Semiconductor component
First Claim
Patent Images
1. A semiconductor component, comprising:
- a component housing, said housing being formed by a carrier part having a first surface and defining an upper housing portion and by at least two housing side parts, said housing side parts being micromechanical supports at least partly formed by two electrode connectors;
a semiconductor chip of a given height disposed in said housing and mounted on said first surface of said carrier part, said semiconductor chip being at least partly surrounded by said carrier part and said electrode connectors, said semiconductor chip being mounted on said carrier part and being electrically connected with said electrode connectors; and
contacts disposed on said micromechanical supports on ends thereof distally of said carrier part; and
wherein said micromechanical supports have a height which slightly exceeds the given height of said semiconductor chip, and said micromechanical supports are affixed laterally of said semiconductor chip on said first surface.
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Abstract
A semiconductor component has at least one semiconductor chip mounted on a carrier part of its housing. The semiconductor chip is electrically connected to at least two electrode connectors which are provided with contacts. The component housing has an upper housing portion and at least one housing side part which surround the semiconductor chip at least partially. The carrier part on which the semiconductor chip is mounted forms the upper housing portion of the component housing and the at least two electrode connectors at least partially form the housing side parts of the component housing.
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Citations
11 Claims
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1. A semiconductor component, comprising:
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a component housing, said housing being formed by a carrier part having a first surface and defining an upper housing portion and by at least two housing side parts, said housing side parts being micromechanical supports at least partly formed by two electrode connectors; a semiconductor chip of a given height disposed in said housing and mounted on said first surface of said carrier part, said semiconductor chip being at least partly surrounded by said carrier part and said electrode connectors, said semiconductor chip being mounted on said carrier part and being electrically connected with said electrode connectors; and contacts disposed on said micromechanical supports on ends thereof distally of said carrier part; and wherein said micromechanical supports have a height which slightly exceeds the given height of said semiconductor chip, and said micromechanical supports are affixed laterally of said semiconductor chip on said first surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification