Method for producing a smart card module for contactless smart cards
First Claim
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1. A method for producing a smart card module, which comprises:
- bonding one end of a thin wire onto a first contact zone of a semiconductor chip;
guiding the wire in a plurality of turns forming an antenna coil;
bonding the wire onto a second contact area of the semiconductor chip; and
placing the wire turns of the antenna coil and the semiconductor chip on a carrier body.
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Abstract
A method for producing a smart card module includes bonding one end of a thin wire onto a first contact zone of a semiconductor chip. The wire is guided in a plurality of turns forming an antenna coil. The wire is bonded onto a second contact area of the semiconductor chip. The wire turns of the antenna coil and the semiconductor chip are placed on a carrier body.
202 Citations
3 Claims
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1. A method for producing a smart card module, which comprises:
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bonding one end of a thin wire onto a first contact zone of a semiconductor chip; guiding the wire in a plurality of turns forming an antenna coil; bonding the wire onto a second contact area of the semiconductor chip; and placing the wire turns of the antenna coil and the semiconductor chip on a carrier body. - View Dependent Claims (2, 3)
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Specification