Method of making a device including a metallized magnetic substrate

• US 5,802,702 A
• Filed: 09/04/1997
• Issued: 09/08/1998
• Est. Priority Date: 06/30/1994
• Status: Expired due to Fees

• Current Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Fleming, Debra Anne, Liptack, David Joseph, Roy, Apurba, Thomson, John Jr., Johnson, David Wilfred Jr., Law, Henry Hon, Lambrecht, Vincent George Jr.
• Primary Examiner(s): Hall, Carl E.
• Application Number:
  US08/923,591
• Time in Patent Office: 369 Days
• Field of Search: 29/602.1, 29/607, 29/608, 29/606, 29/852, 336/200
• US Class Current: 29/608
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 2017/004 with the coil helically wound around an axis without a core
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/09645 Patterning on via walls; Plural lands around one hole
• CPC Class Codes: H05K 2201/09854 Hole or via having special cross-section, e.g. elliptical
• CPC Class Codes: H05K 2203/1476 Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
• CPC Class Codes: H05K 3/005 Punching of holes
• CPC Class Codes: H05K 3/245 Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
• CPC Class Codes: H05K 3/403 Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence
• CPC Class Codes: H05K 3/4061 for via connections in inorganic insulating substrates
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49076 From comminuted material
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

The method of making a metallized magnetic substrate for devices including a magnetic component involves providing an unfired ceramic body. In one exemplary embodiment, the method further involves making one or more vias through the ceramic body, coating the via side walls with conductive material, forming an aperture through the ceramic body, such that an aperture edge intersects the via, and metallizing the unfired ceramic body such that a conductive pathway is formed that includes the conductive material in the via. Finally, the metallized unfired ceramic body is fired in conventional fashion, optionally followed by deposition of additional conductor material.

Claims

1. A method for making a device including at least one magnetic component, the device comprising a metallized substrate of ceramic magnetic material, the method comprising:

a) providing at least one layer of unfired magnetic material having a planar surface, said layer of unfired magnetic ceramic material to be referred to as the "unfired layer";

b) creating at least one via through the unfired layer, the via having an inner side wall surface;

c) coating, prior to step d), said inner side wall surface with conductive material to form a side wall conductive pathway;

d) forming at least one aperture through the unfired layer such that at least one aperture edge intersects the via;

e) metallizing at least a portion of the planar surface of the unfired layer such that the metallized surface portion forms a continuous region with the side wall conductive pathway to create a conductive winding about a portion of the unfired layer; and

f) firing the unfired layer with the conductive winding formed thereon such that said metallized substrate of magnetic ceramic material results.

3. A method according to claim 1 or 2, wherein said magnetic substrate comprises a ferrite.

4. A method according to claim 1 or 2, wherein said magnetic substrate comprises a nickel-zinc ferrite or a manganese-zinc ferrite.

5. A method according to claim 1 or 2, wherein said magnetic component comprises an inductor or a transformer.

6. A method according to claim 1 or 2, further comprising metallizing at least a portion of said planar surface to provide electronic circuit element interconnections on the substrate.

7. A method according to claim 1 or 2, further comprising plating additional metal upon said metallized portion and said side wall conductive pathway of said substrate of magnetic ceramic material.

8. A method according to claim 1 or 2, further comprising metallizing at least a portion of said planar surface to provide electronic circuit element interconnections on the substrate, and plating additional metal upon the interconnections.

9. A method according to claim 8 comprising plating at least 0.003 inches thickness of said additional metal.

10. A method according to claim 9, wherein said additional metal comprises copper.

11. A method according to claim 10, wherein said additional metal further comprises nickel.

12. A method according to claim 7 comprising plating at least 0.003 inches thickness of said additional metal.

2. A method for making a device including at least one magnetic component, the device comprising a metallized substrate of ceramic magnetic material, the method comprising:

providing at least one layer of unfired magnetic ceramic material having a planar surface, said layer of unfired magnetic ceramic material to be referred to as the "unfired layer";

creating at least one aperture through the unfired layer, the aperture having an inner side wall surface;

coating said inner side wall surface with conductive material;

forming a plurality of vias through the unfired layer such that the vias intersect at least one aperture edge removing the conductive material on portions of the aperture side wall defining at least one side wall conductive pathway;

metallizing at least a portion of the planar surface of the unfired layer such that the metallized surface portion forms a continuous conductive region with the side wall conductive pathway to create a conductive winding about a portion of the unfired layer; and

firing the unfired layer with the conductive winding formed thereon such that said metallized substrate of magnetic ceramic material results.