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Semiconductor device structure

  • US 5,811,877 A
  • Filed: 03/31/1997
  • Issued: 09/22/1998
  • Est. Priority Date: 08/30/1994
  • Status: Expired due to Fees
First Claim
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1. In a resin molded lead frame semiconductor device including a resin molded structure having a metal lead frame and an LSI chip, the improvement comprising said metal lead frame and an electrode on said LSI chip being metallurgically directly connected with each other, an overall thickness of said lead frame is thin, a part of said lead frame is structured as a reinforcing member for preventing a warp of said LSI chip, an outer periphery of said structure is resin molded, and a resin portion which covers a mirror surface side on which a circuit of said LSI chip is not formed is a grinded surface so that an overall thickness of said semiconductor device is reduced.

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