequency matching circuit,

said filter circuit and said high-frequency matching circuit are distributed in discrete ones of the layers of said multilayer structure, and

a fundamental frequency of said high-frequency integrated circuit device is 800 MHz or higher.

9. A high-frequency integrated circuit device according to claim 1, wherein

at least one step portion is formed in the cavity of said multilayer structure so as to provide a mezzanine surface higher in level than said bottom surface of the cavity,

said circuit components include an interconnect layer formed on said mezzanine surface, and

the semiconductor chip on the bottom surface of said cavity is connected to said interconnect layer by means of bonding wires.

10. A high-frequency integrated circuit device according to claim 9, wherein

the respective highest portions of said bonding wires are lower in level than the upper surface of the uppermost substrate of said multilayer structure.

11. A high-frequency integrated circuit device according to claim 1, wherein

said semiconductor chip is mounted by flip-chip bonding on the substrate forming the bottom surface of said cavity with a surface of the semiconductor chip provided with said active component facing the bottom surface of said cavity.

12. A high-frequency integrated circuit device according to claim 1, wherein

said circuit components include a high-frequency matching circuit composed of a microstrip line and a chip component and an interconnect layer, said high-frequency matching circuit and said interconnect layer being disposed in the uppermost layer of said multilayer structure, and

said interconnect layer except for a portion to be soldered and said high-frequency matching circuit including said chip component except for the microstrip line for impedance matching are selectively coated with a coating material composed of either one of a resin-based material and a glass-based material.

13. A high-frequency integrated circuit device according to claim 1, wherein

the uppermost layer of said multilayer structure is coated with a coating material composed of either one of a resin-based material and a glass-based material and having a thickness sufficient to prevent other components from protruding from a planarized top face of said coating material.

14. A high-frequency integrated circuit device according to claim 13, wherein

the planarized top face of said coating material is coated with an electrically conductive material.

15. A high-frequency integrated circuit device according to claim 1, wherein

said circuit components include a bias circuit having a filter circuit and

a width of a microstrip line of said filter circuit is 200 μ

m or more.

16. A high-frequency integrated circuit device according to claim 15, wherein

said circuit components include a chip component partially composing a high-frequency matching circuit and

said chip component is mounted on the uppermost substrate of said multilayer structure.

18. A high-frequency integrated circuit device according to claim 1, wherein

a circuit component of an edge electrode is formed at said side layer of said multilayer structure.

19. A high-frequency integrated circuit device according to claim 1, wherein

said circuit component of said passive components disposed on the said upper surface of said uppermost substrate serves as a condenser or a resistance chip.

17. A high-frequency integrated circuit device having a plurality of circuit components including at least one active component for a high-frequency signal and a plurality of passive components, said high-frequency integrated circuit device comprising:

a multilayer structure comprising a plurality of substrates composed of a dielectric material, wherein said circuit components are disposed on an upper surface of an uppermost substrate, in at least one middle layer corresponding to a region lying between the substrates, on a lower surface of a lowermost substrate, and on a side layer formed by side surfaces of said respective substrates;

a cavity formed by removing a part of the lowermost substrate; and

a semiconductor chip having said active components and mounted by flip-chip bonding on a bottom surface of said cavity with a front face of the semiconductor chip facing the bottom surface of said cavity,

wherein a back face of said semiconductor chip can be brought into contact with equipment on which the high-frequency integrated circuit device is to be mounted, and

said circuit components of said active component is distributed in upper surface of said uppermost substrate and said middle layer of said multilayer structure.