Reducing hydrogen concentration in pecvd amorphous silicon carbide films

• US 5,800,878 A
• Filed: 10/24/1996
• Issued: 09/01/1998
• Est. Priority Date: 10/24/1996
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Yao, Xiang Yu
• Primary Examiner(s): Niebling, John
• Assistant Examiner(s): LEBENTRITT, MICHAEL
• Application Number:
  US08/738,137
• Time in Patent Office: 677 Days
• Field of Search: 427/574, 427/577, 427/578, 427/573, 438/479, 438/931
• US Class Current: 427/573
• CPC Class Codes: C22B 7/001 Dry processes
• CPC Class Codes: F23G 2209/12 Sludge, slurries or mixtures of liquids
• CPC Class Codes: F23G 5/28 having raking arms
• CPC Class Codes: F23G 5/38 Multi-hearth arrangements
• CPC Class Codes: F23L 2900/07005 Injecting pure oxygen or oxygen enriched air
• CPC Class Codes: F26B 17/003 with fixed floors provided with scrapers F26B17/006 and F26B17/007 take precedence
• CPC Class Codes: F26B 23/02 using combustion heating F26B3/305, F26B13/186, F26B21/001, F26B23/10 take precedence
• CPC Class Codes: F27B 9/185 multiple hearth type furnaces
• CPC Class Codes: Y02E 20/34 Indirect CO2mitigation, i.e. by acting on non CO2directly related matters of the process, e.g. pre-heating or heat recovery
• CPC Class Codes: Y02P 10/143 of methane [CH4]
• CPC Class Codes: Y02P 10/20 Recycling
• CPC Class Codes: Y10S 438/931 Silicon carbide semiconductor

Abstract

The present invention provides a plasma enhanced chemical vapor deposition method and apparatus for reducing the hydrogen concentration in amorphous silicon carbide films deposited on a substrate. The process combines a noble gas such as helium with a silicon source such as silane and a carbon source such as methane in the reaction zone of a CVD chamber. The resulting silicon carbide films have a low concentration of hydrogen and high compressive stress. The films are preferably produced with a plasma generated by a mixture of high and low radio frequency.

Claims

1. A method for depositing a silicon carbide film onto a substrate, comprising the steps of:

providing a silicon source, a carbon source, and a noble gas in a reaction zone containing a substrate; and

reacting the silicon source and the carbon source in the presence of a plasma to deposit a silicon carbide film on the substrate;

wherein the plasma is generated using mixed frequency RF power.

2. The method of claim 1, wherein a ratio of low frequency RF power to total mixed frequency RF power is less than about 0.6.

3. The method of claim 1, wherein the carbon source is methane, the silicon source is silane, and the noble gas is helium.

4. The method of claim 1, wherein the reaction of the silicon source and the carbon source is carried out at a reaction zone pressure between about 1.5 and about 6.0 torr.

5. The method of claim 1, wherein the reaction of the silicon source and the carbon source is carried out at a substrate temperature of between about 150°

C. and about 600°

C.

6. The method of claim 1, wherein the high frequency RF power is selected from about 10 to about 15 MHz and the low frequency RF power is selected from about 150 to about 450 KHz.

7. The method of claim 2, wherein the low frequency RF power is selected from 325 to 375 KHz.

8. The method of claim 2, wherein the high frequency RF power is selected from 13 to 14 MHz.

9. A method for plasma enhanced chemical vapor deposition of a silicon carbide film having a reduced concentration of hydrogen onto a substrate surface, comprising the steps of:

supplying a noble gas and reactant gases comprising a silicon source and a carbon source into a deposition chamber containing a substrate;

applying a radio frequency bias sufficient to generate a plasma adjacent a surface of the substrate; and

reacting the silicon source and the carbon source in the presence of the plasma to deposit a silicon carbide film on the surface of the substrate;

wherein the radio frequency bias comprises a high frequency bias and a low frequency bias.

10. The method of claim 9, wherein the high frequency bias is from about 10 to about 15 MHz and the low frequency bias is from about 150 to about 450 KHz.

11. The method of claim 10, wherein a ratio of low frequency RF power to total RF power is less than about 0.6.

12. An improved plasma enhanced chemical vapor deposition process comprising the steps of supplying reactant gases comprising a silicon source and a carbon source into a deposition chamber containing a substrate, applying a radio frequency bias sufficient to generate a plasma adjacent a surface of the substrate, and reacting the silicon source and the carbon source in the presence of the plasma to deposit a silicon carbide film on the surface of the substrate, the improvement comprising the steps of supplying a noble gas with the reactant gases, and coupling a mixed radio frequency bias into the chamber.

13. The improved process of claim 12, wherein the mixed radio frequency bias comprises a high frequency RF bias from 13 to 14 MHz and a low frequency RF bias from 325 to 375 KHz.

14. The process of claim 13, wherein a ratio of low frequency RF power from the low frequency RF bias to the total power from both the low frequency RF bias and the high frequency RF bias is less than about 0.6.