Method and apparatus for an improved micromechanical modulator

• US 5,808,781 A
• Filed: 02/24/1997
• Issued: 09/15/1998
• Est. Priority Date: 02/01/1996
• Status: Expired due to Term

• Current Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Greywall, Dennis S., Arney, Susanne C., Walker, James A.
• Primary Examiner(s): Epps, Georgia Y.
• Assistant Examiner(s): BEY, DAWN MARIE
• Application Number:
  US08/805,255
• Time in Patent Office: 568 Days
• Field of Search: 359/290, 359/291, 216/72
• US Class Current: 359/291
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G02B 26/02 for controlling the intensity of light G02B26/004 takes precedence

Abstract

An improved modulator and methods for making the modulator are disclosed. A membrane, preferably circular in shape, is formed over a region of a substrate in such a way that a gap results between the membrane and substrate forming a modulator cavity. The membrane forms a continuous surface over the cavity. In particular, the membrane is not supported by discrete support arms, but rather extends beyond the modulator cavity. Preferably, holes are formed in the membrane to aid in damping its motion and to allow access to underlying layers during modulator formation. According to the method, the modulator is formed by forming a means for creating a gap between the substrate and the membrane, forming a membrane, forming a lateral conduit to aid in removing the means for creating the gap and, finally, by removing the means for creating the gap.

Claims

1. A method for forming a micromechanical modulator comprising the steps of:

(a) forming a composition for creating a gap between a substrate and a membrane;

(b) forming a membrane over the composition; and

(c) creating the gap by removing the composition by;

forming a lateral conduit by removing a first portion of said composition, and

removing a second portion of the composition utilizing the lateral conduit for access, wherein, the first portion is comprised of a first material that is physically adapted to be removed substantially more quickly than a second material comprising the second portion.

2. The method of claim 1 wherein step (a) further comprises the steps of:

(i) defining a modulator cavity; and

(ii) forming the means for creating a gap between the substrate and the membrane within the modulator cavity.

3. The method of claim 1 wherein step (b) further comprises the step of forming holes in the membrane.

4. The method of claim 1 wherein the physical adaptation of the first portion is that it comprises a rapidly-etchable material disposed on the second portion of the composition, wherein the rapidly-etchable materials is etchable at a much quicker rate than the second material comprising the second portion of the composition.

5. The method of claim 4 wherein step (c) further comprises providing an etch that rapidly removes the rapidly-etchable material.

6. The method of claim 5 wherein the etch also removes the second material.

7. The method of claim 5 wherein step (b) further comprises the step of forming holes in the membrane and step (c) further comprises providing the etch through the holes in the membrane.

8. A method for making a micromechanical modulator comprising the steps of:

(a) depositing a cavity-defining layer on a suitably-prepared substrate;

(b) patterning the cavity-defining layer into a desired shape that defines a region that will become a modulator cavity and further removes the cavity-defining layer from the substrate in the region;

(c) oxidizing the substrate in the region;

(d) depositing a rapidly-etchable layer on the oxidized substrate of step (c);

(e) patterning the rapidly-etchable layer;

(f) depositing a membrane-forming layer on the patterned rapidly-etchable layer;

(g) patterning the membrane-forming layer into a membrane, wherein holes are formed in the membrane; and

(h) removing the rapidly-etchable layer and the oxidized substrate.

9. A composition for forming a micromechanical modulator comprising:

a substrate;

a membrane supported above a portion of the substrate;

first and second layers comprising respective first and second materials, which layers are removed to form a gap between the membrane and the portion of the substrate, and further wherein the first layer is proximal to the membrane and the first material is etchable by a first etchant at a substantially faster rate than the second material.

10. The composition of claim 9, wherein the second material is an oxide formed within the portion of the substrate.

11. The composition of claim 9 wherein, the first layer is removed by the first etchant, it forms a lateral conduit by which one of either the first etchant or a second etchant is delivered to the second layer.

12. The composition of claim 11 wherein the first material is selected from the group consisting of phosphoro-silicate glass, boron-phosphoro-silicate glass, phosphoro-tetraorthosilicate, boron-phosphoro-tetraorthosilicate, plasma-enhanced chemical vapor deposition silicon nitride or silicon oxide, and spin-on-glass.

13. The composition of claim 11 wherein the first material is amorphous silicon or polycrystalline silicon.

14. The composition of claim 11 wherein the substrate is silicon and the membrane is silicon nitride.

15. A method for forming a feature in a structure wherein there is limited access to a region of a first layer, comprising a first material that must be etched to form the feature, comprising the steps of:

(a) forming a rapidly-etchable layer on the first layer, the rapidly-etchable layer comprising a second material that is etched rapidly via a first etch relative to the first material;

(b) forming a second layer on the rapidly-etchable layer;

(c) delivering the first etch to the rapidly-etchable layer, thereby removing it and forming a conduit; and

(d) delivering to the first layer, via the conduit, one of either the first etch, or a second etch if the first layer is not etchable by the first etch, to remove the region and form the feature.

16. The method of claim 15 wherein step (a) further comprises patterning the rapidly-etchable layer into a size and shape suitable for forming the feature.

17. The method of claim 15 wherein step (b) further comprises forming holes in the second layer by which etch is delivered to the rapidly-etchable layer.

18. The method of claim 15 wherein the step of forming a rapidly-etchable layer comprises forming a layer of material selected from the group consisting of phosphoro-silicate glass, boron-phosphoro-silicate glass, phosphoro-tetraorthosilicate, boron-phosphoro-tetraorthosilicate, plasma-enhanced chemical vapor deposition silicon nitride or silicon nitride, and spin-on-glass.

19. The method of claim 15 wherein the step of forming a rapidly-etchable layer comprises forming a layer of material selected from the group consisting of amorphous silicon or polycrystalline silicon.