Plasma processing apparatus and method

• US 5,810,963 A
• Filed: 09/27/1996
• Issued: 09/22/1998
• Est. Priority Date: 09/28/1995
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Tomioka, Kazuhiro
• Primary Examiner(s): Breneman, Bruce
• Assistant Examiner(s): Weingart, Thomas W.
• Application Number:
  US08/722,464
• Time in Patent Office: 725 Days
• Field of Search: 156/627.1, 156/345, 216/61, 204/298.03, 204/298.32
• US Class Current: 156/345.28
• CPC Class Codes: C23C 16/509 using internal electrodes
• CPC Class Codes: H01J 2237/0206 Extinguishing, preventing or controlling unwanted discharges
• CPC Class Codes: H01J 37/32082 Radio frequency generated discharge H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence
• CPC Class Codes: H01J 37/32174 Circuits specially adapted for controlling the RF discharge

Abstract

In a conductive plasma process chamber, a susceptor, which serves as an electrode and on which a target substrate is placed, is arranged. During a plasma process, the process chamber is supplied with a process gas while being exhausted, so that the chamber is kept at a constant vacuum pressure. A RF power of 13.56 MHz from an RF power supply is amplified and applied to the susceptor through a directional coupler and a matching circuit. A reflection wave of the RF power reflected by the susceptor is extracted by the directional coupler and is subjected to envelope wave detection by a wave detector, to generate a wave detection signal. The wave detection signal is compared with a reference voltage in a comparator, to determine presence or absence of an occurrence of abnormal discharge. When abnormal discharge occurs, the RF power is cut off for a predetermined period of time and the abnormal discharge is damped.

Claims

1. A plasma processing apparatus comprising:

an airtight process chamber;

a support mechanism for supporting a target substrate in said process chamber;

an exhaust for exhausting said process chamber and setting said process chamber in a vacuum state;

a supply for supplying a process gas into said process chamber;

a first electrode for forming an electric field in said process chamber, thereby to turn said process gas into plasma;

an RF power supply for supplying an RF power to said first electrode;

a matching mechanism for matching impedance of said RF power with impedance of said plasma;

an extraction mechanism for extracting a reflection wave of said RF power reflected by said first electrode;

a wave detection mechanism for subjecting said reflection wave to envelope wave detection to generate a wave detection signal; and

an examination mechanism for determining presence or absence of an occurrence of abnormal discharge, from changes in amplitude of said wave detection signal.

2. An apparatus according to claim 1, wherein said examination mechanism comprises a comparator for comparing said wave detection signal with a reference voltage.

3. An apparatus according to claim 1, further comprising control mechanism for lowering a power value of said RF power for a period of time, when said examination mechanism determines presence of abnormal discharge.

4. An apparatus according to claim 3, wherein said period of time is set such that said period is equal to or longer than a time period for which abnormal discharge is expected to be maintained and such that said plasma does not disappear.

5. An apparatus according to claim 3, wherein said control mechanism cuts off supply of said RF power for said period of time, when said examination mechanism determines presence of abnormal discharge.

6. An apparatus according to claim 3, further comprising a mechanism for setting power values of said RF power not to be controlled by said control mechanism by a time when impedance of said RF power is matched with impedance of said plasma by said matching mechanism at first.

7. An apparatus according to claim 1, further comprising a mechanism for monitoring the number of occurrences of abnormal discharge, which are determined by said examination mechanism.

8. A plasma processing apparatus comprising:

an airtight process chamber;

a support mechanism for supporting a target substrate in said process chamber;

an exhaust for exhausting said process chamber and setting said process chamber in a vacuum state;

a supply for supplying a process gas into said process chamber;

a first electrode for forming an electric field in said process chamber, thereby to turn said process gas into plasma;

an RF power supply for supplying an RF power to said first electrode;

a mechanism for radiating a microwave into said plasma;

an extraction mechanism for extracting a reflection wave of said microwave reflected by said plasma or extracting a passing wave of said microwave passing through said plasma;

a wave detection mechanism for subjecting said reflection wave or said passing wave to envelope wave detection to generate a wave detection signal; and

an examination mechanism for determining presence or absence of an occurrence of abnormal discharge, from changes in amplitude or phase of said wave detection signal.

9. An apparatus according to claim 8, wherein said examination mechanism comprises a comparator for comparing said wave detection signal with a reference voltage.

10. An apparatus according to claim 8, further comprising a control mechanism for lowering a power value of said RF power for a period of time, when said examination mechanism determines presence of abnormal discharge.

11. An apparatus according to claim 10, wherein said period of time is set such that said period is equal to or longer than a time period for which abnormal discharge is expected to be maintained and such that said plasma does not disappear.

12. An apparatus according to claim 10, wherein said control mechanism cuts off supply of said RF power for said period of time, when said examination mechanism determines presence of abnormal discharge.

13. A plasma processing method comprising the steps of:

placing a target substrate in an airtight process chamber;

supplying a process gas into said process chamber;

supplying an RF power to a first electrode, thereby to generate an electric field in said process chamber and turn said process gas into plasma;

matching impedance of said RF power with impedance of said plasma;

subjecting said target substrate placed in said process chamber to a process, using said plasma;

extracting a reflection wave of said RF power reflected by said first electrode;

subjecting said reflection wave to envelope wave detection thereby to generate a wave detection signal; and

examining and determining presence or absence of an occurrence of abnormal discharge, from changes in amplitude of said wave detection signal.

14. A method according to claim 13, wherein said wave detection signal is compared with a reference voltage in said step of examining, thereby to determine presence or absence of an occurrence of abnormal discharge.

15. A method according to claim 13, further comprising a step of controlling and lowering a power value of said RF power for a period of time, when presence of an occurrence of abnormal discharge is determined in said step of examining.

16. A method according to claim 15, wherein said period of time is set such that said period is equal to or longer than a time period for which abnormal discharge is expected to be maintained and such that said plasma does not disappear.

17. A method according to claim 15, wherein supply of said RF power is cut off for said period of time in said step of controlling, when an occurrence of abnormal discharge is determined in said step of examining.

18. A method according to claim 15, wherein power values of said RF power are not controlled in said step of matching, regardless of presence or absence of an occurrence of abnormal discharge, by a time when impedance of said RF power is matched with impedance of said plasma by said matching mechanism at first.

19. A method according to claim 16, further comprising a step of monitoring the number of occurrences of abnormal discharge, which are determined in said step of examining.

20. A method according to claim 19, further comprising a step of selecting whether or not a treatment step of recovering a damage caused by abnormal discharge is performed on said target substrate, on the basis of the number of occurrences of abnormal discharge, which is obtained in said step of monitoring.

21. A plasma processing method comprising the steps of:

placing a target substrate in an airtight process chamber;

supplying a process gas into said process chamber;

supplying an RF power to a first electrode thereby to generate an electric field in said process chamber and turn said process gas into plasma;

subjecting said target substrate placed in said process chamber to a process, using said plasma;

radiating a microwave into said plasma;

extracting a reflection wave of said RF power reflected by said first electrode or extracting a passing wave of said microwave passing through said plasma;

subjecting said reflection wave or said passing wave to envelope wave detection thereby to generate a wave detection signal; and

examining and determining presence or absence of an occurrence of abnormal discharge, from changes in amplitude or phase of said wave detection signal.

22. A method according to claim 21, wherein said wave detection signal is compared with a reference voltage in said step of examining, thereby to determine presence or absence of an occurrence of abnormal discharge.

23. A method according to claim 21, further comprising a step of controlling and lowering a power value of said RF power for a period of time, when presence of an occurrence of abnormal discharge is determined in said step of examining.

24. A method according to claim 23, wherein said period of time is set such that said period is equal to or longer than a time period for which abnormal discharge is expected to be maintained and such that said plasma does not disappear.

25. A method according to claim 23, wherein supply of said RF power is cut off for said period of time in said step controlling, when an occurrence of abnormal discharge is determined in said step of examining.