Microelectronic connections with solid core joining units

• US 5,801,446 A
• Filed: 03/28/1995
• Issued: 09/01/1998
• Est. Priority Date: 03/28/1995
• Status: Expired due to Term

• Current Assignee: Tessera, Inc. (Adeia, Inc.)
• Original Assignee: Tessera, Inc. (Adeia, Inc.)
• Inventors: DiStefano, Thomas H., Solberg, Vernon
• Primary Examiner(s): Thomas, Tom
• Assistant Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US08/411,472
• Time in Patent Office: 1,253 Days
• Field of Search: 257/778, 257/772, 257/777, 257/779, 257/780, 257/738, 257/723, 257/730
• US Class Current: 257/778
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2225/0652 Bump or bump-like direct electrical connections from substrate to substrate
• CPC Class Codes: H01L 2225/06579 TAB carriers; beam leads
• CPC Class Codes: H01L 23/3157 Partial encapsulation or coating mask layer used as insulation layer H01L21/31
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices

Abstract

A microelectronic component such as a semiconductor chip having electrical contacts is provided with terminals, the terminals being movable relative to the component. A joining unit having a solid core is disposed on each terminal and extends upwardly, away from the component. Each unit includes a bonding material such as a solder bonding the terminal and the solid core, the bonding material desirably defining a waist or narrow section spaced above the terminal, the waist having a curved surface forming a stress-relieving fillet. The joining units are bonded to contact pads of a substrate such as a circuit panel as by bonding the solder of the joining units to the terminals, or by means of a further solder on the contact pads having a lower melting point. The assembly provides substantial resistance to mechanical stress caused by thermal expansion. Preferably, the terminals are movable in vertical directions towards the component to compensate for nonplanarity during assembly.

Claims

1. A microelectronic assembly comprising:

(a) a microelectronic component having electrical contacts;

(b) a plurality of terminals adjacent said component, each said terminal being connected to at least one contact of the component but movable relative to said component; and

(c) a plurality of joining units, each said unit including a solid core disposed on one said terminal and extending upwardly therefrom; and

(d) a unit bonding material having a first melting temperature securing each core to the terminal.

2. An assembly as claimed in claim 1 wherein said component has a top surface, said terminals overlie said top surface and each said terminal is movable with respect to said component in horizontal directions parallel to said top surface.

3. An assembly as claimed in claim 2 wherein each said terminal is vertically displaceable towards said top surface independently of other ones of said terminals.

4. An assembly as claimed in claim 2 or claim 3 further comprising a compliant layer disposed between said terminals and said component, said compliant layer being deformable to accommodate movement of said terminals and joining units relative to said component.

5. An assembly as claimed in claim 4 further comprising a flexible dielectric film disposed above said compliant layer, said terminals being mounted on said film.

6. An assembly as claimed in claim 5 wherein said compliant layer includes an adhesive material which bonds said film to said top surface of said component.

7. An assembly as claimed in claim 5 wherein said compliant layer includes an elastomer.

8. An assembly as claimed in claim 5 wherein said compliant layer includes a gel.

9. An assembly as claimed in claim 2 or claim 3 wherein said component includes a semiconductor chip and at least one support element disposed alongside said semiconductor chip, said at least one support element and said chip cooperatively defining the top surface of the component, at least some of said terminals overlying said at least one support element.

10. An assembly as claimed in claim 9 wherein said at least one support element includes a ring encircling the chip, said ring having a flat top surface forming a part of said top surface of said component.

11. An assembly as claimed in claim 1 or claim 2 or claim 3 further comprising a proximal substrate overlying said terminals and said joining units, said substrate having contact pads thereon, said joining units being bonded to said contact pads on said proximal substrate.

12. An assembly as claimed in claim 11 wherein said proximal substrate is substantially rigid.

13. An assembly as claimed in claim 11 further comprising a pad bonding material having a second melting temperature less than said first melting temperature, said joining units being bonded to said contact pads by said pad bonding material, whereby said proximal substrate can be removed from the assembly without disassembling said joining units from said terminals by heating the assembly to a first disassembly temperature above said second melting temperature but below said first melting temperature.

14. An assembly as claimed in claim 11 wherein said unit bonding material is a first solder and said pad bonding material is a second solder.

15. An assembly as claimed in claim 14 further comprising interconnect pads on said proximal substrate electrically connected to the contact pads of the proximal substrate, whereby said interconnect pads are also connected to the contacts of the microelectronic component through said joining units and terminals, the assembly further comprising a third solder on said interconnect pads, said third solder having a third melting temperature lower than said second melting temperature.

16. An assembly as claimed in claim 15 further comprising a distal substrate having electrical connections bonded to said interconnect pads of said proximal substrate by said third solder.

17. An assembly as claimed in claim 1 wherein each terminal includes a seat in the form of a surface of revolution about a vertical axis and wherein the core of each joining unit is engaged in the seat of the associated terminal.

18. An assembly as claimed in claim 1 wherein the unit bonding material of each said joining unit defines a terminal-side waist at which the horizontal dimensions of the unit bonding material are at a minimum, each said terminal-side waist being spaced above the terminal, said cores having melting or decomposition temperature above the first melting temperature of said unit bonding material.

19. An assembly as claimed in claim 18, further comprising a solder mask surrounding each said terminal, the terminal-side waist of each joining unit being disposed above the solder mask surrounding the associated terminal.

20. An assembly as claimed in claim 18, wherein each said core is substantially spherical.

21. An assembly as claimed in claim 5, wherein the unit bonding material of each joining unit extends horizontally outwardly on the associated terminal to the solder mask layer.

22. An assembly as claimed in claim 18, further comprising a proximal substrate having contact pads thereon disposed above said joining units, each said joining unit being bonded to one said contact pad, each said joining unit defining a pad-side waist remote from the contact pad.

23. A microelectronic subassembly comprising:

(a) a first element defining a plurality of terminals, each said terminal including a generally conical seat;

(b) a plurality of joining units, each said unit including a substantially spherical solid core engaged in the conical seat of said terminal and extending upwardly therefrom, whereby the centers of center said solid cores are aligned with said conical seat, and

(c) solder extending over the terminal and over the core, said cores having a solidus temperature higher than the melting temperature of said solder.

24. An assembly as claimed in claim 23 wherein said first element includes a microelectronic component having contacts, each said terminal being connected to a contact of the component, the assembly further comprising a compliant layer disposed between said terminals and said component, each said terminal being movable relative to said component.

25. A microelectronic assembly comprising:

(a) a first element defining a plurality of terminals;

(b) a plurality of joining units disposed on said terminals and extending upwardly therefrom, each said unit including a solid core;

(c) a unit bonding material extending between each terminal and core, said cores having a solidus temperature higher than the melting temperature of said unit bonding material;

(d) a substrate having contact pads; and

(e) a pad bonding material on said contact pads, said pad bonding material having a melting temperature less than the melting temperature of said unit bonding material, said joining units being bonded to said contact pads by said pad bonding material, whereby said substrate can be removed from the assembly without disassembling said joining units from said terminals by heating the assembly to a temperature above the melting temperature of said pad bonding material but below the temperature of said unit bonding material.

26. An assembly as claimed in claim 25 wherein said unit and pad bonding materials are first and second solders.

27. An assembly as claimed in claim 25 wherein said unit bonding material includes an alloy formed by diffusion bonding between said joining unit and said terminal and wherein said pad bonding material includes a solder.