Interconnector with contact pads having enhanced durability

• US 5,810,607 A
• Filed: 09/13/1995
• Issued: 09/22/1998
• Est. Priority Date: 09/13/1995
• Status: Expired due to Term

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Shih, Da-Yuan, Fogel, Keith Edward, Norcott, Maurice, Lauro, Paul, Beaman, Brian
• Primary Examiner(s): Paumen, Gary F.
• Application Number:
  US08/527,733
• Time in Patent Office: 1,105 Days
• Field of Search: 439/66, 439/71, 439/91, 439/591
• US Class Current: 439/66
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01327 Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01R 12/714 with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
• CPC Class Codes: H01R 13/2414 conductive elastomers
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: Y10S 29/029 Molding with other step
• CPC Class Codes: Y10T 29/49158 with molding of insulated base
• CPC Class Codes: Y10T 29/49162 by using wire as conductive path
• CPC Class Codes: Y10T 29/49213 Metal

Abstract

A structure of an enhanced durability interconnector to reliably interconnect modules having high density type contacts, such as found in modules having solder ball connections (SBC), to a connecting article such as a printed circuit board. The structure comprising a means to provide the SBC type contact a mating surface having a wide contact area. Furthermore, the electrical connecting medium within the interconnector, which is embedded in an elastomeric material to provide compliance, is strengthened by using two or more embedded wires in combination for each wide contact area contact. The interconnector is incorporated into a fixture to compress the interconnector between the SBC module and the connecting article. The fixture having further capability to align the connections, control the compression pressure and to prevent over-compression.

Claims

1. A structure comprising:

a dielectric body of an elastomeric material having a first surface and a second surface;

at least two conductive members embedded in said body, each said member having two ends, one of said ends being a first end having an enlarged, substantially flat, wide surface area extending at least to said first surface, and a second one of said ends, extending at least to said second surface;

a component having at least one solder ball contact, said solder ball contact making connection with said first end of at least one of the two conductive members;

a connecting article having at least one article contact, said article contact making connection with said second end; and

a ball compression means for compressing said solder ball connection to said first end.

2. A structure as in claim 1, including a grouping means for grouping together said at least two said conductive members at their enlarged ends.

3. A structure of claim 2, in which said grouping means is comprised of a conductive pad.

4. A structure as in claim 3, in which said grouping means is comprised of a polymer pad, said pad having a metallic coating on the surface thereof, the coating for making electrical contact to said first end of the grouped conductive members and the solder ball contact.

5. A structure as in claim 4, further comprising a contact compression means for compressing said article contact to the second ends of the two conductive members.

6. A structure as in claim 5, in which said ball compression means further comprises at least one spacer disposed so as to prevent over compression.

7. A structure as in claim 6, in which said ball compression means further comprises at least one alignment means.

8. A structure as in claim 7, in which said ball compression means further comprises a collar disposed around said dielectric body.

9. A structure comprising:

a dielectric body of an elastomeric material having a first surface and a second surface;

a group of at least two conductive members embedded in said body, each said member having two ends, one of said ends being a first end at said first surface, and a second one of said ends extending at least to said second surface;

an enlarged substantially flat conductive pad at said first surface for making electrical connection therethrough to said group;

a component having at least one solder ball component contact, said component contact for making electrical connection with said conductive pad;

a connecting article having at least one article contact, said article contact making connection with said group at second end of said members; and

a compression means for compressing said component contact to said conductive pad.

10. The structure as in claim 9, including a contact compression means for compressing said article contact to said second end.

11. A structure of claim 10, in which said compression means further comprises at least one spacer disposed so as to prevent over compression.

12. A structure of claim 11, in which said compression means includes at least one alignment means;

and

said dielectric body includes a collar disposed around said elastomeric material.

13. A structure comprising:

a dielectric body of an elastomeric material having a first surface and a second surface;

a conductive member embedded in said body, said member having two ends, one of said ends being a first end having an enlarged, substantially flat, wide surface area extending at least to said first surface, and a second one of said ends extending at least to said second surface;

a component having at least one solder ball contact, said solder ball contact making connection with said first end of at least one of the two conductive members;

a connecting article having at least one article contact, said article contact making connection with said second end; and

a ball compression mean, for compressing said solder ball connection to said first end.

14. A structure as in claim 13, further comprising a contact compression means for compressing said article contact to the second end of the conductive member.

15. A structure as in claim 14, in which said ball compression means further comprises at least one spacer disposed so as to prevent over compression.

16. A structure as in claim 15, in which said ball compression means further comprises at least one alignment means.

17. A structure as in claim 16, in which said ball compression means further comprises a collar disposed around said dielectric body.

18. A structure as in claim 17, in which said at least one end being enlarged is coated with a metal selected from the group consisting of Au, Pd, Pt, Au alloy, Pd alloy and Pt alloy.