High-power vertical cavity surface emitting laser cluster
First Claim
1. A laser cluster for high-power applications, comprising:
- an array of VCSELs including a center VCSEL and one or more peripheral VCSELs displaced from the center VCSEL; and
a pair of common electrical contacts shared by said array of VCSELs;
wherein the VCSELs in said array are separated by a distance in a range from about 10 mm to about 40 mm.
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Accused Products
Abstract
A laser cluster for high-power applications includes an array of VCSELs. The array of VCSELs includes a center VCSEL and one or more peripheral VCSELs displaced from the center VCSEL in a hexagonal closest-packing arrangement sharing a pair of common electrical contacts. Each VCSEL in the array is flip-chip mounted on a heat sink to present the backside of the VCSEL. A multimode optical fiber is coupled to receive laser light from the array of VCSELs. The array of VCSELs is operable to generate a laser burst at a wavelength in a range from 950 nm to 1050 nm. In a process for fabricating a VCSEL that can be clustered for high-power applications, a bottom n-doped mirror stack is deposited above an n-doped gallium arsenide substrate. An active region including indium gallium arsenide is deposited above the bottom mirror stack. A top p-doped mirror stack is deposited above the active region. Electrical contacts are applied to the top mirror stack and to the substrate. The laser cluster is packaged and sealed.
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Citations
13 Claims
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1. A laser cluster for high-power applications, comprising:
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an array of VCSELs including a center VCSEL and one or more peripheral VCSELs displaced from the center VCSEL; and a pair of common electrical contacts shared by said array of VCSELs; wherein the VCSELs in said array are separated by a distance in a range from about 10 mm to about 40 mm. - View Dependent Claims (3, 4)
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2. A laser cluster for high-power applications, comprising:
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an array of VCSELs including a center VCSEL and one or more peripheral VCSELs displaced from the center VCSEL; and a pair of common electrical contacts shared by said array of VCSELs; wherein each VCSEL in said array presents an emitting facet having a diameter in a range from about 5 mm to about 30 mm.
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5. A process of fabricating a laser cluster for high-power applications, comprising the following steps:
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(A) providing an array of VCSELs in a hexagonal closest-packing arrangement; (B) connecting the array of VCSELs to a pair of common electrical contacts; and (C) coupling the array of VCSELs into a multimode optical fiber; wherein each VCSEL in the array presents an emitting facet having a diameter in a range from about 5 mm to about 30 mm, and the VCSELs in the array are separated by a distance in a range from about 10 mm to about 40 mm. - View Dependent Claims (6, 7)
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8. A package for a laser cluster, comprising:
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a housing; a submount in said housing; a laser cluster including an array of VCSELs mounted junction-side down on said submount so that said laser cluster presents a backside emitting surface; and a multimode optical fiber including a core, said multimode optical fiber passing through said housing and coupled onto said backside emitting surface; said laser cluster includes seven VCSELs positioned within a circular area, said circular area having a diameter which is substantially equal to the diameter of said core. - View Dependent Claims (9, 10, 11)
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12. A process of fabricating a laser cluster for high-power applications, comprising the following steps:
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(A) providing an array of VCSELs; (B) connecting the array of VCSELs to a pair of common electrical contacts; and (C) coupling the array of VCSELs into a multimode optical fiber; wherein each VCSEL in the array presents an emitting facet having a diameter in a range from about 5 mm to about 30 mm.
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13. A process of fabricating a laser cluster for high-power applications, comprising the following steps:
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(A) providing an array of VCSELs; (B) connecting the array of VCSELs to a pair of common electrical contacts; and (C) coupling the array of VCSELs into a multimode optical fiber; wherein the VCSELs in the array are separated by a distance in a range from about 10 mm to about 40 mm.
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Specification