Semiconductor component

• US 5,814,870 A
• Filed: 01/06/1997
• Issued: 09/29/1998
• Est. Priority Date: 01/05/1996
• Status: Expired due to Term

• Current Assignee: Infineon Technologies AG
• Original Assignee: Siemens AG
• Inventors: Spaeth, Werner
• Primary Examiner(s): OSTROWSKI, DAVID M
• Application Number:
  US08/779,366
• Time in Patent Office: 631 Days
• Field of Search: 257/433, 257/434, 257/666, 257/778
• US Class Current: 257/433
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A semiconductor component has at least one semiconductor chip mounted on a carrier part of its housing. The semiconductor chip is electrically connected to at least two electrode connectors which are provided with contacts. The component housing has an upper housing portion and at least one housing side part which surround the semiconductor chip at least partially. The carrier part on which the semiconductor chip is mounted forms the upper housing portion of the component housing and the at least two electrode connectors at least partially form the housing side parts of the component housing.

Claims

1. A semiconductor component, comprising:

a component housing, said housing being formed by a carrier part having a first surface and defining an upper housing portion and by at least two housing side parts, said housing side parts being micromechanical supports at least partly formed by two electrode connectors;

a semiconductor chip of a given height disposed in said housing and mounted on said first surface of said carrier part, said semiconductor chip being at least partly surrounded by said carrier part and said electrode connectors, said semiconductor chip being mounted on said carrier part and being electrically connected with said electrode connectors; and

contacts disposed on said micromechanical supports on ends thereof distally of said carrier part; and

wherein said micromechanical supports have a height which slightly exceeds the given height of said semiconductor chip, and said micromechanical supports are affixed laterally of said semiconductor chip on said first surface.

2. The semiconductor component according to claim 1, wherein said at least two micromechanical supports are formed of an electrically conductive material.

3. The semiconductor component according to claim 1, including a connection made of electrically conductive material electrically connecting said housing side parts with said semiconductor chip.

4. The semiconductor component according to claim 3, wherein said carrier part has a first surface on which said semiconductor chip is mounted, and wherein said connection is a printed conductor layer formed on said first surface.

5. The semiconductor component according to claim 1, wherein said carrier part is formed of a material having a given coefficient of thermal expansion, and said housing side parts are made of a material having a coefficient of thermal expansion substantially equal to the given coefficient of thermal expansion.

6. The semiconductor component according to claim 1, wherein said housing side parts are made of a semiconductor material.

7. The semiconductor component according to claim 1, wherein said semiconductor chip includes an optoelectronic circuit on a surface thereof facing said carrier part, and said carrier part is optically transparent at least in a vicinity of said semiconductor chip.

8. The semiconductor component according to claim 7, wherein said carrier part has a first surface on which said semiconductor chip is mounted and a second surface opposite said first surface, and including an optical imaging device on said second surface of said carrier part.

9. The semiconductor component according to claim 1, wherein said semiconductor chip includes an optoelectronic circuit on a surface thereof facing said carrier part, and said carrier part is optically translucent at least in a vicinity of said semiconductor chip.

10. The semiconductor component according to claim 9, wherein said carrier part has a first surface on which said semiconductor chip is mounted and a second surface opposite said first surface, and including an optical imaging device on said second surface of said carrier part.

11. The semiconductor component according to claim 1, wherein said carrier part is an electrically insulating plate formed of one of glass and plastic.