System for monitoring surface stress and other conditions in structures
First Claim
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1. A system for monitoring a structure, comprising:
- a printed circuit board mounted at the surface of the structure;
a piece of single crystal silicon mounted on said printed circuit board, said piece of single crystal silicon being in contact with the structure;
an infrared source for directly illuminating said piece of single crystal silicon with radiation having a wavelength in the range of 800-1100 nanometers;
an infrared detector focused on said piece of single crystal silicon for monitoring isochromatic fringe patterns projected from said piece of single crystal silicon as a result of illuminating said piece of single crystal silicon with said radiation, wherein said isochromatic fringe patterns are a direct indication of an amount of stress at the surface of the structure;
at least one sensor coupled to said printed circuit board, each said at least one sensor being capable of collecting data indicative of a physical condition experienced by the structure; and
monitoring means in communication with each said at least one sensor for receiving said data.
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Abstract
A system for monitoring a structure is built on a printed circuit board (PCB) mounted at the surface of the structure. A piece of single crystal silicon is mounted on the PCB and is in contact with the structure. An infrared source directly illuminates the silicon while an infrared detector is focused thereon to monitor isochromatic fringe patterns projected from the silicon as a direct indication of stress at the surface. One or more other sensors are coupled to the PCB for collecting data indicative of other physical conditions experienced by the structure. A wireless system communicates with each such sensor so that the data so collected can be received at a remote location.
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Citations
18 Claims
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1. A system for monitoring a structure, comprising:
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a printed circuit board mounted at the surface of the structure; a piece of single crystal silicon mounted on said printed circuit board, said piece of single crystal silicon being in contact with the structure; an infrared source for directly illuminating said piece of single crystal silicon with radiation having a wavelength in the range of 800-1100 nanometers; an infrared detector focused on said piece of single crystal silicon for monitoring isochromatic fringe patterns projected from said piece of single crystal silicon as a result of illuminating said piece of single crystal silicon with said radiation, wherein said isochromatic fringe patterns are a direct indication of an amount of stress at the surface of the structure; at least one sensor coupled to said printed circuit board, each said at least one sensor being capable of collecting data indicative of a physical condition experienced by the structure; and monitoring means in communication with each said at least one sensor for receiving said data. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A system for monitoring a structure exposed to a fluid flow, comprising:
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a printed circuit board embedded in the structure; a mirror-backed single crystal silicon semiconductor wafer mounted on said printed circuit board such that said wafer is in contact with the structure and flush with the surface of the structure; an infrared source for directly illuminating said wafer through the fluid flow with radiation having a wavelength in the range of 800-1100 nanometers; an infrared detector focused through the fluid flow on said wafer for monitoring isochromatic fringe patterns projected from said wafer as a result of illuminating said wafer with said radiation, wherein said isochromatic fringe patterns are a direct indication of an amount of stress at the surface of the structure; at least one sensor coupled to said printed circuit board, each said at least one sensor being capable of collecting data indicative of a physical condition experienced by the structure; and monitoring means in communication with each said at least one sensor for receiving said data. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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Specification