Image sensor package having a wall with a sealed cover

• US 5,811,799 A
• Filed: 07/31/1997
• Issued: 09/22/1998
• Est. Priority Date: 07/31/1997
• Status: Expired due to Term

• Current Assignee: Harvatek Corporation
• Original Assignee: Liang-Chung Wu
• Inventors: Wu, Liang-Chung
• Primary Examiner(s): LE, QUE TAN
• Application Number:
  US08/904,033
• Time in Patent Office: 418 Days
• Field of Search: 250/239, 250/214.1, 250/208.1, 257/80-84, 257/432, 257/433
• US Class Current: 250/239
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

An image sensor chip is mounted on a printed wiring frame over a substrate, which is plated with a spider web of plated conductors connecting the IC through via holes to the bottom of the substrate as output terminals. After wiring bonding the IC to the plated conductor, the package is sealed. A wall is erected around the image sensor chip and is covered with a transparent glass. A lens may be placed in the middle of the cover for focusing. The structure is amenable to mass production. A large number of printed wiring frames are arranged as a matrix on a common substrate. The frames are sealed column by column or sealed all at once. After sealing, the common substrate are diced into individual packages. The image sensor package may mounted with integrated circuit chips as peripheral circuits. The image sensor chips may be sealed with transparent glue and the integrated circuit chip may be sealed with opaque glue.

Claims

1. An image sensor package, comprising:

an image sensor chip with multiple output terminals;

a printed wiring frame having at least one conductor thereon,

said conductor having one end coupled to one of said output terminals, and said conductor having a second end extending to the bottom of said printed wiring frame;

a wall erected around said image sensor chip with a height taller than the height of the image sensor chip; and

a transparent cover sealed over the top of said wall.

2. An image sensor package as described in claim 1, wherein said transparent cover is made of glass.

3. An image sensor package as described in claim 1, wherein said transparent cover is made of plastic.

4. An image sensor package as described in claim 1, wherein said transparent cover has a lens in the middle of the transparent cover for focusing an image on said image sensor chip.

5. An image sensor package as described in claim 1, wherein said image sensor chip is connected with at least one more integrated circuit chip within said package.

6. An image sensor package as described in claim 5, wherein said integrated circuit chip is covered with opaque seal.

7. An image sensor package as described in claim 6, wherein said wall and said seal are integrated as one component.

8. An image sensor package as described in claim 6, wherein said opaque seal is made of the same material as said wall.

9. An image sensor package as described in claim 5, wherein said integrated circuit chip is surrounded with a wall similar to that surrounding said image sensor chip.

10. An image sensor package as described in claim 5, wherein said image sensor chip and said integrated circuit chip are surrounded by a common wall.

11. An image sensor package as described in claim 1, wherein said image sensor is a charge coupled device.

12. An image sensor package as described in claim 1, wherein said image sensor is a complementary MOS sensor.

13. A method of mass producing a multiplicity of image sensor packages on a common substrate, each having:

an image sensor chip with multiple output terminals,

a printed wiring frame having at least one conductor thereon,

said conductor having a first end coupled to one of said output terminals, and a second extending to the bottom of said printed wiring frame;

a wall erected around said image sensor chip with a height taller than the height of said image sensor chip, and

a transparent cover sealed over said wall, comprising the steps of;

printing a large number of said printed wiring frame on said common substrate as a matrix,

applying glue around each said image sensor chip to erect said wall,

sealing said wall with a common said transparent cover, and

dicing said common substrate into said number of said image sensor packages.

14. A method of mass producing a multiplicity of image sensor packages as described in claim 13, wherein said image sensor chip is connected to at least one more integrated chip mounted in the same package.

15. A method of mass producing a multiplicity of image sensor packages as described in claim 14, wherein said integrated circuit chip is covered with opaque seal.

16. A method of mass producing a multiplicity of image sensor packages as described in claim 15, wherein said opaque seal is made of the same material as said wall.