Electroless copper plating method for forming integrated circuit structures
First Claim
1. A method for fabricating a copper containing integrated structure within an integrated circuit comprising:
- providing a substrate layer;
forming a nickel containing conductor layer over the substrate layer; and
forming upon the nickel containing conductor layer a copper containing conductor layer, where the copper containing conductor layer is employed within a copper containing integrated circuit inductor structure within the integrated circuit.
2 Assignments
0 Petitions
Accused Products
Abstract
A method for fabricating a copper containing integrated circuit structure within an integrated circuit, and the copper containing integrated circuit structure formed through the method. There is first provided a substrate layer. There is then formed through a first electroless plating method a nickel containing conductor layer over the substrate layer. There is then activated the nickel containing conductor layer to form an activated nickel surface of the nickel containing conductor layer. Finally, there is then formed through a second electroless plating method a copper containing conductor layer upon the nickel containing conductor layer. Optionally, there may be formed a polysilicon layer over the substrate prior to forming the nickel containing conductor layer over the substrate, where the nickel containing conductor layer is formed upon the polysilicon layer. Optionally, there may also be formed a second nickel containing conductor layer upon the copper containing conductor layer. The method is useful in forming copper containing integrated circuit inductor structures within integrated circuits.
102 Citations
18 Claims
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1. A method for fabricating a copper containing integrated structure within an integrated circuit comprising:
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providing a substrate layer; forming a nickel containing conductor layer over the substrate layer; and forming upon the nickel containing conductor layer a copper containing conductor layer, where the copper containing conductor layer is employed within a copper containing integrated circuit inductor structure within the integrated circuit. - View Dependent Claims (2, 3, 4, 5, 18)
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6. A method for fabricating a copper containing integrated circuit structure within an integrated circuit comprising:
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providing a substrate layer; forming over the substrate layer a polysilicon layer; forming through a first electroless plating method a nickel containing conductor layer upon the polysilicon layer; activating the nickel containing conductor layer to form an activated nickel surface of the nickel containing conductor layer; and forming through a second electroless plating method a copper containing conductor layer upon the nickel conductor layer. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification