Single chip solution for multimedia GSM mobile station systems

• US 5,799,091 A
• Filed: 05/24/1996
• Issued: 08/25/1998
• Est. Priority Date: 05/24/1996
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: LSI Logic Corporation (Broadcom, Inc.)
• Inventors: Lodenius, Johan
• Primary Examiner(s): Cain, David C.
• Application Number:
  US08/653,675
• Time in Patent Office: 823 Days
• Field of Search: 380/49, 364/131, 364/134, 375/295
• US Class Current: 380/270
• CPC Class Codes: H04B 7/2609 Arrangements for range control, e.g. by using remote antennas

Abstract

According to the present invention, a single chip semiconductor devices is provided. In one version of the invention, a single chip CMOS technology architecture is used to implement all or various combinations of baseband radio transmission, baseband interfaces and filtering, source coding, source interfaces and filtering, control and supervision, power and clock management, keyboard and display drivers, memory management and code compaction, digital signal processing ("DSP") and DSP memory and radio interface functions.

Claims

1. A single chip semiconductor device useful in a GSM mobile station system which includes an RF module for transmitting and receiving radio signals, the semiconductor device comprising:

a source coding bank ("SCB") having a data port interface in electrical communication with a data codec, an audio interface in electrical communication with a speech codec, and a video interface having digital-to-analog and analog-to-digital converters in electrical communication with a video codec;

a control-radio interface ("CRI") having a source codec selector in electrical communication with the data codec, the speech codec and the video codec;

a radio transceiver ("RTX") in electrical communication with the CRI via an RTX control interface, the RTX having a baseband interface coupled to the RF module.

2. A semiconductor device as in claim 1 wherein the data port interface comprises:

a serial port interface in electrical communication with a FAX modem.

3. A semiconductor device as in claim 2 wherein the serial port interface driver comprises a PCMCIA driver.

4. A semiconductor device as in claim 1 wherein the audio interface comprises a voice coder for receiving electrical signals from a microphone, and a voice decoder for providing signals to a speaker.

5. A semiconductor device as in claim 1 wherein the video interface comprises a video DAC/ADC.

6. A semiconductor device as in claim 3 wherein the video interface further comprises a video driver for receiving electrical signals from a CCD camera and for providing electrical signals to a video monitor.

7. A semiconductor device as in claim 1 wherein the CRI comprises a CRI bus providing electrical communication between the source codec selector, the RTX control interface and a plurality of functional modules.

8. A semiconductor device as in claim 5 wherein the plurality of functional modules comprises a digital signal processing module having an electronic memory and a Viterbi Accelerator circuit.

9. A semiconductor device as in claim 5 wherein the plurality of functional modules comprises an MCU and a BIU which provides electrical communication between the MCU and external electronic memory.

10. A semiconductor device as in claim 5 wherein the plurality of functional modules comprises an SIM interface.

11. A semiconductor device as in claim 5 wherein the plurality of functional modules comprises a display driver.

12. A semiconductor device as in claim 5 wherein the plurality of functional modules comprises a keyboard driver.

13. A semiconductor device as in claim 5 wherein the plurality of functional modules comprises clock and power management circuitry.

14. A semiconductor device as in claim 5 wherein the plurality of functional modules comprises an RF control interface.

15. A semiconductor device as in claim 1 wherein the baseband interface comprises a GMSK modulator which provides electrical signals to the external RF module, and a GMSK detector which receives signals from an external RF module.

16. A semiconductor device as in claim 1 wherein the RTX further comprises an RTX control bus which provides electrical communication between the source code selector, the RTX control interface, the baseband interface and a plurality of RTX functional modules.

17. A semiconductor device as in claim 16 wherein the plurality of RTX functional modules comprises a channel coder.

18. A semiconductor device as in claim 16 wherein the plurality of RTX functional modules comprises a channel-viterbi decoder.

19. A semiconductor device as in claim 16 wherein the plurality of RTX functional modules comprises circuits for interleaving and ciphering transmission signals which are provided to the baseband interface.

20. A semiconductor device as in claim 16 wherein the plurality of RTX functional modules comprises circuits for deinterleaving and deciphering received signals from the baseband interface.

21. A semiconductor device as in claim 16 wherein the plurality of RTX functional modules comprises a burst format circuit.

22. A semiconductor device as in claim 16 wherein the plurality of RTX functional modules comprises a viterbi equalizer circuit.

23. A semiconductor device as in claim 9 wherein the MCU comprises a code compaction unit.

24. A semiconductor device as in claim 1 wherein the baseband interface is coupled to an RF module for transmitting and receiving radio signals.

25. A semiconductor device as in claim 1 wherein the audio interface comprises a voice coder for receiving electrical signals from a microphone, and a voice decoder for providing signals to a speaker.