Method of characterizing dynamics of a workpiece handling system
First Claim
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1. A method of fabricating a component comprising the steps of:
- providing a substrate;
processing the substrate by probing the substrate;
determining a presence of a vibration near the substrate during the step of processing the substrate; and
re-processing the substrate when the vibration exceeds a threshold value.
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Abstract
A method of characterizing dynamics of a workpiece handling system includes providing a workpiece or substrate (14), supporting the substrate (14) with a workpiece handler (13), providing a motion for the workpiece handler (13), transforming the motion into a signal, converting the electrical signal into a measurement of distance, and using the measurement of distance to determine a vibration in the motion.
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Citations
8 Claims
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1. A method of fabricating a component comprising the steps of:
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providing a substrate; processing the substrate by probing the substrate; determining a presence of a vibration near the substrate during the step of processing the substrate; and re-processing the substrate when the vibration exceeds a threshold value. - View Dependent Claims (2, 3)
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4. A method of manufacturing a semiconductor device comprising:
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providing a semiconductor substrate; providing a substrate handler having a wafer chuck; disposing the semiconductor substrate over the substrate handler; monitoring a vibration in the substrate handler comprising; sensing a vibration in the substrate handler; transforming the vibration into a voltage; and converting the voltage into a measurement of the vibration; processing the semiconductor substrate by electrically testing at least a portion of the semiconductor substrate; and removing the semiconductor substrate from the substrate handler. - View Dependent Claims (5, 6, 7, 8)
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Specification