Electromagnetic interference shield for electronic devices
First Claim
1. A method for forming an EMI shield from polymeric material comprising the steps ofthermoforming sheets of thermoformable polymeric material into desired shapes,said thermoforming process comprising the steps of heating a thin sheet of thermoplastic polymer, drawing said heated sheet into an open mold or onto a die, cooling said formed sheet, removing the formed sheet from the mold or die,applying electrically conductive metallic material to selected surfaces of the thermoformed polymeric shapes by vacuum deposition means.
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Accused Products
Abstract
An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.
90 Citations
23 Claims
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1. A method for forming an EMI shield from polymeric material comprising the steps of
thermoforming sheets of thermoformable polymeric material into desired shapes, said thermoforming process comprising the steps of heating a thin sheet of thermoplastic polymer, drawing said heated sheet into an open mold or onto a die, cooling said formed sheet, removing the formed sheet from the mold or die, applying electrically conductive metallic material to selected surfaces of the thermoformed polymeric shapes by vacuum deposition means.
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12. A method for forming an EMI shield from thin-walled thermoformable polymeric sheet comprising the steps of
thermoforming said sheet by heating the polymeric sheet, drawing the sheet into an open mold to form a shape, cooling the shape, removing the shape from the open mold, applying electrically conductive metallic material to selected surfaces of the thermoformed shape by vacuum deposition means.
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20. A method for forming an EMI shield from polymeric material of thickness of less than 0.065 inches, comprising the steps of
forming the polymeric material into a desired shape, applying a continuous, electrically-conductive metallic coating to selected surfaces of the polymeric shape by placing the shape within an evacuable chamber, evacuating the chamber, exposing said shape to a plasma, vaporizing metal on a heated anode within the chamber.
Specification