Low-profile socketed packaging system with land-grid array and thermally conductive slug
First Claim
1. An integrated circuit package disposed in a socket, comprising:
- an integrated circuit package, comprising;
a first thermally conductive slug;
an integrated circuit chip mounted on said first thermally conductive slug;
a device substrate attached to said first thermally conductive slug, said device substrate having a plurality of plated lands disposed on a bottom surface thereof;
a plurality of electrical connections between said integrated circuit chip and said device substrate, anda socket comprising;
a frame having a first surface and a second surface, and having an opening therethrough;
a plurality of spring contact elements disposed proximate to the opening in said frame, each of said spring contact elements extending through said frame from said first surface to said second surface, and each of said spring contact elements being held in contact with a corresponding one of said plated lands; and
a releasable holding means holding said integrated circuit package proximate to said frame.
1 Assignment
0 Petitions
Accused Products
Abstract
A socketed integrated circuit packaging system, including a packaged integrated circuit and a socket therefor, is disclosed. The integrated circuit package includes a device circuit board to which a thermally conductive slug is mounted; the underside of the device circuit board has a plurality of lands arranged in an array. The integrated circuit chip is mounted to the slug, through a hole in the device circuit board, and is wire-bonded to the device circuit board and thus to the lands on the underside. The socket is a molded frame, having a hole therethrough to receive the conductive slug of the integrated circuit package; the socket may also have its own thermally conductive slug disposed within the hole of the frame. The socket has spring contact members at locations matching the location of the lands on the device circuit board. The integrated circuit package may be inserted into the socket frame, held there by a metal or molded clip. A low profile, low cost, and high thermal conductivity package and socket combination, is thus produced.
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Citations
31 Claims
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1. An integrated circuit package disposed in a socket, comprising:
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an integrated circuit package, comprising; a first thermally conductive slug; an integrated circuit chip mounted on said first thermally conductive slug; a device substrate attached to said first thermally conductive slug, said device substrate having a plurality of plated lands disposed on a bottom surface thereof; a plurality of electrical connections between said integrated circuit chip and said device substrate, and a socket comprising; a frame having a first surface and a second surface, and having an opening therethrough; a plurality of spring contact elements disposed proximate to the opening in said frame, each of said spring contact elements extending through said frame from said first surface to said second surface, and each of said spring contact elements being held in contact with a corresponding one of said plated lands; and a releasable holding means holding said integrated circuit package proximate to said frame. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An integrated circuit package disposed in a socket, comprising:
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an integrated circuit package, comprising; a thermally conductive slug; an integrated circuit chip mounted on said thermally conductive slug; a device substrate attached to said thermally conductive slug, said device substrate having a plurality of plated lands disposed on a bottom surface thereof; a plurality of electrical connections between said integrated circuit chip and said device substrate; and a socket comprising; a frame having a first surface and a second surface, and having an opening therethrough; a plurality of spring contact elements disposed proximate to the opening in said frame, each of said spring contact elements being held in contact with a corresponding one of said plated lands; and a releasable holding means holding said integrated circuit package proximate to said frame. - View Dependent Claims (13, 14)
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15. An integrated circuit package disposed in a socket, comprising:
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a first thermally conductive slug having a first surface and a second surface; an integrated circuit chip mounted to the first surface of said first thermally conductive slug; a device substrate having a bottom surface, said device substrate being fixed to said first thermally conductive slug, the second surface of said first thermally conductive slug extending below the bottom surface of said device substrate; a plurality of electrical connections between said integrated circuit chip and said device substrate; a plurality of plated lands disposed on the bottom surface of said device substrate; a frame; a plurality of spring contact elements disposed in said frame, each of said spring contact elements extending through said frame; and a releasable holding means holding said device substrate proximate to said frame, each of said plated lands being in contact with a respective one of said spring contact elements. - View Dependent Claims (16, 17)
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18. An integrated circuit package mounted on a system substrate, comprising:
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a first thermally conductive slug having a first surface and a second surface; an integrated circuit chip mounted to the first surface of said first thermally conductive slug; a device substrate having a bottom surface, said device substrate being fixed to said first thermally conductive slug, the second surface of said first thermally conductive slug extending below the bottom surface of said device substrate; a plurality of electrical connections between said integrated circuit chip and said device substrate; a plurality of plated lands disposed on the bottom surface of said device substrate; a frame having a first surface and a second surface, and having a plurality of holes formed therethrough; a plurality of spring contact elements, each spring contact element being disposed in one of said holes; a plurality of conductive joints formed on a system substrate, each of said conductive joints being connected to a second end of a respective one of said spring contact elements such that said frame is fixed to said system substrate; and a releasable holding means holding said device substrate proximate to said frame, each of said plated lands being in contact with a first end of a respective one of said spring contact elements such that a plurality of conductive pathways are formed, each conductive pathway comprising one of said plated lands, one of said spring contact elements, and one of said conductive joints. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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Specification